TMH Inc.
Offers equipment services and a digital platform for the semiconductor industry.
280A | T
Overview
Corporate Details
- ISIN(s):
- JP3538740006
- LEI:
- Country:
- Japan
- Address:
- 大分市下郡北三丁目１４番６号 メゾンドール㈼ １号
- Website:
- https://www.tmh-inc.co.jp/en/
- Sector:
- Manufacturing
Description
TMH Inc. provides comprehensive solutions for the semiconductor manufacturing sector, focusing on the sale, repair, and maintenance of equipment and components. The company's offerings are structured around two key pillars: Engineering Power and Platform Digitization. The Engineering Power division delivers services such as equipment parts maintenance, productivity improvement solutions, and extending the operational life of legacy equipment by supplying discontinued parts. The Platform Digitization division operates LAYLA, a B2B international e-commerce site that facilitates the global sourcing of semiconductor parts, and provides inventory sharing solutions for business continuity. By integrating its technical expertise with a digital platform, TMH offers total support for semiconductor factories, strengthening supply chains through enhanced procurement, logistics, and manufacturing services.
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Filings
| Date | Filing | Language | Size | Actions | |
|---|---|---|---|---|---|
| 2025-07-15 09:07 |
確認書
|
Japanese | 8.0 KB | ||
| 2025-07-15 09:06 |
半期報告書－第14期(2024/12/01－2025/11/30)
|
Japanese | 185.5 KB | ||
| 2025-06-13 08:54 |
臨時報告書
|
Japanese | 19.1 KB | ||
| 2025-02-28 06:00 |
有価証券報告書－第13期(2023/12/01－2024/11/30)
|
Japanese | 1.3 MB | ||
| 2025-01-14 08:30 |
臨時報告書
|
Japanese | 18.7 KB | ||
| 2024-11-26 07:30 |
訂正有価証券届出書（新規公開時）
|
Japanese | 2.2 MB | ||
| 2024-11-18 03:00 |
訂正有価証券届出書（新規公開時）
|
Japanese | 2.2 MB | ||
| 2024-10-31 07:00 |
有価証券届出書（新規公開時）
|
Japanese | 4.3 MB |
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Market Data
Market Data Not Available
Financials & KPIs
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
Peer Companies
