TAZMO CO.,LTD Logo

TAZMO CO.,LTD

Manufactures advanced equipment for semiconductor & FPD production, including coaters and robots.

6266 | T

Overview

Corporate Details

ISIN(s):
N/A
LEI:
Country:
Japan
Address:
岡山市北区芳賀5311
Sector:
Manufacturing
Industry:
Manufacture of special-purpose machinery

Description

TAZMO CO., LTD. is a manufacturer of advanced production equipment for the semiconductor and flat-panel display (FPD) industries. The company's product portfolio includes a wide range of semiconductor manufacturing systems, such as coaters, developers, bonding/debonding systems, cleaning systems, and chemical distribution solutions. In the FPD sector, TAZMO is a notable market participant with its slit coaters for LCD color filter resist. The company also develops and manufactures high-precision clean transfer equipment, including wafer transfer robots recognized for their operational stability and reliability. Additionally, TAZMO provides comprehensive nanoimprint solutions and operates a precision molding division that produces dies and plastic components through an integrated design-to-manufacture process.

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Date Filing Language Size Actions
2025-08-08 08:45
Report Publication Announcement
確認書
Japanese 8.0 KB
2025-08-08 08:44
Interim Report
半期報告書-第54期(2025/01/01-2025/12/31)
Japanese 467.9 KB
2025-05-01 02:24
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 22.5 KB
2025-05-01 02:24
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 23.7 KB
2025-03-27 07:37
Post-Annual General Meeting Information
臨時報告書
Japanese 22.6 KB
2025-03-27 07:37
Registration Form
確認書
Japanese 8.0 KB
2025-03-27 07:36
Governance Information
内部統制報告書-第53期(2024/01/01-2024/12/31)
Japanese 21.8 KB
2025-03-27 07:34
Annual Report
有価証券報告書-第53期(2024/01/01-2024/12/31)
Japanese 1.2 MB
2024-08-09 09:36
Interim Report
半期報告書-第53期(2024/01/01-2024/12/31)
Japanese 477.9 KB
2024-08-09 09:36
Regulatory News Service
確認書
Japanese 8.0 KB
2024-05-14 08:35
Report Publication Announcement
確認書
Japanese 8.0 KB
2024-05-14 08:34
Quarterly Report
四半期報告書-第53期第1四半期(2024/01/01-2024/03/31)
Japanese 444.0 KB
2024-03-29 05:30
Post-Annual General Meeting Information
臨時報告書
Japanese 23.6 KB
2024-03-28 07:37
Governance Information
内部統制報告書-第52期(2023/01/01-2023/12/31)
Japanese 21.6 KB
2024-03-28 07:36
Annual Report
有価証券報告書-第52期(2023/01/01-2023/12/31)
Japanese 1.3 MB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

Peer Companies

Company Country Ticker View
Andritz AG Logo
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Develops core equipment for display and semiconductor manufacturing using laser & heat technology.
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Manufactures high-purity fluid/gas delivery parts for semiconductor & display manufacturing.
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Global supplier of thin-film deposition equipment for leading semiconductor manufacturers.
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ASML Holding N.V. Logo
Builds advanced lithography systems used by chipmakers to mass-produce smaller, faster chips.
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A-Tech Solution CO., LTD. Logo
Manufacturing precision molds, dies, and optical parts for auto and electronics industries.
South Korea 071670
Aumann AG Logo
Builds automated production lines for e-mobility, automotive, and industrial sectors.
Germany AAG
AUROS TECHNOLOGY, INC. Logo
Provides advanced overlay metrology & inspection systems for semiconductor manufacturing.
South Korea 322310
Avrot Industries Ltd. Logo Israel AVRT
BE Semiconductor Industries N.V. Logo
Develops advanced assembly equipment for leading-edge semiconductor packaging applications.
Netherlands BESI

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