TRI — Investor Presentation 2021

May 20, 2021

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德律科技股份有限公司 www.tri.com.tw

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報告人 : 陳冠元 / 財務長兼代理發言人

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德律科技股份有限公司

• 成立時間 : 1989年4月10日

• 創立人 : 陳玠源董事⻑

• 資本額 : 新台幣23.62億

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: 主力產品 電路板組裝檢測設備

• 自動光學檢測設備 (IT/Image Tester)

• 錫膏自動光學影像檢測機 (SPI)  自動光學影像檢測機 (AOI)  X-ray 自動檢測機 (AXI)

• 電路板測試機 (BT/In-Circuit Board Tester)

• 組裝電路板測試機 (MDA)  全功能電路板自動測試機 (ICT)

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全球唯一 “ 一條龍 ” 電路板組裝檢測設備廠 德律產品在客戶的電路板組裝產線的應用

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: 整合多項視覺核心新技術因應 - 高精密電子料件量測需求 - 先進半導體製程 / 封裝檢測需求

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Calibration 校正技術 Laser TRI AOI Metrology Linear 共線性 Linearity

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全球銷售服務網

More than 3000 customers have been serviced through worldwide partners More than 50 distributors and Rep. worldwide.

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More than 50 distributors and Rep. worldwide. 主要客戶為全球各
大電子產品組裝廠
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Electronic Industry/Revenue Movement

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4
8 Industrial/Defense
13
Automobile
24
12
Household/Game
12
25
Phone/Peripheral
13
6
Network
20
25
NB/Tablet/Peripheral
15
Semiconductor/IC
10 12
202001-202004 202101-202104
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主要競爭對手

 : 韓國 Koh Young 日本: Omron  中國大陸: Jutze/Sinic-Tek/Holly 馬來西亞: Vitrox 美國: Keysight/Teradyne 德國: Viscom/SPEA

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10000
年營收
台幣百萬
-
9000 Uncertainty of global economy
-Delay of 3D AOI launch
-Low price competition in China
8000
-
Economic
Increase of smart
Decline of PC/NB
mobile devices
recovery
7000 application application -
Blue-ocean
Rush capacity 5870
6000 buy triggered by
economic recovery 5388
4919 4951
5000 4754
4387
New FCT
New AOI 7500
4084
+7500/L/D
is not launched 37783894
4000 T
until ’06. 3601
New 7500
Economic
+7006L 3100
New SPI recession
3000 7006
2541
+7100EP
2055 2074
2000 New AOI 1706
7100 15531470
1000 569 [777] [902]
0
'01 '02 '03 '04 '05 '06 '07 '08 '09 '10 '11 '12 '13 '14 '15 '16 '17 '18 '19 '20
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每股盈餘
7
6.43
6
5.34
4.87
5 4.67 [5.03]
4.48
4.51 4.63
4.23
4.45
4 3.97
3.41
3.19
3
2.53
2.17 2.52
2
1.82
1 1.02
0
'03 '04 '05 '06 '07 '08 '09 '10 '11 '12 '13 '14 '15 '16 '17 '18 '19 '20
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紅海與藍海市場營收變化

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台幣百萬
藍海 紅海 毛利率
8,000 80%
紅海市場 : 藍海市場之產品與應用 :
- -
較低技術門檻 3D AOI
7,000
- -
價格導向 高精密電子料件量測
70%
-
( 紅色供應鏈 ) 先進半導體製程檢測需求
6,000
-
AXI
-
電路板測試機
5,000
60%
57%
55% 55% 55%
4,000 53% 53% 53%
1,689
1,453
(Q1)
1,856
3,123 50%
3,000 46%
1,592
1,517
4,955
2,000
3,262
3,063 2,934 555 40%
(66%)
(62%)
2,009 (67%)
1,000 1,631 1,583
1,356
914 (34%) (51%) (56%)
(71%)
(16%)
0 30%
2014 2015 2016 2017 2018 2019 2020 2021.4
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TRI 整合完整的解決方案
Metrology
Multi-Sensing
AOM
2D/3D
AOI & AVI
Industry 4.0
Hermes/CFX
TRI
SECS/GEM AI
AOI
12
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升級 DFF 3D 科技 Only available for TR7700Q

 Optimal focus position  Clearer 2D Images  Sharper images  Shadow-free 3D Image

0.5 µm 1 µm Ultra High Resolution

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Semiconductor -Wire bond

SMT –Solder joint

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13

全新TRI量測功能(AOM)

 UI: New designed and friendly user interface

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 Features: More complete 量測元素
measurement functions will be
構造方法
available
量測目標
指定座標系
 High Flexibility: Multi-Layer
measurements
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14

TRI 3D AOI Product Roadmap

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SMT Components
0201 >> 15 um
01005 >> 10 um
Mini LED Application
2D TR7700 SIII Plus @ 5.5 um
3D TR7700QE-S @ 5.5 / 3.45 um
SiP/Underfill + Laser @ 10/20 um
Wafer
(TR7700QE-S +IR)
@ 3.45 um
7960A (DFF)
Die Bond
+ Laser @ 10/20 um
Inspection
Wire Bond
+ DFF @ 1.0 / 0.5 um
Full Inspection Sampling
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TRI 3D AOI Product Roadmap
TR7500QE SII
-12M/15um
TR7700Q(L) SII (DL)
+ 4 Sideview
-12M/15um
-12M/12um
TR7500QE SII
-12M/10um
-12M/10um+4 Sideview
-12M/5.5um
TR7700(L) QE -12M/15,10um
TR7700 QM SII -12M/5.5um
TR7500(L) QE -12M/15,10um+4 Sideview
TR7700 QE-S -12M/5.5um,3.45um •
AOM & AI SW module
• 4x DLP + Omni color RGBW lighting •
Optional Laser module
•
Optional Laser module •
Optional DFF module
•
Optional DFF module
2019 2020 2021 2022
16 Confidential
Speed
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NEW
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TR7700Q SII 3D AOI 特點

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Industry-Leading Inspection Speed up to 57 cm[2] /sec

Ease of Programming with TRI’s Smart Library Multiple 3D Technologies: Zero-escapes Inspection

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17

Confidential

TR7700QE-S 3D AOI 特點

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Supports 3.45 / 5.5um Ultra High Resolution Inspection Solutions for Semiconductor Packaging Level:

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SMD
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Underfill
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18

Confidential

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TRI’s SPI 最新應用項目
Fast Inspection Precision Smart
Speed Inspection Factory
5.5
μm
Large FOV High Resolution Closed Loop
CoaXpress Technology Shadow Free IPC-CFX
Dynamic Imaging Smart Warpage Technology Smart Library
Stop & Go Imaging High Inspection Range YMS 4.0
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Confidential

完備的3D在線型 AXI

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TR7600 SIII

TR7600TL SIII

TR7600F3D SII

為TRI新一代具指標性的在線 型PCBA檢測解決方案。 TR7600SIII包含可配合生產線 速度達到100%檢測覆蓋率的 設計，結合了業界最快速的高 解析取像速度，並在業界最先 進的自動X光檢測中大大提升 了影像品質。

針對大型伺服器、網通 大幅提升檢測速度的 應用和大型PCB所設計 高解析度在線型3D 的高性能、高速3D AXI，並可應用CT電 AXI 。 腦斷層掃描科技，專 門用於檢測需要高影 像品質的組裝電路板 和軟板組件。

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- 電路板測試機 多核心配置

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TR5001 SII Quad-code System 單核心與多核心測試時間比較
10
101.1%
100.2%
100%
9
TR5001 SII Single-Core TR5001 SII Dual-Core TR5001 SII Quad-Core
(100.0%) (100.2%) (101.1%)
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高密度測試點數ICT TR8100H SII / TR8100HL SII

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NEW
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Original Test Points. New SII Model Model TR8100LV 3584 pins 7056 pins ~~SII~~ TR8100LLV 5632 pins 11088 pins Confidential 22

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AI 應用優點
Combines traditional Integrates different TRI
Reduces the labor cost
Image process data models to enhance the
of the production line
and AI technology production process
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Confidential

TRI的AI應用

檢測階段AI 複判階段

Defect Detection / Character Recognition / Visual Inspection / Measurement assistance Advantage: Improve Inspection Quality and Reduce False Calls Repair Station Defect Classification and Re-Inspection Advantage: Reduce the workload of manual Re-Inspection

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AOI
SPI
AXI
TRI Inspection Solutions TRI AI Station Repair Station(s)
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TRI AI 發展歷程及 規劃 Roadmap

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AI Road Map:

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Short Term Mid-Term Long Term
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 Fast development  Technical cultivation  Unmanned AOI  Commercial Library  Open-source Solution  Zero escape and false call  Cooperation  Inference/Training Server  TRI Standard Spec  Faster and more accurate

AI applications:

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♦ RS Second ♦ Cosmetic ♦ Anomaly
stage review Inspection inspection
♦ AI Foreign ♦ IC Lift lead ♦ Auto
material inspection programming
inspection
♦ AI Alignment ♦ Agile training
♦ AI OCR (at customer
♦ Wire Bond
site)
Inspection
2019 2020 2021~
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TRI YMS 4.0 良率管理系統 協助客戶提升生產力及品質管理

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• 實時狀態檢查

• 監控生產問題改善狀況

• SPC和生產力監控 • PDCA改善循環

• •

• 列出排名前10的不良項目和對應圖像 支持品質優化

• 依各站別, 線別, 流程找出問題點

• 輸出報告到MES / SFCS

工業4.0解決方案

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Confidential

TRI支援封閉迴路控制系統 TRI SPI, AOI, AXI 檢測資訊的串流 IPC CFX(data)/HERMES(M2M)

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Data & I Ski b d
mage p oar
Feedback Feedforward
Feedback data
Pre-reflow Post-reflow
SPI AXI
AOI AOI
TR7007QI TR7600 SIII
TR7710 TR7700QE
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智慧工廠解決方案

Big Data Ready

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Smart Monitoring

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內部研發團隊

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. •PLC control
•Optical Dept. • system S/W
• Mechanical Dept. YMS, R/S
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•Lighting control
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光學檢測
200 [+] RD
電路板測試
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外部機構技術支援

Department of Computer science, 台灣大學 - 影像處理 / Understanding

Department of Power Mechanical, 清華大學

• X-ray 3D Reconstruction/Digital Tomosynsis Algorithm/ 電腦切層演算法

• Center of Measurement Standards, 工研院 - Length/ Camera / 色彩校正

近年獲獎

 2016 Global Technology Award  2017 Circuits Assembly NPI Award  2017 EM Asia 創新獎  2018 Circuits Assembly NPI Award  2018 EM Asia 最佳供應商獎  2019 Global Technology Award  2019 EM Asia 傑出產品獎  2020 Global Technology Award  2021 EM Asia 創新獎

• TRI’s Company Milestones: - - -

• https://www.tri.com.tw/tw/about/about 21 1 2.html

免責聲明

本簡報資料所提供之資訊，包含所有前瞻性的 看法，德律科技股份有限公司（本公司）將不 會因任何新的資訊、未來事件、或任何狀況的 產生而負有更新或修正本簡報資料內容之責 任。本簡報資料中所提供之資訊並未明示或暗 示的表達或保證其具有正確性、完整性、或可 靠性，亦不代表本公司、產業狀況或後續重大 發展的完整論述。

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Better Testing Better Quality

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THANK YOU! For more information about Test Research, Inc. Please visit: www.tri.com.tw

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