TRI — Investor Presentation 2021

May 20, 2021

==> picture [721 x 61] intentionally omitted <==

==> picture [721 x 62] intentionally omitted <==

==> picture [721 x 61] intentionally omitted <==

Test Research, Inc. www.tri.com.tw

==> picture [721 x 62] intentionally omitted <==

==> picture [721 x 61] intentionally omitted <==

==> picture [721 x 61] intentionally omitted <==

==> picture [721 x 59] intentionally omitted <==

Test Research, Inc.

• Establishment: April, 1989

• Founder & CEO: Jason Chen

• • Capital: TWD 2362 million

( USD 78 million)

==> picture [392 x 322] intentionally omitted <==

==> picture [296 x 419] intentionally omitted <==

Main Product Line

 IT(Image Tester)  SPI(Solder Paste Inspection)  Pre-reflow AOI / Post-reflow AOI  AXI(Automatic X-ray Inspection)  BT(In-Circuit Board Tester)  MDA  ICT

==> picture [721 x 61] intentionally omitted <==

==> picture [721 x 59] intentionally omitted <==

One Stop Solution Provider in PCBA Production

==> picture [719 x 438] intentionally omitted <==

==> picture [721 x 541] intentionally omitted <==

----- Start of picture text -----

Integration of Vision Technologies for the Demands ：
- Dimensional Metrology for Electronic Parts
- Semiconductor Manufacturing/Packaging Process
Calibration
校正技術
Laser Fringe DFF
TRI AOI
Metrology
Linear
共線性
Linearity
----- End of picture text -----

Global Service Network

More than 3000 customers have been serviced through worldwide partners More than 50 distributors and Rep. worldwide.

==> picture [672 x 355] intentionally omitted <==

Electronic Industry/Revenue Movement

==> picture [721 x 481] intentionally omitted <==

----- Start of picture text -----

4
8 Industrial/Defense
13
Automobile
24
12
Household/Game
12
25
Phone/Peripheral
13
6
Network
20
25
NB/Tablet/Peripheral
15
Semiconductor/IC
10 12
202001-202004 202101-202104
----- End of picture text -----

==> picture [721 x 61] intentionally omitted <==

Major Competitors

Korea: Koh Young Japan: Omron  China: Jutze/Sinic-Tek/Holly Malaysia: Vitrox USA: Keysight/Teradyne Europe: Viscom/SPEA

==> picture [721 x 59] intentionally omitted <==

==> picture [721 x 541] intentionally omitted <==

----- Start of picture text -----

10000 Annual Sales
NTD Million
-
9000 Uncertainty of global economy
-Delay of 3D AOI launch
-Low price competition in China
8000
-
Economic
Increase of smart
Decline of PC/NB
mobile devices
recovery
7000 application application -
Blue-ocean
Rush capacity 5870
6000 buy triggered by
economic recovery 5388
4919 4951
5000 4754
4387
New FCT
New AOI 7500
4084
+7500/L/D
is not launched 37783894
4000 T
until ’06. 3601
New 7500
Economic
+7006L 3100
New SPI recession
3000 7006
2541
+7100EP
2055 2074
2000 New AOI 1706
7100 15531470
1000 569 [777] [902]
0
'01 '02 '03 '04 '05 '06 '07 '08 '09 '10 '11 '12 '13 '14 '15 '16 '17 '18 '19 '20
----- End of picture text -----

==> picture [721 x 541] intentionally omitted <==

----- Start of picture text -----

EPS
7
6.43
6
5.34
4.87
5 4.67 [5.03]
4.48
4.51 4.63
4.23
4.45
4 3.97
3.41
3.19
3
2.53
2.17 2.52
2
1.82
1 1.02
0
'03 '04 '05 '06 '07 '08 '09 '10 '11 '12 '13 '14 '15 '16 '17 '18 '19 '20
----- End of picture text -----

CONFIDENTIAL

Red & Blue-ocean Market Movement in Revenue NTD Million

0 1,000 2,000 3,000 4,000 5,000 6,000 7,000 8,000	914 (16%) 1,631 (34%) 1,583 (51%) 2,009 (56%) 3,063 (62%) 2,934 (67%) 3,262 (66%) 1,356 (71%) 4,955 3,123 1,517 1,592 1,856 1,453 1,689 555 46% 53% 55% 53% 53% 57% 55% 55% 30% 40% 50% 60% 70% 80% 2014 2015 2016 2017 2018 2019 2020 2021.4 Blue-ocean Red-ocean Gross margin % Blue-ocean: - 3D AOI - Dimensional metrology for electronic parts - Semiconductor process - AXI - BT (Q1)

==> picture [721 x 541] intentionally omitted <==

----- Start of picture text -----

TRI Integrated Total Solution
Metrology
Multi-Sensing
AOM
2D/3D
AOI & AVI
Industry 4.0
Hermes/CFX
TRI
SECS/GEM AI
AOI
12
----- End of picture text -----

Upgrade DFF 3D Technology

0.5  Optimal focus position µm  Clearer 2D Images  1 µm Sharper images  Shadow-free 3D Image Ultra High Resolution Semiconductor SMT -Wire bond –Solder joint

Semiconductor -Wire bond

==> picture [721 x 61] intentionally omitted <==

13

TRI New TRI Measurement Functions (AOM)

 UI: New designed and friendly user interface

==> picture [121 x 115] intentionally omitted <==

==> picture [173 x 115] intentionally omitted <==

==> picture [721 x 242] intentionally omitted <==

----- Start of picture text -----

Measure
 Features: More complete Feature
measurement functions will be Construction
available Method
Measure
Target
Assign
System
 High Flexibility: Multi-Layer
measurements
----- End of picture text -----

14

TRI 3D AOI Product Roadmap

==> picture [721 x 420] intentionally omitted <==

----- Start of picture text -----

SMT Components
0201 >> 15 um
01005 >> 10 um
Mini LED Application
2D TR7700 SIII Plus @ 5.5 um
3D TR7700QE-S @ 5.5 / 3.45 um
SiP/Underfill + Laser @ 10/20 um
Wafer
(TR7700QE-S +IR)
@ 3.45 um
7960A (DFF)
Die Bond
+ Laser @ 10/20 um
Inspection
Wire Bond
+ DFF @ 1.0 / 0.5 um
Full Inspection Sampling
----- End of picture text -----

==> picture [721 x 541] intentionally omitted <==

----- Start of picture text -----

TRI 3D AOI Product Roadmap
TR7500QE SII
-12M/15um
TR7700Q(L) SII (DL)
+ 4 Sideview
-12M/15um
-12M/12um
TR7500QE SII
-12M/10um
-12M/10um+4 Sideview
-12M/5.5um
TR7700(L) QE -12M/15,10um
TR7700 QM SII -12M/5.5um
TR7500(L) QE -12M/15,10um+4 Sideview
TR7700 QE-S -12M/5.5um,3.45um •
AOM & AI SW module
• 4x DLP + Omni color RGBW lighting •
Optional Laser module
•
Optional Laser module •
Optional DFF module
•
Optional DFF module
2019 2020 2021 2022
16 Confidential
Speed
----- End of picture text -----

==> picture [64 x 69] intentionally omitted <==

----- Start of picture text -----

NEW
----- End of picture text -----

TR7700Q SII 3D AOI Highlight

==> picture [116 x 372] intentionally omitted <==

Industry-Leading Inspection Speed up to 57 cm[2] /sec

Ease of Programming with TRI’s Smart Library Multiple 3D Technologies: Zero-escapes Inspection

==> picture [259 x 390] intentionally omitted <==

17

Confidential

TR7700QE-S 3D AOI Highlight

==> picture [268 x 384] intentionally omitted <==

==> picture [85 x 88] intentionally omitted <==

Supports 3.45 / 5.5um Ultra High Resolution

Inspection Solutions for Semiconductor Packaging Level:

==> picture [379 x 41] intentionally omitted <==

----- Start of picture text -----

SMD
----- End of picture text -----

==> picture [379 x 42] intentionally omitted <==

----- Start of picture text -----

Underfill
----- End of picture text -----

18

Confidential

==> picture [721 x 527] intentionally omitted <==

----- Start of picture text -----

TRI’s SPI Innovations
Fast Inspection Precision Smart
Speed Inspection Factory
5.5
μm
Large FOV High Resolution Closed Loop
CoaXpress Technology Shadow Free IPC-CFX
Dynamic Imaging Smart Warpage Technology Smart Library
Stop & Go Imaging High Inspection Range YMS 4.0
----- End of picture text -----

Confidential

A Full Line of 3D In-Line AXI

==> picture [195 x 214] intentionally omitted <==

==> picture [205 x 220] intentionally omitted <==

----- Start of picture text -----

TR7600F3D SII
----- End of picture text -----

TR7600 SIII

TR7600TL SIII TR7600F3D SII High performance and high Faster inspection speed 3D AXI for the speed, ultra high largest server, networking resolution 3D CT X-ray and power PCBs. TRI's inspection, highest Planar CT technology image quality brings true 3D solder joint maximize production review for maximum yields on any inspection accuracy. production line.

A new generation of TRI’s hallmark inline PCBA inspection solutions. Designed for 100% inspection coverage at production line speed, industry’s fastest high resolution imaging speed with greatly improved image quality in the industry's most advanced automatic X-ray inspection.

Faster inspection speed, ultra high resolution 3D CT X-ray inspection, highest image quality maximize production yields on any production line.

==> picture [721 x 59] intentionally omitted <==

BT Parallel Test for Different DUTs (Multi-Program)

==> picture [721 x 460] intentionally omitted <==

----- Start of picture text -----

TR5001 SII Quad-code System
Testing Time Comparision
10
101.1%
100.2%
100%
9
TR5001 SII Single-Core TR5001 SII Dual-Core TR5001 SII Quad-Core
(100.0%) (100.2%) (101.1%)
----- End of picture text -----

High Density Pin Count ICT TR8100H SII / TR8100HL SII

==> picture [379 x 162] intentionally omitted <==

----- Start of picture text -----

NEW
----- End of picture text -----

Original Test Points. New SII Model Model TR8100LV 3584 pins 7056 pins ~~SII~~ TR8100LLV 5632 pins 11088 pins

==> picture [721 x 61] intentionally omitted <==

22

Confidential

==> picture [721 x 527] intentionally omitted <==

----- Start of picture text -----

The Benefits of AI
Combines traditional Integrates different TRI
Reduces the labor cost
Image process data models to enhance the
of the production line
and AI technology production process
----- End of picture text -----

Confidential

TRI's AI Application Can be divided in Two Phases

AI Defect Detection / Character Recognition / Visual Inspection / Measurement assistance Inspection PhasePhase Advantage: Improve Inspection Quality and Reduce False Calls RS Repair Station Defect Classification and Re-Inspection Phase Advantage: Reduce the workload of manual Re-Inspection AOI SPI AXI TRI Inspection Solutions TRI AI Station Repair Station(s)

==> picture [65 x 63] intentionally omitted <==

==> picture [64 x 64] intentionally omitted <==

==> picture [65 x 63] intentionally omitted <==

==> picture [66 x 64] intentionally omitted <==

==> picture [65 x 63] intentionally omitted <==

==> picture [65 x 63] intentionally omitted <==

==> picture [66 x 64] intentionally omitted <==

==> picture [65 x 64] intentionally omitted <==

==> picture [397 x 153] intentionally omitted <==

TRI’s AI Development Roadmap

==> picture [721 x 62] intentionally omitted <==

AI Road Map:

==> picture [627 x 89] intentionally omitted <==

----- Start of picture text -----

Short Term Mid-Term Long Term
----- End of picture text -----

 Fast development  Technical cultivation  Unmanned AOI  Commercial Library  Open-source Solution  Zero escape and false call  Cooperation  Inference/Training Server  TRI Standard Spec  Faster and more accurate

AI applications:

==> picture [415 x 152] intentionally omitted <==

----- Start of picture text -----

♦ RS Second ♦ Cosmetic ♦ Anomaly
stage review Inspection inspection
♦ AI Foreign ♦ IC Lift lead ♦ Auto
material inspection programming
inspection
♦ AI Alignment ♦ Agile training
♦ AI OCR (at customer
♦ Wire Bond
site)
Inspection
2019 2020 2021~
----- End of picture text -----

YMS 4.0 Yield Management System

==> picture [269 x 183] intentionally omitted <==

==> picture [268 x 183] intentionally omitted <==

• •Improvement Monitoring

• •Real-Time Inspection Status

• •Support Quality Improvement

• •SPC and Productivity Monitoring

• •Output Reports to MES/SFCS

• •Top 5 or 10 defects & Images

• •PDCA improvement cycle

• •Issue Drill Down line, station or process

Industry 4.0 Solution

==> picture [61 x 45] intentionally omitted <==

Confidential

TRI Support Closed Loop Solutions TRI SPI, AOI, AXI Inspection Integration CFX(data)/HERMES(M2M)

==> picture [721 x 360] intentionally omitted <==

----- Start of picture text -----

Data & I Ski b d
mage p oar
Feedback Feedforward
Feedback data
Pre-reflow Post-reflow
SPI AXI
AOI AOI
TR7007QI TR7600 SIII
TR7710 TR7700QE
----- End of picture text -----

Smart Factory Solutions

==> picture [722 x 190] intentionally omitted <==

----- Start of picture text -----

Big Data Ready
----- End of picture text -----

==> picture [5 x 4] intentionally omitted <==

Smart Monitoring

==> picture [513 x 128] intentionally omitted <==

In-house RD Team

==> picture [383 x 75] intentionally omitted <==

----- Start of picture text -----

.
•Optical Dept. • system S/W
• Mechanical Dept. YMS, R/S
----- End of picture text -----

==> picture [155 x 75] intentionally omitted <==

----- Start of picture text -----

•PLC control
•Lighting control
----- End of picture text -----

==> picture [195 x 110] intentionally omitted <==

----- Start of picture text -----

IT
BT
----- End of picture text -----

180[+] RD

Outside Support

Department of Computer science, National Taiwan Univ. - Image processing / Understanding Department of Power Mechanical, Tsing Hua Univ., Taiwan - X-ray 3D Reconstruction/Digital Tomosynsis Algorithm/ CT algorithm Center of Measurement Standards, Industrial Technology Research Institute Taiwan

• -- Length/ Camera / Color calibration

Recent Awards

 2016 Global Technology Award  2017 Circuits Assembly NPI Award  2017 EM Asia Innovation Award  2018 Circuits Assembly NPI Award  2018 EM Asia Best Supplier Award  2019 Global Technology Award  2019 EM Asia Outstanding Product Award  2020 Global Technology Award  2021 EM Asia Innovation Award

• TRI’s Company Milestones: - - - https://www.tri.com.tw/tw/about/about 21 1 2.html

Safe Harbor Notice

TRI’s statements of its current expectations are forward looking statements subject to significant risks and uncertainties and actual results may differ materially from those contained in the forward-looking statements. Except as required by law, we undertake no obligation to update any forward-looking statement, whether as a result of new information, future events, or otherwise.

==> picture [721 x 59] intentionally omitted <==

Better Testing Better Quality

==> picture [103 x 94] intentionally omitted <==

THANK YOU! For more information about Test Research, Inc. Please visit: www.tri.com.tw

==> picture [106 x 89] intentionally omitted <==

==> picture [721 x 61] intentionally omitted <==

==> picture [721 x 59] intentionally omitted <==