Hosiden Corporation
Manufacturer of electronic components like connectors, sensors, and wireless modules.
6804 | T
Overview
Corporate Details
- ISIN(s):
- JP3845800006
- LEI:
- Country:
- Japan
- Address:
- 八尾市北久宝寺１丁目４番３３号
- Website:
- https://www.hosiden.com/en/
- Sector:
- Manufacturing
Description
Hosiden Corporation is a comprehensive manufacturer of electronic components that provides one-stop ODM, OEM, and EMS solutions. The company's core product offerings are categorized into connecting components, such as connectors and switches; transducers, including microphones, speakers, and touch sensors; and wireless products like Bluetooth® modules. These components are integral to a wide range of applications, serving key markets including automotive, IoT, home and mobile electronics, and audio/visual equipment. Hosiden focuses on developing and supplying parts that enhance the safety, functionality, and connectivity of modern electronic devices.
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Filings
| Date | Filing | Language | Type / Size | Actions | |
|---|---|---|---|---|---|
| 2017-06-29 04:17 |
有価証券報告書－第67期(2016/04/01－2017/03/31)
|
Japanese | ZIP • 778.6 KB | ||
| 2017-02-13 05:17 |
四半期報告書－第67期第3四半期(2016/10/01－2016/12/31)
|
Japanese | ZIP • 169.3 KB | ||
| 2017-02-10 01:17 |
訂正四半期報告書－第66期第3四半期(2015/10/01－2015/12/31)
|
Japanese | ZIP • 136.0 KB | ||
| 2016-11-14 03:21 |
四半期報告書－第67期第2四半期(2016/07/01－2016/09/30)
|
Japanese | ZIP • 178.1 KB | ||
| 2016-08-09 03:08 |
四半期報告書－第67期第1四半期(2016/04/01－2016/06/30)
|
Japanese | ZIP • 159.4 KB | ||
| 2016-06-29 03:29 |
有価証券報告書－第66期(2015/04/01－2016/03/31)
|
Japanese | ZIP • 791.6 KB | ||
| 2016-02-12 05:11 |
四半期報告書－第66期第3四半期(2015/10/01－2015/12/31)
|
Japanese | ZIP • 169.9 KB | ||
| 2015-11-12 02:28 |
四半期報告書－第66期第2四半期(2015/07/01－2015/09/30)
|
Japanese | ZIP • 179.3 KB |
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Market Data
Market Data Not Available
Financials & KPIs
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
Peer Companies
