Hosiden Corporation
Manufacturer of electronic components like connectors, sensors, and wireless modules.
6804 | T
Overview
Corporate Details
- ISIN(s):
- JP3845800006
- LEI:
- Country:
- Japan
- Address:
- 八尾市北久宝寺１丁目４番３３号
- Website:
- https://www.hosiden.com/en/
- Sector:
- Manufacturing
Description
Hosiden Corporation is a comprehensive manufacturer of electronic components that provides one-stop ODM, OEM, and EMS solutions. The company's core product offerings are categorized into connecting components, such as connectors and switches; transducers, including microphones, speakers, and touch sensors; and wireless products like Bluetooth® modules. These components are integral to a wide range of applications, serving key markets including automotive, IoT, home and mobile electronics, and audio/visual equipment. Hosiden focuses on developing and supplying parts that enhance the safety, functionality, and connectivity of modern electronic devices.
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Filings
| Date | Filing | Language | Type / Size | Actions | |
|---|---|---|---|---|---|
| 2021-02-10 01:54 |
四半期報告書－第71期第3四半期(令和2年10月1日－令和2年12月31日)
|
Japanese | ZIP • 191.7 KB | ||
| 2020-11-12 01:24 |
四半期報告書－第71期第2四半期(令和2年7月1日－令和2年9月30日)
|
Japanese | ZIP • 190.7 KB | ||
| 2020-08-07 09:07 |
四半期報告書－第71期第1四半期(令和2年4月1日－令和2年6月30日)
|
Japanese | ZIP • 166.1 KB | ||
| 2020-06-26 03:23 |
有価証券報告書－第70期(平成31年4月1日－令和2年3月31日)
|
Japanese | ZIP • 947.5 KB | ||
| 2020-02-13 01:45 |
四半期報告書－第70期第3四半期(令和1年10月1日－令和1年12月31日)
|
Japanese | ZIP • 167.4 KB | ||
| 2019-11-13 01:11 |
四半期報告書－第70期第2四半期(2019/07/01－2019/09/30)
|
Japanese | ZIP • 177.1 KB | ||
| 2019-08-13 02:50 |
四半期報告書－第70期第1四半期(2019/04/01－2019/06/30)
|
Japanese | ZIP • 160.0 KB | ||
| 2019-06-27 03:31 |
有価証券報告書－第69期(平成30年4月1日－平成31年3月31日)
|
Japanese | ZIP • 929.7 KB | ||
| 2019-02-13 01:22 |
四半期報告書－第69期第3四半期(2018/10/01－2018/12/31)
|
Japanese | ZIP • 167.3 KB | ||
| 2018-11-13 02:26 |
四半期報告書－第69期第2四半期(2018/07/01－2018/09/30)
|
Japanese | ZIP • 176.2 KB | ||
| 2018-08-10 03:52 |
四半期報告書－第69期第1四半期(2018/04/01－2018/06/30)
|
Japanese | ZIP • 159.2 KB | ||
| 2018-06-28 03:34 |
有価証券報告書－第68期(平成29年4月1日－平成30年3月31日)
|
Japanese | ZIP • 800.3 KB | ||
| 2018-02-13 02:17 |
四半期報告書－第68期第3四半期(2017/10/01－2017/12/31)
|
Japanese | ZIP • 165.4 KB | ||
| 2017-11-13 02:36 |
四半期報告書－第68期第2四半期(2017/07/01－2017/09/30)
|
Japanese | ZIP • 193.7 KB | ||
| 2017-08-10 03:43 |
四半期報告書－第68期第1四半期(2017/04/01－2017/06/30)
|
Japanese | ZIP • 155.0 KB |
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Market Data
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Financials & KPIs
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
Peer Companies
