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Technoprobe Regulatory Filings 2023
4484_er_2023-03-12_46b6030c-1b2c-4ba2-bf66-d71aaa8b03f6.pdf
Regulatory Filings
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| Informazione Regolamentata n. 20250-6-2023 |
Data/Ora Ricezione 12 Marzo 2023 19:11:50 |
Euronext Growth Milan | |
|---|---|---|---|
| Societa' | : | TECHNOPROBE | |
| Identificativo Informazione Regolamentata |
: | 173330 | |
| Nome utilizzatore | : | TECHNOPROBEN04 - Di Terlizzi | |
| Tipologia | : | REGEM | |
| Data/Ora Ricezione | : | 12 Marzo 2023 19:11:50 | |
| Data/Ora Inizio Diffusione presunta |
: | 12 Marzo 2023 19:11:51 | |
| Oggetto | : | Press Release Exposure to Silicon Valley Bank Financial Group |
|
| Testo del comunicato |
Vedi allegato.
Technoprobe S.p.A. Via Cavalieri di Vittorio Veneto, 2 23870, Cernusco Lombardone (LC) - Italy www.technoprobe.com
PRESS RELEASE
Cernusco Lombardone (LC), 12 marzo 2023 – Technoprobe S.p.A., a company listed on Euronext Growth Milan and leader in the design and production of Probe Cards (the "Company" or "Technoprobe") announces, with reference to the events that are affecting the Silicon Valley Bank Financial Group (the "SVB Financial Group"), that its exposure to SVB represents approximately 2.5% of the Company's cash and cash equivalents as of December 31, 2022.
The Company does not maintain any other material accounts or lines of credit with SVB Financial Group considering the exposure not relevant.
The Company, assisted by its advisors, is monitoring the situation to assess and consequently take any action to protect the Company's interests.
***
This press release will be available on Technoprobe's website www.technoprobe.com, in the Investor Relations section/Financial Press Releases.
Contacts
Technoprobe S.p.A. Technoprobe S.p.A. Ines Di Terlizzi Paolo Cavallotti
Investor Relator Communication & Marketing Manager Email: [email protected] Email: [email protected]
Euronext Growth Advisor e Specialist Mediobanca – Banca di Credito Finanziario S.p.A. Piazzetta Enrico Cuccia n. 1 Milano Email: [email protected] Tel: +39 02 88291
Technoprobe Group
Technoprobe is a leading company in the semiconductor and microelectronics industry. Established in 1996 from a business idea of its founder Giuseppe Crippa, Technoprobe specialises in the design and manufacture of electromechanical interfaces called Probe Cards for chip function testing. Its business sector is non-memory semiconductor or SOC (system on chip) testing. The Group is Italy's only Probe Card manufacturer and one of the world leaders in terms of volume and turnover. Within its portfolio of collaborations and partnerships, the Group includes the world's major manufacturers of microchips in the microelectronics, IT and digital sectors. Probe Cards are high-tech devices, tailor-made to the specific chip, that allow the functioning of chips to be tested during their construction process. These are technological designs and solutions that ensure the operation and reliability of devices that play a decisive role in the Information Technology industry, 5G, Internet of Things, home automation, automotive, aerospace and more. Today, the Technoprobe Group is an ever-expanding research and innovation technology hub with about 2,700 employees (of which about 1,700 are in Italy), 3 research centres and over 600 certified patents. In Italy, the Group has its registered office in Cernusco Lombardone (LC), on the outskirts of Milan, where there is also a production centre occupying a covered area of approximately 18,000 square metres. In addition, the Group has two other production plants in Italy: the first of about 3,000 square metres in Agrate Brianza (MB), and the second of about 5,000 square metres in Osnago (LC). Finally, the Group has another 11 locations worldwide, spread across Europe (France, Germany), Asia (Taiwan, South Korea, China, Japan Philippines and Singapore) and the United States (two locations in California).
Technoprobe S.p.A. - Partita IVA e Codice Fiscale 02272540135 - Capitale Sociale € 6.010.000 - R.E.A. 283619 All rights reserved. The COPYRIGHT of this document is property of TECHNOPROBE S.p.A. No part of this document may be copied, reprinted or reproduced in any material form, whether wholly or in part, without a written consent. The contents or methods or techniques contained herein are CONFIDENTIAL, therefore must not be disclosed to any other person or company or entity.