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Skytech Investor Presentation 2026

May 27, 2026

52670_rns_2026-05-27_2bdc6b3b-ef04-4bfb-9539-bee46a9a84b0.pdf

Investor Presentation

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Skytech 天虹科技
Accelerating Innovation

INSIGHT SKYTECH

天虹科技 SKYTECH

Quality Service
Innovating Solutions


Skytech 天虹科技
Accelerating Innovation

Safe Harbor Notice

  • Information included in this presentation that is not historical in nature constitutes "forward-looking statements". Skytech cautions readers that forward-looking statements are based on Skytech's current knowledge and expectations and are subject to various risks and uncertainties.
  • Actual results may differ materially from those contained in such forward-looking statements for a variety of reasons including, without limitation, risks associated with demand and supply changes, manufacturing and supply capacity, time to market, market competition and other unexpected events which may disrupt Skytech's business and operations.
  • Accordingly, readers should not place undue reliance on any forward-looking statements. Except as required by law, Skytech undertakes no obligation to update any forward-looking statement, whether as a result of new information, future events, or otherwise.

Quality Service
Innovating Solutions
Confidential


Skytech 天虹科技
Accelerating Innovation

Management Team & MFG Locations

INFO

Stock Symbol : 6937
Establish Date : 2002/07
Capital : TWD 675,762,630
Employees : 424

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Homestead (~2021)

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Paul Huang
Skytech Chairman

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Carl Lo
Skytech founder & Vice President

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George Yi
Skytech CEO
(Previous AMAT Corporate VP for global field service)

LOCATIONS

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Hsinchu (Headquarter)

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Hsinchu MFG#1
(with RD center)

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Tainan MFG

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SkySemi
Xiamen MFG

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Gimtek
Singapore Office

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JTCK
Japan Office
(M&A in 2025/10)

Quality Service
Innovating Solutions
Confidential


2025 Skytech 天虹科技
Accelerating Innovation

Awards

2026 ERSO AWARD

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2025 Taiwan FINI 100 Companies

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2024 Taiwan Mittelstand Award

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The Largest Corporations in Taiwan 2022 TOP 5000

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Innovating Solutions
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2

Skytech

天虹科技

Accelerating Innovation

Skytech Patent Summary

Skytech Inc.

Total submitted 575
Total Patented 417

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Patent Invention Utility Total
Taiwan 104 113 217
China 49 104 153
US 46 46
Singapore 1 1
Global 200 217 417

As of 2026/Q1

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Patent Statistics

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Innovating Solutions

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2

Skytech

天虹科技

Accelerating Innovation

Hsinchu MFG R&D Center

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Elevator Hall

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Office

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Pantry Room

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Innovating Solutions

Confidential


Skytech 天虹科技
Accelerating Innovation
Hsinchu MFG 1F Cleanroom

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Quality Service
Innovating Solutions
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Skytech 天虹科技
Accelerating Innovation
Hsinchu MFG 3F Cleanroom

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Quality Service
Innovating Solutions
Confidential


Skytech
天虹科技
Accelerating Innovation
Skytech Roadmap

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PVD
Semi Auto Bonder/
De-bonder
2018
02

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Certified by A
Skiwar/EFEM
Powder ALD
2020
04

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PEALD
Shuxda PVD
2022
06

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Penetrate into Europe market
ITO PVD
PECVD
2024
08
Focus on advanced packaging
Equipment enters key accounts
Obtain critical technology & products
by M&A
Penetrate into SEA/J/US market
2026
10

01
2017
Kick off for Semiconductor
equipment

03
2019
ALD

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05
2021
Penetrate into compound
Semiconductor
Penetrate into Front-end
Auto Bonder/ De-bonder

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07
2023
Descum
Carbon PVD
IPO Q4/23

09
2025
EUV inspection
PLP PVD/ PLP Descum
12" Auto Bonder

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Quality Service
Innovating Solutions
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Skytech 无虹科技
Accelerating Innovation

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Delivery 154 equipment to customers till 2026/Q1

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Achieved sales milestone of the 100th system delivery on 2024/06/28

Equipment Delivery Records

Quantity Category Ship Date Quantity Category Ship Date Quantity Category Ship Date Quantity Category Ship Date
1 Compound 2018/5/22 96 LED 2022/3/19 78 Semi 2023/9/8 115 ED 2024/12/10
2 Compound 2018/5/22 41 Semi 2022/4/30 80 Semi 2023/10/4 115 Semi 2024/12/18
3 Semi 2018/6/1 42 Semi 2022/6/30 81 Compound 2023/10/10 120 Semi 2024/12/23
4 LED 2018/6/7 43 LED 2022/7/5 87 Compound 2023/10/10 121 Semi 2024/12/23
5 LED 2018/8/15 44 LED 2022/7/7 84 Compound 2023/10/11 122 Semi 2025/2/8
6 LED 2018/9/4 45 Compound 2022/7/15 88 Semi 2023/10/10 123 Semi 2025/3/25
7 Compound 2018/12/30 46 Compound 2022/7/15 85 Compound 2023/12/13 124 Semi 2025/3/25
8 Compound 2018/12/30 47 Compound 2022/8/1 88 Semi 2023/12/29 125 ED 2025/3/27
9 Semi 2019/4/11 48 RD Center 2022/9/20 87 Compound 2024/1/2 126 Semi 2025/4/24
10 Compound 2019/7/4 49 Compound 2022/9/23 88 Compound 2024/1/2 127 ED 2025/5/12
11 Semi 2019/9/16 50 Compound 2022/9/27 89 Semi 2024/2/27 128 ED 2025/6/4
12 LED 2020/5/15 51 Semi 2022/9/29 91 Semi 2024/3/27 129 ED 2025/6/16
13 LED 2020/6/8 52 Compound 2022/9/29 91 Semi 2024/3/22 130 Electrical 2025/6/25
14 LED 2020/6/15 53 Compound 2022/9/29 92 Compound 2024/3/28 131 Compound 2025/6/26
15 Compound 2020/6/15 54 LED 2022/12/4 94 Compound 2024/3/28 132 Semi 2025/8/19
16 Semi 2020/7/20 55 Semi 2022/12/14 94 Semi 2024/3/29 133 ED 2025/8/27
17 LED 2020/7/31 56 Compound 2022/12/28 95 LED 2024/5/29 134 Semi 2025/9/8
18 LED 2020/7/31 57 Compound 2022/12/28 96 Semi 2024/6/6 135 Electrical 2025/9/30
19 LED 2020/8/14 58 LED 2022/12/29 97 Semi 2024/6/12 136 Compound 2025/10/2
20 Compound 2020/8/31 59 Compound 2023/1/5 98 Compound 2024/6/24 137 ED 2025/10/3
21 LED 2020/10/8 60 Compound 2023/1/6 99 Compound 2024/6/25 138 Semi 2025/10/13
22 Semi 2020/12/31 61 Compound 2023/2/2 100 Semi 2024/6/28 139 Compound 2025/11/18
23 Semi 2020/12/31 62 Semi 2023/2/8 101 Semi 2024/7/31 140 Semi 2025/12/15
24 LED 2021/2/25 63 Semi 2023/2/15 102 Semi 2024/7/31 141 Semi 2025/12/15
25 Semi 2021/3/15 64 Semi 2023/2/19 103 Semi 2024/8/1 142 Semi 2025/12/18
26 Compound 2021/3/31 65 Semi 2023/3/2 104 Semi 2024/8/1 143 Compound 2025/12/19
27 Electrical 2021/6/30 66 Compound 2023/3/30 105 Academic 2024/8/23 144 Semi 2025/12/22
28 LED 2021/7/12 67 Compound 2023/3/31 106 LED 2024/9/25 145 ED 2025/12/24
29 Semi 2021/11/17 68 Compound 2023/3/31 107 Academic 2024/9/25 146 LED 2025/12/26
30 LED 2021/11/18 69 Semi 2023/3/16 108 Academic 2024/9/25 147 Semi 2026/1/21
31 LED 2021/12/7 70 Compound 2023/3/31 109 Academic 2024/9/25 148 ED 2026/2/11
32 Compound 2021/11/22 71 Semi 2023/6/8 110 Academic 2024/9/25 149 ED 2026/2/11
33 Compound 2021/11/22 72 Compound 2023/6/15 111 LED 2024/10/7 150 Semi 2026/2/11
34 Compound 2021/11/22 73 Compound 2023/6/19 112 Electrical 2024/10/29 151 Compound 2026/2/24
35 Compound 2021/12/24 74 Compound 2023/6/20 113 LED 2024/11/19 152 Semi 2026/3/31
36 Electrical 2021/12/25 75 RD Center 2023/7/3 114 LED 2024/11/20 153 Compound 2026/3/31
37 Semi 2022/1/5 76 Compound 2023/8/16 115 LED 2024/12/4 154 Compound 2026/3/31
38 Semi 2022/2/24 77 Semi 2023/8/31 116 Compound 2024/12/10
39 LED 2022/2/9 78 Semi 2023/9/6 117 Compound 2024/12/10

Quality Service
Innovating Solutions
Confidential


Skytech 天虹科技
Accelerating Innovation
Core Competence & RD Direction

High Vacuum Plasma & Wafer Thinning Solution Provider

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High Vacuum & Plasma

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PVD

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ALD

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PECVD

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Descum & Plasma Polish

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PLP PVD/ PLP Descum

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High Vacuum & Laser

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EUV Inspection

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Silicon Semiconductor
Frontend/Adv. Package/IGBT BM
(PVD, ALD, Bonder, Descum, PECVD)

Compound Semiconductor GaAs/InP/SiC/GaN
(PVD, ALD, Bonder, De-Bonder)

LED/Mini LED/ Micro LED
(PVD, ALD) & (QD Solution)

CPO (Co-Package Optics)
(Bonder, De-Bonder, PVD)

PLP (Panel Level Package)
(PVD, Descum, Etching)

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Wafer Thinning

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Bonder

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De-Bonder

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Skytech 天虹科技
Accelerating Innovation
Roadmap of PVD

NEXDA
- ESC: Enhanced Step Coverage
- HSC: High Step Coverage
- UHSC: Ultra High Step Coverage
- B-HSC: Bias High Step Coverage

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11


Skytech 天虹科技

Accelerating Innovation

Roadmap of ALD

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Quality Service

Innovating Solutions

Confidential


Skytech
天虹科技
Accelerating Innovation
Roadmap of Bonder/ De-Bonder

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Innovating Solutions
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13


2014

Skytech

天虹科技

Accelerating Innovation

Roadmap of Etching

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Descum

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Plasma Polish & Dry etching
Integrated with Std. EFEM

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Integrated with Narrow Body LL

SiC etching

New Etch Vetra Chamber

Plasma Dicing & TSV

ABF etching

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Descum & Dry etching for 3DIC related application :
- PI & PR descum
- LTHC dry etching

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Innovating Solutions

Confidential


Skytech
天虹科技
Accelerating Innovation
Roadmap of EUV Inspection

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15


Skytech 天虹科技
Accelerating Innovation
Development Plan for PLP Tools

PVD Deposition

  • FSM Ti/Cu Deposition:
    LLA → MSD (Multi-Slot Degas) → Pre-clean → PVD Ti → PVD Cu → LLB
  • BSM Al/Ti/NiV/Au Deposition:
    LLA → MSD (Multi-Slot Degas) → Pre-clean → PVD Al → PVD Ti → PVD NiV → PVD Au → LLB
  • Multi-Slot degas for MC substrate baking

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Descum

  • Maximum 6 Descum chambers, 6 process gases
  • Microwave on top (provided top RPS), & CCP at bottom, with dual plasma capability

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Skytech 无虹科技
Accelerating Innovation
ISO & Semi S2 Certification

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ISO Certification

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PVD Semi S2 Certification

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ALD Semi S2 Certification

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Auto Bender Semi S2 Certification

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Auto Bender Semi S2 Certification

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RLP PVD System Semi S2 Certification

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2026/Q1 Summary

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Achievement

  • Successfully delivered the first 310x310mm PLP PVD system with a strategic customer, securing a 2nd customer order.
  • ALD gains momentum in advanced technologies and smart glasses applications.
  • Next-gen EUV transmission inspection tool (EUV2) hits performance targets, outperforming EUV1 prototype.

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Challenge

  • Manufacturing bay management with the most effective way.

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On-going project

  • Continue engagement in advanced technologies and advanced packaging.
  • Deliver the 12-inch Auto Mechanical De-Bonder, scheduled for Q2 2026.
  • Develop the new Lumina UV ALD chamber, scheduled for Q3 2026.
  • Develop the new HyFA ALD chamber, scheduled for Q3 2026.
  • Develop the new Vetra etching chamber, scheduled for Q4 2026.
  • Develop the new 310×310 Panel ALD chamber, scheduled for Q1 2027.
  • Develop Nexda 2.0 operation software, scheduled for Q1 2027.
  • Continue to execute M&A and investments to drive inorganic growth.

Quality Service
Innovating Solutions
Confidential


Skytech 天虹科技
Accelerating Innovation

Finance Performance

(Unit: NT$ thousand)

2023 2024 2025 Q1 2025 Q2 2025 Q3 2025 Q4 2025 2026 Q1
Net Revenue 1,992,643 2,587,641 461,194 512,306 549,489 721,657 2,244,646 582,447
Gross Margin % 44.02% 43.96% 41.91% 39.21% 36.51% 42.29% 40.09% 41.77%
Net Income 306,661 406,803 49,033 18,875 59,887 72,000 199,795 61,756
EPS (NT$) 5.02 6.03 0.73 0.28 0.91 1.09 3.01 0.96

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Innovating Solutions
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Skytech
无红科技
Accelerating Innovation

Equipment - Product and Industry Distribution

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Innovating Solutions
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Skytech 无虹科技
Accelerating Innovation
Equipment Shipping Status- based on Application

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YR18~25 Accumulated

  • CPO/ Optical Communications
  • FOPLP
  • Packaging Heat Dissipation
  • Consumer Electronics
  • LEO Satellite
  • Automotive Electronics
  • AR/ VR
  • EUV Pellicle

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YR26/27 Guidance

  • CPO/ Optical Communications
  • FOPLP
  • Packaging Heat Dissipation
  • Consumer Electronics
  • LEO Satellite
  • Automotive Electronics
  • AR/ VR
  • EUV Pellicle

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Innovating Solutions
Confidential
21


Skytech 天虹科技

SkyEUV輝虹科技 智虹科技 靈天虹 SKYSEMI

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NEXDA ShuxdA
Akomila BondelA
PandA WatapultA
WandA SgunA

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