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PRIORTECH

Capital Market Presentation

May 2026

Legal Comments

The purpose of this presentation is to provide information only regarding Priortech Ltd. ("the Company") and/or its held companies.

This presentation does not constitute, and should not be interpreted, as an offer to purchase or sell securities of the Company, or as an invitation to receive such offers, and it is intended for the delivery of information only. Furthermore, this presentation does not constitute an offer to the public of securities of the Company or any of its held companies. The information included in the presentation does not constitute advice, recommendation, opinion, or an offer regarding the feasibility of investment and does not replace independent examination and personal advice according to the specific data of each investor. This presentation does not purport to encompass or contain all information that may be relevant for the purpose of making any decision regarding investment in the Company's securities.

The presentation includes data and information presented in a manner and editing different from the data included in public reports or such that can be calculated from the data included in the public reports. Therefore, this presentation is not intended to replace the need for reviewing reports published by the Company to the public, including a shelf prospectus, the Company's periodic reports, or the Company's immediate reports. To the extent there is a contradiction between what is stated in this presentation and what is stated in the Company's reports, the content of the said reports shall prevail.

partly due to the imposition of movement restrictions or blocking of shipping routes in territories where the Company and/or its held companies operate; (b) dependence on third parties and fulfillment of agreements by third parties with whom the Company and/or any of its held companies have contracted; (c) regulatory developments and government policy, mainly due to the group companies' activity in territories around the world and especially in East Asia; (d) instability in global operation areas and the impact of political, economic, and geopolitical crises on the semiconductor industry and the tension between the US and China; (e) the global supply of electronic components and the ability of the held companies to purchase electronic components to maintain their competitive advantage; (f) increase in operational costs; (g) high production costs of customers which may lead to a delay in the purchase of the held companies' products; (h) risk factors detailed in the Company's Annual Report for the year 2025 published by the Company on March 31, 2026 (reference number 2026-01-030459).

Therefore, actual future results or performance of the Company or its held companies may be materially different from what was expected or as interpreted in this presentation.

Except as required by law, the Company does not undertake to update or change this presentation and/or to update and/or change data and/or projections and/or evaluations included in it to reflect events and/or circumstances that occur after the date the presentation was edited.

Part of the information included in the presentation (including markets and trends) is based on or derived from data the Company collected from independent third parties whose accuracy the Company cannot guarantee as it has not verified the data itself.

This presentation includes projections, evaluations, estimates, intentions, and other data relating to future events that constitute "forward-looking information" as defined in Section 32A of the Securities Law, 1968, based on projections, expectations, and subjective assumptions as known to the Company at the time of preparing this presentation. These evaluations may not materialize, in whole or in part, or may materialize in a materially different way than expected, and may be affected by factors beyond the Company's control that cannot be reasonably estimated in advance, including but not limited to: (a) slowdown in economic growth in general and slowdown in activity in the electronics and chip markets in particular, supply chain delays and shipping price costs, raw material price costs, interruptions and delays in product installations at customer sites, delays and interruptions to production, marketing, and research and development processes, as well as interruptions and delays in the export or import of components and products,

Furthermore, it is clarified that the past performance of the Company and/or its held companies presented in this presentation does not constitute an indication of future results, and there is no certainty that the Company and/or its held companies will reach similar results or be able to implement their investment strategy or achieve any investment goal.

Q1-26 Results

Equity Profits	Q1-26	Y 2025
$10.8M $48.8M
Net Profit	Q1-26	Y 2025
$16.1M $41.5M
Equity	$280M
---	---
Net Financial Debt	$51.9M

Semiconductor Market Forecast

Global sales in the semiconductor industry grew in 2025 and totaled approximately 792 billion dollars – an increase of approximately 24% compared to 2024. The growth trend continues into 2026 with forecasts of up to approximately 1 trillion dollars in sales – a significant advancement of forecasts that predicted reaching this threshold only towards the year 2030(*).

The main engine for growth in the market comes from Logic components and memory components (mainly HBM), primarily due to the expansion of AI application uses and the demand for suitable hardware components for server farms and dedicated edge computing.

AI chips (accelerators, processors, and communication components) are expected to constitute about 50% of all chip sales in the world in 2026. Furthermore, growth is expected in all geographical areas and in all product categories.

The significant risk factors are excess production capacity which may lead to a decrease in prices if demand moderates, export restrictions, political tension (mainly US-China), and dependence on raw materials.

(*) Sources: Semiconductor Industry Association, World Semiconductor Trade Statistics

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Description of the Business Status of the Included Companies

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Access Business Status

The first quarter of 2026 continues the trend from the end of 2025 and presents sales volume of approximately $91 million with an operating profitability of 15.8%.

Access estimates that the growth trend will continue in 2026. Access is shifting its product focus towards electronic modules for HPC computers intended for AI applications and is expanding its production capacity accordingly.

Power Device Components Segment

Has become a significant and leading segment in Access, primarily due to the demand for components integrated into HPC computers, used mainly in Data centers and AI applications. This segment accounts for 50% of Access's sales in the first quarter.

ASIC Substrates Segment

For virtual currency applications, suffering from the decline in Bitcoin prices.

RF Components Segment

Still suffering from the recession in China and low demand for mobile phones, but recorded an improvement in sales and accounts for 37% of sales.

Access continues to work on promoting the process with the Chinese securities Authority and the Shenzhen Stock Exchange. It is not yet possible to estimate if and when the IPO of Access will be completed.

Access - Q1 2026 Results

Growth Rate ↑

Product Portfolio Distribution

2025 REVENUE

Q1 2026 REVENUE

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Camtek's Business Position

First quarter sales 2026 stand it

approximately

$122M

Camtek expects that demand in the field of components for High Performance Computing (HPC) will continue to be Camtek's main growth engine. Today, Camtek is a leading inspection equipment supplier in solutions for this market.

Sales forecast for the second quarter of 2026 stands at approx.

$129M

Camtek maintains its position as a leading manufacturer of inspection systems for advanced packaging and components in the HPC field, accounting for approximately 50% of its sales in the first quarter of 2026. Industry estimates suggest that the annual growth rate in the coming years for HBM and Chiplets components will be double-digit.

Camtek's new products, the Eagle G5 and the Hawk, were developed to meet customer precision and throughput requirements, and it is expected that revenues from these products (which in 2025 accounted for approximately 30% of sales) will double this year compared to last year.

2026 is expected to be another year of growth - the revenue increase is expected mainly in the second half of the year and is estimated at approximately $25\%$ compared to the first half of 2026.

Camtek is developing the field of innovation through significant investments in developing advanced platforms, innovative AI-based algorithms, and breakthrough software capabilities. The acquisition of Visual Layers (in April 2026) is expected to contribute significantly to the depth and pace of Camtek's development.

Camtek - First Quarter Results 2026

Non-GAAP Data (*) Growth rate $\mathcal{A}$ Decline rate $\mathcal{L}$

Priortech - Summary

Access is the leading company in China in the field of advanced substrates, establishing its position as an important player in the production of logic modules for the HPC market for AI applications.

Camtek has established its position as a global leader in the field of component inspection for High Performance Computing (HPC) intended for AI applications, one of the fastest growing and most exciting fields in the world of technology.

The central growth engine of Access is the field of advanced packaging for Power Devices (ECP). These packages are installed in the HPC computers of the world's leading companies, used for running AI applications.

Camtek believes that new packaging technologies, Hybrid bonding and micro copper bumps, will constitute significant growth opportunities for Camtek in the coming years.

Professional Terms

Definitions

(HPC) High Performance Computer

Extremely powerful computers to solve advanced computing problems, based on advanced Chiplet or Heterogeneous Integration packaging that support AI applications and include HBM-type DRAM memories which are 8 layers of Dram chips assembled on top of each other.

(HI) Heterogeneous Integration

Integration of separately manufactured semiconductor components into a higher-level assembly, which, cumulatively, provides improved functionality and enhanced operational characteristics.

Chiplet

A chiplet is a secondary processing unit, usually controlled by an I/O controller located in the same package. The chiplet architecture is a modular approach to building processors. Intel and AMD, the world's leading processor manufacturers, are adopting the chiplet architecture for their current product line.

(HBM) High Bandwidth Memories

High bandwidth memory is a fast computer memory interface for 3D-stacked dynamic memory.

FC-BGA

A ball grid array on a high-density semiconductor packaging substrate, allowing more functions for high-speed LSI chips.

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Professional Terms

Definitions (continued)

ECP Packages

Packages containing Power devices components that are placed on a buried organic substrate, the connection between the components is made by a network of conductors (RDL) in several layers. The package is part of the Advanced Packaging segment and is protected by several registered patents that Access has registered.

RDL

Redistribution layers - a network of thin conductors between 2 to 12 microns that connects the components in several conduction layers.

Via First

This is the basic technology developed at Amitech and implemented at Access since its inception. In this technology, the connection between the different layers is made through pillars that are implemented initially and only then the layer is placed, unlike the standard technology in which the passage holes (Via) are drilled and coated after the placement of the layer.

PMIC

Power management Interconnect - Power Devices components that consume high currents and are in the high scale of prices and qualities.

Pick&place

Technology of placing components on substrates in a very precise manner and with high output.

ASIC

An integrated circuit or chip intended for a unique and specific application, unlike standard integrated circuits for general use. For example, a chip built specifically for a certain mobile phone application or for cryptocurrency computing application is considered an ASIC.

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AI assistant

Priortech Ltd. Investor Presentation 2026

6999_rns_2026-05-27_332b3b87-8204-406d-881a-3510ef1720fa.pdf

PRIORTECH

Capital Market Presentation

Legal Comments

Q1-26 Results

Semiconductor Market Forecast

Description of the Business Status of the Included Companies

Access Business Status

Power Device Components Segment

ASIC Substrates Segment

RF Components Segment

Access - Q1 2026 Results

Product Portfolio Distribution

2025 REVENUE

Q1 2026 REVENUE

Camtek's Business Position

Camtek - First Quarter Results 2026

Priortech - Summary

Professional Terms

Definitions

(HPC) High Performance Computer

(HI) Heterogeneous Integration

(HBM) High Bandwidth Memories

FC-BGA

Professional Terms