TO

TOKYO SEIMITSU CO., LTD.

Manufacturer of semiconductor production equipment and precision measuring instruments for high-tech industries.

7729 | T

Overview

Corporate Details

ISIN(s):
JP3580200008
LEI:
Country:
Japan
Address:
八王子市石川町2968番地2
Sector:
Manufacturing
Industry:
Manufacture of special-purpose machinery

Description

Tokyo Seimitsu Co., Ltd., operating under the brand name ACCRETECH, is a leading manufacturer specializing in two primary business segments: semiconductor production equipment and precision measuring instruments. The company's Semiconductor Manufacturing Equipment division provides a comprehensive suite of production systems for wafer manufacturing, test, assembly, and back-end processing, including probing machines, dicing machines, and CMP systems. The Precision Measuring Instrument division supplies a wide range of metrology solutions, from multi-purpose to in-line measuring systems, guided by the principle 'no measurement, no manufacturing' to support various high-tech industries.

Unlock This Filing & Millions More

You're one step away from the data you need. Create a free account to instantly view this filing and get access to powerful research tools.

Filings

You have of free filing views remaining. Upgrade for unlimited access.
Quick Filters:

Filters

Clear
Bulk Actions:
Date Filing Language Size Actions
2025-11-05 03:11
Interim Report
確認書
Japanese 8.9 KB
2025-11-05 03:10
Interim Report
半期報告書-第103期(2025/04/01-2025/09/30)
Japanese 235.9 KB
2025-06-27 04:00
Post-Annual General Meeting Information
臨時報告書
Japanese 26.3 KB
2025-06-20 09:41
Governance Information
内部統制報告書-第102期(2024/04/01-2025/03/31)
Japanese 24.5 KB
2025-06-20 09:39
Registration Form
確認書
Japanese 8.8 KB
2025-06-20 09:37
Annual Report
有価証券報告書-第102期(2024/04/01-2025/03/31)
Japanese 1.5 MB
2024-11-05 06:13
Interim Report
確認書
Japanese 8.9 KB
2024-11-05 06:08
Interim Report
半期報告書-第102期(2024/04/01-2025/03/31)
Japanese 242.7 KB
2024-09-11 08:00
Registration Form
有価証券届出書(参照方式)
Japanese 136.8 KB
2024-06-26 07:21
Post-Annual General Meeting Information
臨時報告書
Japanese 27.7 KB
2024-06-24 05:05
Governance Information
内部統制報告書-第101期(2023/04/01-2024/03/31)
Japanese 23.7 KB
2024-06-24 05:03
Registration Form
確認書
Japanese 8.8 KB
2024-06-24 05:01
Annual Report
有価証券報告書-第101期(2023/04/01-2024/03/31)
Japanese 1.4 MB
2024-02-06 06:04
Report Publication Announcement
確認書
Japanese 8.9 KB
2024-02-06 06:02
Quarterly Report
四半期報告書-第101期第3四半期(2023/10/01-2023/12/31)
Japanese 188.6 KB

Automate Your Workflow. Get a real-time feed of all TOKYO SEIMITSU CO., LTD. filings delivered via API.

Explore Data Feeds →

Market Data

Market Data Not Available

Financials & KPIs

No data available

Unlock Full Financials for TOKYO SEIMITSU CO., LTD.

This data is available as part of our premium data solutions. Contact our team for access.

Need More History? Access decades of standardized financials for TOKYO SEIMITSU CO., LTD. via our API.

Get Historical Data →

Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

Peer Companies

KOKUSAI ELECTRIC CORPORATION Logo
Global leader in semiconductor equipment for film deposition and treatment processes.
Japan
6525
KOMORI  CORPORATION Logo
Global manufacturer of printing machinery and provider of print-related solutions.
Japan
6349
KOSES Co.,Ltd Logo
Manufactures semiconductor back-end equipment and laser automation systems for global IT industries.
South Korea
089890
KUKA AG Logo
Provides industrial robots and automation systems for manufacturing, logistics, and healthcare.
Germany
KU2
KULICKE & SOFFA INDUSTRIES INC Logo
Provides equipment and tools for semiconductor packaging and electronics assembly solutions.
United States of America
KLIC
Kurita Water Industries Ltd. Logo
Provides integrated water treatment solutions with chemicals, equipment, and services for industry.
Japan
6370
LAM RESEARCH CORP Logo
Supplies wafer fabrication equipment and services to the global semiconductor industry.
United States of America
LRCX
Pioneers laser soldering and reflow equipment for assembling next-generation electronics.
South Korea
412350
Manufactures equipment and automation for the semiconductor and flat-panel display industries.
South Korea
311060
LEWAG Holding AG Logo
Manages firms making glass cutting machinery, logistics systems, and vehicle bodies.
Germany
KGR

Talk to a Data Expert

Have a question? We'll get back to you promptly.