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Skytech — Investor Presentation 2026
May 27, 2026
52670_rns_2026-05-27_2bdc6b3b-ef04-4bfb-9539-bee46a9a84b0.pdf
Investor Presentation
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Skytech 天虹科技
Accelerating Innovation
INSIGHT SKYTECH
天虹科技 SKYTECH
Quality Service
Innovating Solutions
Skytech 天虹科技
Accelerating Innovation
Safe Harbor Notice
- Information included in this presentation that is not historical in nature constitutes "forward-looking statements". Skytech cautions readers that forward-looking statements are based on Skytech's current knowledge and expectations and are subject to various risks and uncertainties.
- Actual results may differ materially from those contained in such forward-looking statements for a variety of reasons including, without limitation, risks associated with demand and supply changes, manufacturing and supply capacity, time to market, market competition and other unexpected events which may disrupt Skytech's business and operations.
- Accordingly, readers should not place undue reliance on any forward-looking statements. Except as required by law, Skytech undertakes no obligation to update any forward-looking statement, whether as a result of new information, future events, or otherwise.
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Skytech 天虹科技
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Management Team & MFG Locations
INFO
Stock Symbol : 6937
Establish Date : 2002/07
Capital : TWD 675,762,630
Employees : 424

Homestead (~2021)

Paul Huang
Skytech Chairman

Carl Lo
Skytech founder & Vice President

George Yi
Skytech CEO
(Previous AMAT Corporate VP for global field service)
LOCATIONS

Hsinchu (Headquarter)

Hsinchu MFG#1
(with RD center)


Tainan MFG


SkySemi
Xiamen MFG

Gimtek
Singapore Office

JTCK
Japan Office
(M&A in 2025/10)
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2025 Skytech 天虹科技
Accelerating Innovation
Awards
2026 ERSO AWARD


2025 Taiwan FINI 100 Companies



2024 Taiwan Mittelstand Award



The Largest Corporations in Taiwan 2022 TOP 5000


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Skytech
天虹科技
Accelerating Innovation
Skytech Patent Summary
Skytech Inc.
Total submitted 575
Total Patented 417

| Patent | Invention | Utility | Total |
|---|---|---|---|
| Taiwan | 104 | 113 | 217 |
| China | 49 | 104 | 153 |
| US | 46 | 46 | |
| Singapore | 1 | 1 | |
| Global | 200 | 217 | 417 |
As of 2026/Q1

Patent Statistics
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Skytech
天虹科技
Accelerating Innovation
Hsinchu MFG R&D Center


Elevator Hall


Office


Pantry Room
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Skytech 天虹科技
Accelerating Innovation
Hsinchu MFG 1F Cleanroom








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Skytech 天虹科技
Accelerating Innovation
Hsinchu MFG 3F Cleanroom

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Skytech
天虹科技
Accelerating Innovation
Skytech Roadmap

PVD
Semi Auto Bonder/
De-bonder
2018
02

Certified by A
Skiwar/EFEM
Powder ALD
2020
04

PEALD
Shuxda PVD
2022
06

Penetrate into Europe market
ITO PVD
PECVD
2024
08
Focus on advanced packaging
Equipment enters key accounts
Obtain critical technology & products
by M&A
Penetrate into SEA/J/US market
2026
10
01
2017
Kick off for Semiconductor
equipment
03
2019
ALD

05
2021
Penetrate into compound
Semiconductor
Penetrate into Front-end
Auto Bonder/ De-bonder

07
2023
Descum
Carbon PVD
IPO Q4/23
09
2025
EUV inspection
PLP PVD/ PLP Descum
12" Auto Bonder




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Skytech 无虹科技
Accelerating Innovation

Delivery 154 equipment to customers till 2026/Q1

Achieved sales milestone of the 100th system delivery on 2024/06/28
Equipment Delivery Records
| Quantity | Category | Ship Date | Quantity | Category | Ship Date | Quantity | Category | Ship Date | Quantity | Category | Ship Date |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 1 | Compound | 2018/5/22 | 96 | LED | 2022/3/19 | 78 | Semi | 2023/9/8 | 115 | ED | 2024/12/10 |
| 2 | Compound | 2018/5/22 | 41 | Semi | 2022/4/30 | 80 | Semi | 2023/10/4 | 115 | Semi | 2024/12/18 |
| 3 | Semi | 2018/6/1 | 42 | Semi | 2022/6/30 | 81 | Compound | 2023/10/10 | 120 | Semi | 2024/12/23 |
| 4 | LED | 2018/6/7 | 43 | LED | 2022/7/5 | 87 | Compound | 2023/10/10 | 121 | Semi | 2024/12/23 |
| 5 | LED | 2018/8/15 | 44 | LED | 2022/7/7 | 84 | Compound | 2023/10/11 | 122 | Semi | 2025/2/8 |
| 6 | LED | 2018/9/4 | 45 | Compound | 2022/7/15 | 88 | Semi | 2023/10/10 | 123 | Semi | 2025/3/25 |
| 7 | Compound | 2018/12/30 | 46 | Compound | 2022/7/15 | 85 | Compound | 2023/12/13 | 124 | Semi | 2025/3/25 |
| 8 | Compound | 2018/12/30 | 47 | Compound | 2022/8/1 | 88 | Semi | 2023/12/29 | 125 | ED | 2025/3/27 |
| 9 | Semi | 2019/4/11 | 48 | RD Center | 2022/9/20 | 87 | Compound | 2024/1/2 | 126 | Semi | 2025/4/24 |
| 10 | Compound | 2019/7/4 | 49 | Compound | 2022/9/23 | 88 | Compound | 2024/1/2 | 127 | ED | 2025/5/12 |
| 11 | Semi | 2019/9/16 | 50 | Compound | 2022/9/27 | 89 | Semi | 2024/2/27 | 128 | ED | 2025/6/4 |
| 12 | LED | 2020/5/15 | 51 | Semi | 2022/9/29 | 91 | Semi | 2024/3/27 | 129 | ED | 2025/6/16 |
| 13 | LED | 2020/6/8 | 52 | Compound | 2022/9/29 | 91 | Semi | 2024/3/22 | 130 | Electrical | 2025/6/25 |
| 14 | LED | 2020/6/15 | 53 | Compound | 2022/9/29 | 92 | Compound | 2024/3/28 | 131 | Compound | 2025/6/26 |
| 15 | Compound | 2020/6/15 | 54 | LED | 2022/12/4 | 94 | Compound | 2024/3/28 | 132 | Semi | 2025/8/19 |
| 16 | Semi | 2020/7/20 | 55 | Semi | 2022/12/14 | 94 | Semi | 2024/3/29 | 133 | ED | 2025/8/27 |
| 17 | LED | 2020/7/31 | 56 | Compound | 2022/12/28 | 95 | LED | 2024/5/29 | 134 | Semi | 2025/9/8 |
| 18 | LED | 2020/7/31 | 57 | Compound | 2022/12/28 | 96 | Semi | 2024/6/6 | 135 | Electrical | 2025/9/30 |
| 19 | LED | 2020/8/14 | 58 | LED | 2022/12/29 | 97 | Semi | 2024/6/12 | 136 | Compound | 2025/10/2 |
| 20 | Compound | 2020/8/31 | 59 | Compound | 2023/1/5 | 98 | Compound | 2024/6/24 | 137 | ED | 2025/10/3 |
| 21 | LED | 2020/10/8 | 60 | Compound | 2023/1/6 | 99 | Compound | 2024/6/25 | 138 | Semi | 2025/10/13 |
| 22 | Semi | 2020/12/31 | 61 | Compound | 2023/2/2 | 100 | Semi | 2024/6/28 | 139 | Compound | 2025/11/18 |
| 23 | Semi | 2020/12/31 | 62 | Semi | 2023/2/8 | 101 | Semi | 2024/7/31 | 140 | Semi | 2025/12/15 |
| 24 | LED | 2021/2/25 | 63 | Semi | 2023/2/15 | 102 | Semi | 2024/7/31 | 141 | Semi | 2025/12/15 |
| 25 | Semi | 2021/3/15 | 64 | Semi | 2023/2/19 | 103 | Semi | 2024/8/1 | 142 | Semi | 2025/12/18 |
| 26 | Compound | 2021/3/31 | 65 | Semi | 2023/3/2 | 104 | Semi | 2024/8/1 | 143 | Compound | 2025/12/19 |
| 27 | Electrical | 2021/6/30 | 66 | Compound | 2023/3/30 | 105 | Academic | 2024/8/23 | 144 | Semi | 2025/12/22 |
| 28 | LED | 2021/7/12 | 67 | Compound | 2023/3/31 | 106 | LED | 2024/9/25 | 145 | ED | 2025/12/24 |
| 29 | Semi | 2021/11/17 | 68 | Compound | 2023/3/31 | 107 | Academic | 2024/9/25 | 146 | LED | 2025/12/26 |
| 30 | LED | 2021/11/18 | 69 | Semi | 2023/3/16 | 108 | Academic | 2024/9/25 | 147 | Semi | 2026/1/21 |
| 31 | LED | 2021/12/7 | 70 | Compound | 2023/3/31 | 109 | Academic | 2024/9/25 | 148 | ED | 2026/2/11 |
| 32 | Compound | 2021/11/22 | 71 | Semi | 2023/6/8 | 110 | Academic | 2024/9/25 | 149 | ED | 2026/2/11 |
| 33 | Compound | 2021/11/22 | 72 | Compound | 2023/6/15 | 111 | LED | 2024/10/7 | 150 | Semi | 2026/2/11 |
| 34 | Compound | 2021/11/22 | 73 | Compound | 2023/6/19 | 112 | Electrical | 2024/10/29 | 151 | Compound | 2026/2/24 |
| 35 | Compound | 2021/12/24 | 74 | Compound | 2023/6/20 | 113 | LED | 2024/11/19 | 152 | Semi | 2026/3/31 |
| 36 | Electrical | 2021/12/25 | 75 | RD Center | 2023/7/3 | 114 | LED | 2024/11/20 | 153 | Compound | 2026/3/31 |
| 37 | Semi | 2022/1/5 | 76 | Compound | 2023/8/16 | 115 | LED | 2024/12/4 | 154 | Compound | 2026/3/31 |
| 38 | Semi | 2022/2/24 | 77 | Semi | 2023/8/31 | 116 | Compound | 2024/12/10 | |||
| 39 | LED | 2022/2/9 | 78 | Semi | 2023/9/6 | 117 | Compound | 2024/12/10 |
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Skytech 天虹科技
Accelerating Innovation
Core Competence & RD Direction
High Vacuum Plasma & Wafer Thinning Solution Provider

High Vacuum & Plasma

PVD

ALD

PECVD

Descum & Plasma Polish

PLP PVD/ PLP Descum

High Vacuum & Laser

EUV Inspection

Silicon Semiconductor
Frontend/Adv. Package/IGBT BM
(PVD, ALD, Bonder, Descum, PECVD)
Compound Semiconductor GaAs/InP/SiC/GaN
(PVD, ALD, Bonder, De-Bonder)
LED/Mini LED/ Micro LED
(PVD, ALD) & (QD Solution)
CPO (Co-Package Optics)
(Bonder, De-Bonder, PVD)
PLP (Panel Level Package)
(PVD, Descum, Etching)

Wafer Thinning

Bonder

De-Bonder
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Roadmap of PVD
NEXDA
- ESC: Enhanced Step Coverage
- HSC: High Step Coverage
- UHSC: Ultra High Step Coverage
- B-HSC: Bias High Step Coverage

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Skytech 天虹科技
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Roadmap of ALD

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天虹科技
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Roadmap of Bonder/ De-Bonder

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2014
Skytech
天虹科技
Accelerating Innovation
Roadmap of Etching

Descum

Plasma Polish & Dry etching
Integrated with Std. EFEM

Integrated with Narrow Body LL
SiC etching
New Etch Vetra Chamber
Plasma Dicing & TSV
ABF etching

Descum & Dry etching for 3DIC related application :
- PI & PR descum
- LTHC dry etching
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天虹科技
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Roadmap of EUV Inspection

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Skytech 天虹科技
Accelerating Innovation
Development Plan for PLP Tools
PVD Deposition
- FSM Ti/Cu Deposition:
LLA → MSD (Multi-Slot Degas) → Pre-clean → PVD Ti → PVD Cu → LLB - BSM Al/Ti/NiV/Au Deposition:
LLA → MSD (Multi-Slot Degas) → Pre-clean → PVD Al → PVD Ti → PVD NiV → PVD Au → LLB - Multi-Slot degas for MC substrate baking

Descum
- Maximum 6 Descum chambers, 6 process gases
- Microwave on top (provided top RPS), & CCP at bottom, with dual plasma capability

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Skytech 无虹科技
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ISO & Semi S2 Certification

ISO Certification

PVD Semi S2 Certification

ALD Semi S2 Certification

Auto Bender Semi S2 Certification

Auto Bender Semi S2 Certification

RLP PVD System Semi S2 Certification
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2026/Q1 Summary

Achievement
- Successfully delivered the first 310x310mm PLP PVD system with a strategic customer, securing a 2nd customer order.
- ALD gains momentum in advanced technologies and smart glasses applications.
- Next-gen EUV transmission inspection tool (EUV2) hits performance targets, outperforming EUV1 prototype.

Challenge
- Manufacturing bay management with the most effective way.

On-going project
- Continue engagement in advanced technologies and advanced packaging.
- Deliver the 12-inch Auto Mechanical De-Bonder, scheduled for Q2 2026.
- Develop the new Lumina UV ALD chamber, scheduled for Q3 2026.
- Develop the new HyFA ALD chamber, scheduled for Q3 2026.
- Develop the new Vetra etching chamber, scheduled for Q4 2026.
- Develop the new 310×310 Panel ALD chamber, scheduled for Q1 2027.
- Develop Nexda 2.0 operation software, scheduled for Q1 2027.
- Continue to execute M&A and investments to drive inorganic growth.
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Skytech 天虹科技
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Finance Performance
(Unit: NT$ thousand)
| 2023 | 2024 | 2025 Q1 | 2025 Q2 | 2025 Q3 | 2025 Q4 | 2025 | 2026 Q1 | |
|---|---|---|---|---|---|---|---|---|
| Net Revenue | 1,992,643 | 2,587,641 | 461,194 | 512,306 | 549,489 | 721,657 | 2,244,646 | 582,447 |
| Gross Margin % | 44.02% | 43.96% | 41.91% | 39.21% | 36.51% | 42.29% | 40.09% | 41.77% |
| Net Income | 306,661 | 406,803 | 49,033 | 18,875 | 59,887 | 72,000 | 199,795 | 61,756 |
| EPS (NT$) | 5.02 | 6.03 | 0.73 | 0.28 | 0.91 | 1.09 | 3.01 | 0.96 |
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Skytech
无红科技
Accelerating Innovation
Equipment - Product and Industry Distribution







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Skytech 无虹科技
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Equipment Shipping Status- based on Application

YR18~25 Accumulated
- CPO/ Optical Communications
- FOPLP
- Packaging Heat Dissipation
- Consumer Electronics
- LEO Satellite
- Automotive Electronics
- AR/ VR
- EUV Pellicle

YR26/27 Guidance
- CPO/ Optical Communications
- FOPLP
- Packaging Heat Dissipation
- Consumer Electronics
- LEO Satellite
- Automotive Electronics
- AR/ VR
- EUV Pellicle
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Skytech 天虹科技
SkyEUV輝虹科技 智虹科技 靈天虹 SKYSEMI


NEXDA ShuxdA
Akomila BondelA
PandA WatapultA
WandA SgunA
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