TMT — Interim / Quarterly Report 2018

Aug 21, 2018

Taiwan Polyimide

We know Polyimide

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IMPORTANT NOTICE

Taimide’s statements of its current expectations provided herein are forward-looking. These statements are subject to risks and uncertainties that might cause significant deviations from actual results, including but not limited to changes in business policy, possible fluctuations in economic situations, technology development, competition environment, and other circumstances beyond control. Taimide undertakes no obligation to update the forwardlooking statements to reflect events or circumstances after the issuance of the statements.

Nothing contained herein constitutes an investment advice, offer or solicitation for the purchase or sale of any financial instrument. While reasonable care has been taken to ensure that the information contained herein is not untrue or misleading at the time of publication, Taimide makes no representation that it is accurate or complete. Neither Taimide nor any of its officers or employees shall be liable for any direct, indirect or consequential loss, damage, cost or expense incurred or arising from any use of the information contained herein.

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Company Profile
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Operating Result 2018 H1
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Company Profile
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Q & A
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Company Profile
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• Established: June, 2000

 Company capital: 40M USD

 Plant sites: Hsinpu & Tongluo

 Employees: ~380

 IPO in TSE: October, 2011

Polyimide Film Manufacturer

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Operating Result 2018 H1
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Selected Items from Statements of Comprehensive Income

(NT$ million) Net Revenue Gross Margin Operating Expenses Operating Margin Non-Operating Items Net Income to Shareholders of the Parent Company Net Profit Margin EPS(NT Dollar)	2Q18		1Q18	2Q17 379.53 29.2% 65.33 12.0% 6.65 40.44 10.1% 0.33	2Q18 over 1Q18 2Q18 over 2Q17 7.5% 56.6% -6.7ppts -0.8ppts 10.1% 18.7% -7ppts 3.4ppts N/A 255.8% -0.2% 120.9% -1.2ppts 4.2ppts -1.4% 118.2%
	594.53 28.4% 77.52 15.4% 23.66 89.35 14.3% 0.72		553.23 35.1% 70.40 22.4% (12.72) 89.57 15.5% 0.73

*Diluted weighted average outstanding shares were 123million units in 2Q18.

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(NT$ million)

YoY QoQ 56.6% 7.5%

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(NT$ million)

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QoQ
24%
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QoQ
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QoQ
QoQ
9%
5%
R e v e n u e R e v e n u e
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(NT$ million)

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YoY QoQ
-0.8ppts -6.7ppts
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(NT$ million) YoY QoQ 18.7% 10.1% 65.33 70.40 77.52

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(NT$ million)

YoY QoQ 100.7% -26.3%

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YoY QoQ
3.4ppts -7ppts
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(NT$ million)

YoY QoQ 122.8% -0.4%

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YoY QoQ 4.2ppts -1.2ppts

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(NT$)

YoY QoQ 118.2% -1.4%

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Selected Items from Balance Sheets (NT$ million) Cash & Marketable Securities Accounts Receivable Inventories Net PP&E Total Assets Current Liabilities Long-term Interest-bearing Debts Total Liabilities Total Shareholders' Equity Key Indices Inventory Turnover Days Current Ratio (x) Asset Productivity (x)	2Q18		Amount % Amount % 481.39 13.1% 556.74 15.8% 520.57 14.2% 361.76 10.2% 359.41 9.8% 403.45 11.4% 2,167.84 59.1% 2,145.63 60.8% 3,668.49 100.0% 3,531.41 100.0% 850.81 23.2% 801.87 22.7% 438.20 11.9% 616.85 17.5% 1,292.80 35.2% 1,421.30 40.2% 2,375.69 64.8% 2,110.11 59.8% 86.50 122.17 1.65 1.69 1.02 0.74 1Q18 2Q17
	Amount %
	558.56 15.2% 486.15 13.2% 342.73 9.3% 2,135.88 58.2% 3,669.49 100.0% 1,006.72 27.4% 379.19 10.3% 1,389.71 37.9% 2,279.78 62.1% 77.21 1.42 1.07

*Total outstanding shares were 123 million units at 6/30/18

**Asset Productivity=Annualized net revenue/Average net PP&E

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公司及產品簡介 Product development direction

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公司及產品簡介 High-frequency high-speed products

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Modified PI (MPI)
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• High surface energy- higher bonding strength

• Lower temp lamination- lower energy cost

• Amorphous polymer- wider operation window

• Same facility- be familiar with customer

• Acceptable material cost

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LCP
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• Lower surface energy- lower bond-ability to copper

• High temp lamination- higher energy cost

• Crystalline melt- narrow operation window

• Additional facility needed

• High material cost

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Low Temp. Lamination

190[o] C 0.5M/S 60kg/cm2

Post curing: 180 ℃ × 1hrs.

Properties	LKL Laminated
Peeling strength (kgf/cm)	>1.0
Solder float (288℃×180 sec.)	Pass

Dimensional Stability (%)	Dimensional Stability (%)	Dimensional Stability (%)	Dimensional Stability (%)
	Cu Etched	Cu Etched + 150℃/0.5hr	Cu Etched + 200℃/0.5hr
MD	-0.015	-0.015	-0.025
TD	-0.058	-0.034	-0.053

• Copper Foil:

• Thickness: 1/3 oz.

• Grade: TQ-M4-VSP (Rz=0.6 μm )

• Supplier: Mitsui Mining & Smelting Co., Ltd.

 LKL Film:

• Thickness: 25,50, 75 ,100um

• Grade: Low Dk/Df

• Supplier: Taimide Tech. INC.

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A 社 B 社
A 社
B 社
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公司及產品簡介 Transparent optical products

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LCD Glass OLED Flexible OLED

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Q&A
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Thank you

TAIMIDE TECH. INC

www.taimide.com.tw

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