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P.C.B. Technologies Ltd. Investor Presentation 2026

May 18, 2026

6971_rns_2026-05-18_3797d740-3b38-4c0a-aab7-e199f9517050.pdf

Investor Presentation

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PCB

PCB TECHNOLOGIES

leading the way

PCB

All-in-One Solutions

Q1 2026

Company Presentation

May 2026

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Forward looking statement

Disclaimer

The information contained herein is a summary only, and does not exhaust all the information about the Company or its operations, nor does it replace a review of the Company's Periodical or Annual Reports, or any other information which is filed and furnished with the Israel Securities Authority.

Material information regarding the Company which is included in this slide presentation has been published to the public in the past as part of the Company's reporting. That said, the information or data presented may be presented in a different manner and/or segmentation from those previously furnished in the Company's Reports.

This presentation does not constitute or form part of any invitation or offer to invest or purchase the Company's securities, and in particular does not constitute an "offer to the public" or "sale to the public" of any kind. This presentation is intended solely for the provision of information included in it, and does not constitute a recommendation, or an opinion, or a substitute for the judgment of an investor for any kind of decision. Furthermore, it does not pretend to include all the information that may be relevant for the purpose of making any decision regarding the investment in the Company's securities or in general.

This presentation may include forward-looking information as defined in the Securities Law, 1968, including forecasts, goals, business strategy, evaluations and estimates, regarding both the Company's activities and the markets in which it operates, as well as any other information, in any form in which it is presented, that relates to future events or matters, the realization of which is uncertain and is not under the Company's control.

Any forward-looking information is based on current estimates and assumptions, among others, by the Company's management, which, although Company believes are reasonable, are inherently uncertain and are partially based on subjective estimates. The realization or non-realization of the forward-looking information will be affected and depended on a variety of factors including the risk factors which are inherent to the Company's activity, third party decisions, including regulatory authorities and engagements with third parties, as well as by developments in the economic environment and the external factors which impact the Company's activity, which cannot be assessed in advance and are out of the Company's control. Actual results and achievements of the Company in the future may be materially different from those presented in the forward-looking information presented in this presentation.

The Company does not undertake to update or change such a forecast or estimate in order to reflect events and/or reasons that will apply after the date of this presentation and does not undertake to update this presentation.

© 2025. All rights reserved. PCB Technologies Ltd.
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Management Organization Chart

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Oved Shapira
CEO

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Tomer Dvash
CFO & Deputy CEO

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Yaniv Maydar
VP R&D and Innovation, GM INPACK

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Yossi Ohayon
VP Head of Circuits Division

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Nir Marko
VP Head of Assembly Division

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Michael Digerman
VP Supply Chain & Trade

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Tali Pedhazur-Zuri
VP HR

C

© 2025. All rights reserved. PCB Technologies Ltd.


PCB TECHNOLOGIES At a Glance

Providing All-in-One, Cutting-Edge Hardware Electronics Technology

Legacy

Since 1981
HQ is in Israel
789 Employees

Performance

$((Q1 - 24 > Q1 - 26)$
TTM Revenue - 186.8 M$
CAGR Sales TTM : 16.9%
CAGR GP TTM : 46%
CAGR EBITDA TTM : 62%

Diversified Customer Base (2025)

59% Defense and Aerospace
16% Industrial Instruments
25% Medical

Innovation

Strong R&D and Engineering Team
New Products - 25% of Total Revenue
+100 Customers Programs

Value Proposition

One Site, All-in-One Solution:
Bridging PCB Fabrication,
IC Packaging and Final
Product Integration

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© 2025. All rights reserved. PCB Technologies Ltd.


CAGR 2020-2025

P&L Financial Results 2020-2025

Sales 9.04%

GP 22.4%

EBITDA: 37.2%

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© 2025. All rights reserved. PCB Technologies Ltd.


Revenue Mix by Segment

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© 2025. All rights reserved. PCB Technologies Ltd.


Volume, Mix and Operational Excellence

Over the last five years, volume has grown superbly, while overhead costs have remained stable to moderate.

Mix improvement derived from the demand for technology and solutions results in better direct contribution margins.

Operational excellence driven scrap reduction and throughput improvement.

© 2025. All rights reserved. PCB Technologies Ltd.


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Technology

Customer Needs

  • Miniaturization & ULTRA HDI (Substrate)
  • Heat dissipation & thermal management
  • High-precision & multi-layer registration
  • System integration & ODM solution

Our Investments (Last 5 Years)

Significant CAPEX investments 43M$
Increased R&D spending 7.5M$
Expansion of engineering headcount
Launch of INPACK's advanced packaging division.

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TM

External and buried Heat Sinks, Heavy Copper and High-End thermal conductivity materials

Sequential Lamination

Up to 5 lamination cycles for increased density

RIGID FLEX

Mixed material build-up / Book-binde

RIGID

From standard to extreme complexity blind, buried, stacked, back-drill, and more...

HDI

Allowing ambitious miniaturization by producing the most dense and accurate lines, spaces and laser drilled interconnects

FLEX

HDI / thin boards / various configurations

© 2025. All rights reserved. PCB Technologies Ltd.


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© 2025. All rights reserved. PCB Technologies Ltd.
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All-in-One Solution

What's in it for us?

  • Maximize profit potential on every technology vertical
  • Customer's project time to market value
  • One-stop shop captivate
  • Generate revenue from NRE to mass production

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Assembly and final product
Organic Substrates
PCB Printed Circuit Board

Advanced IC Packaging


Growth Potential, International TAM

Our current annual sales are about 1% of the TAM in the US and the EU

Company Share from 2025 Revenue US+EU Total *EMS Market Size 2024 (B$) PCB & Substrate Market Siz (B$) IC Packaging Market Size (B$) Assembly & Final Product Market Size (B$) Company Addressable Market 2024 (B$) Segment CAGR % (2025-2030)
Aerospace & Defense 59% 45 5 2 38 7.2 6.1%--8.5%
Medical Technologies 25% 32 3 2 27 3.7 5.8%--6.1%
Industrial Instruments 16% 41 4 2 35 4.7 5.6%--6.3%
Total 118 12 6 100 15.6

*Electronic Manufacturing Services

Sources: Mordor Intelligence, K.B.V Research

© 2025. All rights reserved. PCB Technologies Ltd.


Key Business Highlights

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Sales Trend K$ (TTM)

Sales CAGR Q1-24>>Q1-26: 16.9%

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Consistent Growth in Sales

Financial Overview

© 2025. All rights reserved. PCB Technologies Ltd.


Consolidate EBITDA & GP Trends K$

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CAGR GP TTM Q1-24>>Q1-26: 46%
CAGR EBITDA TTM Q1-24>>Q1-26: 62%

Financial Overview

© 2025. All rights reserved. PCB Technologies Ltd.


Backlog & Long Term Agreements (LTA) M$

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Information presented in this chart is based on dates adjacent to the release of the financial statements

Financial Overview

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© 2025. All rights reserved. PCB Technologies Ltd.
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What we are going to do in the next years...

Capacity and efficiency Capitalize on our process IP Materialize the growth opportunity of international TAM.
New plating line – PCB Substrate with ULTRA HDI and more... Establish local operation and commercial team in the US and EU.
Automation – PCB / Assembly / INPACK SIP and MCM Support our PRIME customers’ success- FMF and offset.
Increase in house capabilities Increase from ODM services Diversify Our customer portfolio.

PCB TECHNOLOGIES leading the way

Thank you

© 2025. All rights reserved. PCB Technologies Ltd.