TRI — Investor Presentation 2021

Nov 26, 2021

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德律科技股份有限公司 www.tri.com.tw

Nov. 26, 2021

報告人 : 陳冠元 / 財務長兼代理發言人

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德律科技股份有限公司

• 成立時間 : 1989年4月10日

• 創立人 : 陳玠源董事⻑

• 資本額 : 新台幣23.62億

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: 主力產品 電路板組裝檢測設備

• 自動光學檢測設備 (IT/Image Tester)

• 錫膏自動光學影像檢測機 (SPI)  自動光學影像檢測機 (AOI)  X-ray 自動檢測機 (AXI)

• 電路板測試機 (BT/In-Circuit Board Tester)

• 組裝電路板測試機 (MDA)  全功能電路板自動測試機 (ICT)

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全球唯一 “ 一條龍 ” 電路板組裝檢測設備廠 德律產品在客戶的電路板組裝產線的應用

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: 整合多項視覺核心新技術因應 - 高精密電子料件量測需求 - 先進半導體製程 / 封裝檢測需求

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Calibration 校正技術 雷射 (Laser)

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條紋光
(Fringe
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深度對焦
(DFF)
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TRI AOI Metrology 量測 Linear 共線性

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Linearity

主要競爭對手

 : 韓國 Koh Young 日本: Omron  中國大陸: Jutze/Sinic-Tek/Holly 馬來西亞: Vitrox 美國: Keysight/Teradyne 德國: Viscom/SPEA

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全球銷售服務網

More than 3000 customers have been serviced through worldwide partners More than 50 distributors and Rep. worldwide.

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More than 50 distributors and Rep. worldwide. 主要客戶為全球各
大電子產品組裝廠
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Electronic Industry/Revenue Movement

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5
8 Industrial/Defense
15
18
Automobile
11
12 Household/Game
16
13
Phone/Peripheral
15
12
Network
26
26 NB/Tablet/Peripheral
Semiconductor/IC
12
10
202001-202010 202101-202110
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10000
年營收
台幣百萬
-
9000 Uncertainty of global economy
-Delay of 3D AOI launch
-Low price competition in China
8000
-
Economic
Increase of smart
Decline of PC/NB
mobile devices
recovery
7000 application application -
Blue-ocean
Rush capacity 5870
6000 buy triggered by
economic recovery 5388
4919 4951
5000 4754
4387
New FCT
New AOI 7500
4084
+7500/L/D
is not launched 37783894
4000 T
until ’06. 3601
New 7500
Economic
+7006L 3100
New SPI recession
3000 7006
2541
+7100EP
2055 2074
2000 New AOI 1706
7100 15531470
1000 569 [777] [902]
0
'01 '02 '03 '04 '05 '06 '07 '08 '09 '10 '11 '12 '13 '14 '15 '16 '17 '18 '19 '20
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每股盈餘
7
6.43
6
5.34
4.87
5 4.67 [5.03]
4.48
4.51 4.63
4.23
4.45
4 3.97
3.41
3.19
3
2.53
2.17 2.52
2
1.82
1 1.02
0
'03 '04 '05 '06 '07 '08 '09 '10 '11 '12 '13 '14 '15 '16 '17 '18 '19 '20
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紅海與藍海市場營收變化

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台幣百萬
藍海 紅海 毛利率
8,000 80%
紅海市場 : 藍海市場之產品與應用 :
- -
較低技術門檻 3D AOI
7,000
- -
價格導向 高精密電子料件量測
70%
-
先進半導體製程檢測需求
6,000
-
AXI
-
電路板測試機
5,000 54%
60%
57%
55% 55% (~Q3)
4,000 53% 53% 53%
1,689
1,453
1,578
1,856
3,123 50%
3,000 46%
1,592
1,517
4,955
2,000
3,063 3,262 1,356
2,934 40%
(62%) (66%) (71%)
2,009 (67%)
1,000 1,631 1,583
914 (34%) (51%) (56%)
(16%)
0 30%
2014 2015 2016 2017 2018 2019 2020 2021.10
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TRI 3D AOI Product Roadmap
SMT 元件
0201 >> 15 um
01005 >> 10 um
Mini LED 應用
2D TR7700 SIII Plus @ 5.5 um
3D TR7700QE-S @ 5.5 / 3.45 um
系統封裝 (SiP)/
+ Laser @ 10/20 um
填充膠 (Underfill)
晶圓 (Wafer)
(TR7700QE-S +IR)
@ 3.45 um TR7960A (DFF)
黏晶 (Die Bond)
+ Laser @ 10/20 um
檢測
打線 (Wire Bond)
+ DFF @ 1.0 / 0.5 um
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TRI 3D AOI Product Roadmap

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TR7700QB SII
TR7700Q(L) SII (DL)
-12M/15um
-12M/15um
TR7500QE Plus
-12M/12um
-12M/10, 15um
-12M/10um + 4 Sideview
-12M/5.5um
TR7700(L) QE -12M/15,10um
TR7700QM SII -12M/5.5um
TR7500(L) QE -12M/15,10um+4 Sideview
•
TR7700 QE-S -12M/5.5um,3.45um AOM & AI SW module
•
• 4x DLP + Omni color RGBW lighting Optional Laser module
•
• Optional DFF module
Optional Laser module
•
Optional DFF module
2019 2020 2021 2022
13 Confidential
Speed
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NEW
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TR7700Q SII 3D AOI 特點

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Industry-Leading Inspection Speed up to 57 cm[2] /sec

Ease of Programming with TRI’s Smart Library Multiple 3D Technologies: Zero-escapes Inspection

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14

Confidential

升級 DFF 3D 科技 Only available for TR7700Q

 Optimal focus position  Clearer 2D Images

0.5 µm 1 µm 超高解析度

 Sharper images  Shadow-free 3D Image

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Semiconductor - 打線接合 (Wire bond)

SMT – 錫點 (Solder joint)

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15

TR7700QE-S 3D AOI 特點

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Supports 3.45 / 5.5um Ultra High Resolution

: 可支援半導體封裝等級檢測應用

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貼片元件 (SMD)
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填充膠 (Underfill)
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16

Confidential

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TRI’s SPI 最新應用項目
Fast Inspection Precision Smart
Speed Inspection Factory
5.5
μm
Large FOV High Resolution Closed Loop
CoaXpress Technology Shadow Free IPC-CFX
Dynamic Imaging Smart Warpage Technology Smart Library
Stop & Go Imaging High Inspection Range YMS 4.0
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Confidential

TR7007D/Q Plus Series SPI 新應用特點 Improved Inspection Stability and Capability

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Enhanced 2D Light Improved Imaging Easy Maintenance

Full Size Support Pin (Optional)

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New Log Interface

Easy hardware Upgrading design

NEW Motion Controller

完備的3D在線型 AXI

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TR7600(LL/TL) SIII

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TR7600F3D(LL) SII

TRI新一代具指標性的在線型 PCBA檢測解決方案。結合了業界 最快速的高解析取像速度，並在先 進的自動X光檢測中大大提升了影 像品質。

大幅提升檢測速度的高解析度 在線型3D AXI，並可應用CT 電腦斷層掃描科技，專門用於 檢測需要高影像品質的組裝電 路板和軟板組件。

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- 電路板測試機 多核心配置

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TR5001 SII Quad-code System 單核心與多核心測試時間比較
10
101.1%
100.2%
100%
9
TR5001 SII Single-Core TR5001 SII Dual-Core TR5001 SII Quad-Core
(100.0%) (100.2%) (101.1%)
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高密度測試點數ICT TR8100H SII / TR8100HL SII

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NEW
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Original Test Points. New SII Model Model TR8100LV 3584 pins 7056 pins ~~SII~~ TR8100LLV 5632 pins 11088 pins Confidential 21

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TRI 整合完整的解決方案
Metrology
Multi-Sensing
AOM
2D/3D
AOI & AVI
Industry 4.0
Hermes/CFX
TRI
SECS/GEM AI
AOI
22
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全新TRI量測功能(AOM)

 UI: New designed and friendly user interface

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 Features: More complete 量測元素
measurement functions will be
構造方法
available
量測目標
指定座標系
 High Flexibility: Multi-Layer
measurements
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23

TRI的AI應用

缺陷檢測/ 字元識別/ 視覺檢測/ 量測輔助 檢測階段AI 優點：提高檢測品質，減少誤判 維修站缺陷分類和複檢 複判階段 優點：減少人工複檢的工作量 AOI SPI AXI TRI 檢測解決方案 TRI AI 工作站 維修 / 複判站

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TRI的AI應用

1. AI 智慧編程 (Smart Programing)

• 2. AI 工作站 : 伺服器 終端架構的 AI 檢測及調試

3. AI 智能複判主機 (Verify Host): AI 維修/複判站(Repair Station) 管理

4. AI : 檢測

• 字元辨識 (OCV/OCR)

• 瑕疵檢測

• 待測物外觀檢測

• 異物檢測

TRI AI 發展歷程及規劃藍圖

AI 發展藍圖:

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短期 中期 ⻑期
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 快速發展

• 取得商用化元件資料庫

• 外部合作單位

 技術紮根

 無人化 AOI應用

 採用開源 (Open-source) 方案  零漏測及零誤判  推論/訓練伺服器  TRI 規格/標準訂定  發展更快速及更精確檢測方案

AI 應用:

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♦ AI 維修/複判站 ♦ AI 外觀檢測 ♦ 檢測一致性優化
♦ AI 異物檢測 ♦ IC 腳位浮高檢測 ♦ 智慧編程
♦ AI 字元辨識 ♦ AI 控制優化 ♦ 客戶端有效訓練
♦ AI打線接合檢測
2019 2020 2021~
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TRI YMS 4.0 良率管理系統 協助客戶提升生產力及品質管理

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• 實時狀態檢查

• 監控生產問題改善狀況

• SPC和生產力監控 • PDCA改善循環

• •

• 列出排名前10的不良項目和對應圖像 支持品質優化

• 依各站別, 線別, 流程找出問題點

• 輸出報告到MES / SFCS

工業4.0解決方案

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Confidential

TRI支援封閉迴路控制系統 TRI SPI, AOI, AXI 檢測資訊的串流 IPC CFX(data)/HERMES(M2M)

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Data & I Ski b d
mage p oar
Feedback Feedforward
Feedback data
Pre-reflow Post-reflow
SPI AXI
AOI AOI
TR7007QI TR7600 SIII
TR7710 TR7700QE
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智慧工廠解決方案

Big Data Ready

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Smart Monitoring

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內部研發團隊

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. •PLC control
•Optical Dept. • system S/W
• Mechanical Dept. YMS, R/S
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•Lighting control
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光學檢測
200 [+] RD
電路板測試
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外部機構技術支援

Department of Computer science, 台灣大學 - 影像處理 / Understanding

Department of Power Mechanical, 清華大學

• X-ray 3D Reconstruction/Digital Tomosynsis Algorithm/ 電腦切層演算法

• Center of Measurement Standards, 工研院 - Length/ Camera / 色彩校正

近年獲獎

 2016 Global Technology Award  2017 Circuits Assembly NPI Award  2017 EM Asia 創新獎  2018 Circuits Assembly NPI Award  2018 EM Asia 最佳供應商獎  2019 Global Technology Award  2019 EM Asia 傑出產品獎  2020 Global Technology Award  2021 EM Asia 創新獎

• TRI’s Company Milestones: - - -

• https://www.tri.com.tw/tw/about/about 21 1 2.html

免責聲明

本簡報資料所提供之資訊，包含所有前瞻性的 看法，德律科技股份有限公司（本公司）將不 會因任何新的資訊、未來事件、或任何狀況的 產生而負有更新或修正本簡報資料內容之責 任。本簡報資料中所提供之資訊並未明示或暗 示的表達或保證其具有正確性、完整性、或可 靠性，亦不代表本公司、產業狀況或後續重大 發展的完整論述。

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Better Testing Better Quality

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THANK YOU! For more information about Test Research, Inc. Please visit: www.tri.com.tw

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