KOKUSAI ELECTRIC CORPORATION Logo

KOKUSAI ELECTRIC CORPORATION

Global leader in semiconductor equipment for film deposition and treatment processes.

6525 | T

Overview

Corporate Details

ISIN(s):
N/A
LEI:
Country:
Japan
Address:
東京都千代田区神田鍛冶町三丁目4番地oak神田鍛冶町ビル5階
Sector:
Manufacturing
Industry:
Manufacture of special-purpose machinery

Description

KOKUSAI ELECTRIC CORPORATION is a specialized manufacturer of semiconductor production equipment, playing a pivotal role in the evolution of advanced semiconductor devices. The company's core business centers on the development, manufacturing, sales, installation, and maintenance of systems for critical film deposition and treatment processes. These processes are fundamental to enhancing semiconductor device performance and film properties. Leveraging world-class technology, KOKUSAI ELECTRIC's product portfolio, which includes high-productivity batch processing systems, commands a significant global market share in its specialized fields.

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Filings

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Date Filing Language Size Actions
2025-07-14 09:10
Registration Form
訂正有価証券届出書(参照方式)
Japanese 78.0 KB
2025-07-14 09:05
Major Shareholding Notification
臨時報告書
Japanese 22.2 KB
2025-06-30 07:37
Registration Form
訂正有価証券届出書(参照方式)
Japanese 76.6 KB
2025-06-30 07:35
Post-Annual General Meeting Information
臨時報告書
Japanese 23.8 KB
2025-06-26 09:02
Regulatory News Service
訂正有価証券届出書(参照方式)
Japanese 79.0 KB
2025-06-26 09:01
Regulatory News Service
確認書
Japanese 8.2 KB
2025-06-26 09:01
Regulatory News Service
内部統制報告書-第10期(2024/04/01-2025/03/31)
Japanese 24.3 KB
2025-06-26 09:00
Annual Report
有価証券報告書-第10期(2024/04/01-2025/03/31)
Japanese 2.0 MB
2025-05-21 08:53
Registration Form
有価証券届出書(参照方式)
Japanese 116.9 KB
2025-05-21 08:53
Registration Form
有価証券届出書(参照方式)
Japanese 83.7 KB
2025-05-21 08:35
Remuneration Information
臨時報告書
Japanese 28.4 KB
2025-02-10 06:35
Board/Management Information
臨時報告書
Japanese 20.9 KB
2024-11-11 08:00
Report Publication Announcement
確認書
Japanese 8.1 KB
2024-11-11 08:00
Interim Report
半期報告書-第10期(2024/04/01-2025/03/31)
Japanese 221.0 KB
2024-10-09 08:02
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 24.0 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

Peer Companies

Company Country Ticker View
FUJI CORPORATION Logo
Manufactures robotic SMT mounters and CNC lathes for electronics, auto, medical, and aerospace.
Japan 6134
FUJI CORPORATION LIMITED Logo
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South Korea 370090
GENERAL PACKER CO., LTD. Logo
Develops rotary automatic packaging machines for bagging and pouching dry and powdered products.
Japan 6267
Genesem Inc. Logo
Global manufacturer of automated equipment for the semiconductor back-end process.
South Korea 217190
Develops automated optical inspection & repair systems for IC substrates and PCBs.
South Korea 420770
G.I.Tech Co.,Ltd. Logo
Manufactures ultra-precision slot dies & nozzles for the roll-to-roll manufacturing industry.
South Korea 382480
Glaston Oyj Abp Logo
Provides glass processing machinery and services for architectural, auto, and solar industries.
Finland GLA1V
GlobalStandardTechnologyCo.,Ltd. Logo
Manufactures exhaust & thermal systems like scrubbers & chillers for semiconductor/display industries.
South Korea 083450

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