==> picture [721 x 143] intentionally omitted <==

----- Start of picture text -----

1
----- End of picture text -----

Elite Material Co., Ltd. Global leader of eco-friendly laminates

Presentation May, 2021

Disclaimer

This presentation may contain “forward-looking statements” which may include projections on future results of operations, financial condition, and business prospects based on our own information and other sources.

The actual results of operations, financial condition, and business prospects may differ from those explicitly or implicitly indicated in those forward-looking statements for a variety of reasons, including but not limited to market demand, price fluctuations, competition, supply chain issues, global economic conditions, exchange rate fluctuation and other risks and factors beyond EMC’s controls. The forward-looking statements in this presentation, if any, only reflect the current view of EMC as of the date of its release. EMC undertakes no obligation to update those forward-looking statements for events or circumstances that occur subsequently.

Page 2

Content

▪ Industry outlook ▪ Financial performance ▪ Appendix

Page 3

PCB design of networking infrastructure is migrating

Trend 1: Halogen-free. HF laminates are preferred or required.

New platforms of PCIe 4 include, but are not limited to, Intel’s Whitely, request only halogen-free laminates.

Trend 2: HDI. AI semiconductors, GPUs and CPUs, and heterogeneous integration of semiconductors increase pin counts substantially.

Fine line/pitch HDI architecture design by PCB constructors becomes common.

Trend 3: The manufacturing technique of HDI becomes the must handicraft art of high-end networking board.
Decades of experiences and knowledge EMC accumulated in HF and HDI now a competitive advantage unrivalled by peers.

Multi-GPUs make a super high speed computing AI Server

Source: nVidia

Page 4

Trend of 5G infrastructure development: HDI, High Speed, High Frequency

==> picture [694 x 388] intentionally omitted <==

----- Start of picture text -----

HDI
High Speed
High Frequency AAU
AiP MIMO [RRU]
Phone-5G BBU
mmWave
Phone-4G
ADAS
Phone-3G
77GHz
AI Server
Switch-800G
26.56 GHz
Server- PCIe5 Infotainment
NB- USB4.0 Switch-400G
16GHz
14GHz
E-Mobility
NB- USB3.0
Switch-100G ECU
Server- PCIe4
12.89GHz
8GHz
Server- PCIe3 Switch-40G
4GHz 5GHz
----- End of picture text -----

Global server shipment is increasing for next 5 years

Unit：k set

Source：DIGITIMES Research，2020/9

The 100/400G switch is becoming the main stream

2017~2023 switch split

Source: IDC, Morgan Stanley Research

The CAGR of 5G Smartphone is 37.9%

==> picture [721 x 401] intentionally omitted <==

----- Start of picture text -----

Unit: Million
----- End of picture text -----

Source: DIGITIMES Research, 2020/9

HDI is a must trend of wide varieties of automotive electronics applications

HDI (High-Density Interconnection) PCB adoption in automotive electronics is set to rise in the next 10 years in step with higher penetration of ADAS (advanced driver assistance systems), infotainment systems and telematic systems.

Sales Revenue

==> picture [721 x 362] intentionally omitted <==

----- Start of picture text -----

NTD ： Billion
30.0
25.0
2003 ： 2.3Bn  2020 ： 27.2Bn
(2003 ~ 2020) 17 years GAGR=15.5%
20.0
15.0
10.0
5.0
0.0
2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020
Revenue
----- End of picture text -----

Operation Performance

==> picture [682 x 365] intentionally omitted <==

----- Start of picture text -----

12.0
11.33
EPS: NTD
10.14
10.0
8.7 8.74
8.0
7.6
6.0
5.48
4.9
4.0
4.30 3.73
2.87 2.7
2.0 2.80
1.52
1.36 1.78
0.53
0.49
0.0
2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020
(1.04)
(2.0)
EPS
----- End of picture text -----

History of Cash dividend and Payout ratio

Page 12

1Q21 P&L summary

Unit: NT$ million

Unit: NT$ million
Revenue Gross profit Operating profit Income before tax Tax expenses Net income EPS (NT$) - basic Gross margin (%) Operating margin (%) Net margin (%)	1Q21 8,004 1,887 1,233 1,224 (259) 965 2.89 23.6% 15.4% 12.1%	4Q20 7,517 1,876 1,203 1,287 (310) 977 2.93 25.0% 16.0% 13.0%	QoQ 6.5% 0.6% 2.5% -4.9% 16.3% -1.3% -1.4%	1Q20 5,909 1,431 951 954 (221) 733 2.29 24.2% 16.1% 12.4%	YoY
					35.4% 31.9% 29.6% 28.4% -17.7% 31.6% 26.2%

Page 13

1Q21 Abstracted Balance Sheet

	Unit:NT$ million Cash & Equivalent A/R+N/R Inv PPE Total Assets	1Q21 Am ount % 6,567 21.5% 10,495 34.3% 4,386 14.3% 6,729 22.0% 30,609 100.0%	4Q20 1Q20 Amount % Am ount % 5,732 20.6% 7,007 27.1% 9,934 35.7% 8,084 31.3% 3,702 13.3% 3,384 13.1% 6,531 23.4% 5,867 22.7% 27,857 100.0% 25,825 100.0% 1,162 4.2% 903 3.5% 5,847 21.0% 5,461 21.1% 564 2.0% 703 2.7% 16,756 60.1% 14,140 54.8% 27,857 100.0% 25,825 100.0%
	Short term Debt A/P Long term Debt	1,696 5.5% 7,018 22.9% 300 1.0%
	Shareholder's Equity	17,633 57.6%
	Total Debt and Equity	30,609 100.0%

Page 14

APPENDIX

Page 15

Company profile- Global Footprint

==> picture [709 x 411] intentionally omitted <==

----- Start of picture text -----

Japan
Kunshan,
UK
China
Korea
Germany
Huangshi,
CA OH China
Taiwan,
France
HQ
Zhongshan,
China
▪ EMC Group Outline
TAIEX listing code: 2383
Established: 1992
Manpower: 3,200+
Capacity: 3.55 KK sheets/ month (CCL)
10.7 KK m/ month (PP)
800 K SF/ month (Mass Lam)
40K panels/ month (MCCCL)
Paid-in capital: USD 96 million
Revenue in 2020: USD 920 million
Production facility
Qualification: ISO-9001, ISO-14001, IATF-16949,
Distributor
ISO-45001, QC080000, AS9100C
and Sony Green Partner Representative office
UL file number: E150504
16
----- End of picture text -----

Manufacturing Locations and Monthly Capacity

EMC (HS) Huangshi CCL: 600k sheets PP: 2.4kk meters Manpower: 500+ +300K SHT/ Month by June, 2022

EMC (KS) Kunshan CCL: 1.35kk sheets PP: 3.3kk meters Manpower: 1,000+ +300K SHT/M in Q3,2022 EMC (TW) Taoyuan CCL: 500k sheets PP: 1.8kk meters Manpower: 600+

EMC (TW) Hsinchu CCL: 150k sheets PP: 1.1kk meters Mass Lam: 800k ft2 Metal Core: 40k pnls Manpower: 300+

EMC (ZS) Zhongshan CCL: 950k sheets PP: 2.1kk meters Manpower: 800+

AI assistant

EMC Investor Presentation 2021

52046_rns_2021-05-13_be86dad0-9acf-4b6e-b80b-b28620d8fb44.pdf

Elite Material Co., Ltd. Global leader of eco-friendly laminates

Disclaimer

Content

▪ Industry outlook ▪ Financial performance ▪ Appendix

PCB design of networking infrastructure is migrating

Multi-GPUs make a super high speed computing AI Server

Trend of 5G infrastructure development: HDI, High Speed, High Frequency

Global server shipment is increasing for next 5 years

The 100/400G switch is becoming the main stream

2017~2023 switch split

The CAGR of 5G Smartphone is 37.9%

HDI is a must trend of wide varieties of automotive electronics applications

Sales Revenue

Operation Performance

History of Cash dividend and Payout ratio

1Q21 P&L summary

Unit: NT$ million

1Q21 Abstracted Balance Sheet

APPENDIX

Company profile- Global Footprint

Manufacturing Locations and Monthly Capacity

AI assistant

EMC — Investor Presentation 2021

52046_rns_2021-05-13_be86dad0-9acf-4b6e-b80b-b28620d8fb44.pdf

Elite Material Co., Ltd. Global leader of eco-friendly laminates

Disclaimer

Content

▪ Industry outlook ▪ Financial performance ▪ Appendix

PCB design of networking infrastructure is migrating

Multi-GPUs make a super high speed computing AI Server

Trend of 5G infrastructure development: HDI, High Speed, High Frequency

Global server shipment is increasing for next 5 years

The 100/400G switch is becoming the main stream

2017~2023 switch split

The CAGR of 5G Smartphone is 37.9%

HDI is a must trend of wide varieties of automotive electronics applications

Sales Revenue

Operation Performance

History of Cash dividend and Payout ratio

1Q21 P&L summary

Unit: NT$ million

1Q21 Abstracted Balance Sheet

APPENDIX

Company profile- Global Footprint

Manufacturing Locations and Monthly Capacity

More from EMC

EMC Investor Presentation 2021