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INVL Technology

Capital/Financing Update • May 5, 2017

2265_iss_2017-05-05_ad5e48e4-bccb-4b0a-a9c1-90b85db52a46.html

Capital/Financing Update

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Disclosure 352097

INVL Technology - Notification on material event

BAIP UAB redeemed bonds from INVL Technology

Vilnius, Lithuania, 2017-05-05 07:11 CEST (GLOBE NEWSWIRE) -- INVL Technology announced that BAIP UAB has redeemed bonds issued on 16 January 2017 in the amount of EUR 1.55 million as of 4 May 2017. AThe person authorized to provide additional information: Kazimieras Tonkūnas INVL Technology Managing Partner e-mail [email protected]

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