BE Semiconductor Industries N.V. Logo

BE Semiconductor Industries N.V.

Develops advanced assembly equipment for leading-edge semiconductor packaging applications.

BESI | AS

Overview

Corporate Details

ISIN(s):
NL0012866412 (+1 more)
LEI:
7245007A1YFLI2GNYX06
Country:
Netherlands
Address:
Ratio 6, 6921RW Duiven
Sector:
Manufacturing
Industry:
Manufacture of special-purpose machinery

Description

BE Semiconductor Industries N.V. (Besi) is a leading global supplier of semiconductor assembly equipment for the semiconductor and electronics industries. Founded in 1995, the company develops, manufactures, and services advanced assembly processes and equipment. Besi specializes in leading-edge packaging applications, including leadframe, substrate, and wafer-level packaging. Its solutions serve a wide range of end-user markets such as electronics, mobile internet, cloud servers, computing, automotive, industrial, and LED.

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Filings

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Date Filing Language Size Actions
2025-08-07 06:27
Transaction in Own Shares
BE Semiconductor Industries N.V. Announces Transactions Under Share Repurchase …
English 83.8 KB
2025-07-31 06:18
Transaction in Own Shares
BE Semiconductor Industries N.V. Announces Transactions Under Share Repurchase …
English 96.4 KB
2025-07-24 14:25
Annual / Quarterly Financial Statement
BE Semiconductor Industries N.V., Halfjaarlijkse financiële verslaggeving
English 621.7 KB
2025-07-24 08:14
Earnings Release
BE Semiconductor Industries N.V. Announces Q2-25 Results
English 307.6 KB
2025-07-22 07:14
Transaction in Own Shares
BE Semiconductor Industries N.V. Announces Transactions Under Share Repurchase …
English 95.0 KB
2025-07-17 06:40
Report Publication Announcement
BE Semiconductor Industries N.V. Announces 2025 Second Quarter Conference Call …
English 80.6 KB
2025-07-11 07:32
Transaction in Own Shares
BE Semiconductor Industries N.V. Announces Transactions Under Share Repurchase …
English 92.1 KB
2025-07-03 06:24
Transaction in Own Shares
BE Semiconductor Industries N.V. Announces Transactions Under Share Repurchase …
English 83.8 KB
2025-06-26 06:22
Transaction in Own Shares
BE Semiconductor Industries N.V. Announces Transactions Under Share Repurchase …
English 97.4 KB
2025-06-17 07:48
Transaction in Own Shares
BE Semiconductor Industries N.V. Announces Transactions Under Share Repurchase …
English 84.8 KB
2025-06-12 07:53
Regulatory News Service
BE Semiconductor Industries N.V. Increases Financial Targets at 2025 Investor D…
English 168.0 KB
2025-06-06 07:56
Transaction in Own Shares
BE Semiconductor Industries N.V. Announces Transactions Under Share Repurchase …
English 84.3 KB
2025-05-29 08:33
Transaction in Own Shares
BE Semiconductor Industries N.V. Announces Transactions Under Share Repurchase …
English 83.4 KB
2025-05-05 08:20
Earnings Release
BE Semiconductor Industries N.V. Announces TCB Next Orders
English 108.0 KB
2025-05-01 06:29
Transaction in Own Shares
BE Semiconductor Industries N.V. Announces Transactions Under Share Repurchase …
English 84.6 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
2023-05-10 R.W. Blickman Non-Executive member Sell 100,000 8,524,000.00 EUR
2023-04-26 R.W. Blickman Non-Executive member Other 125,261 N/A
2023-02-23 R.W. Blickman Non-Executive member Sell 100,000 7,560,000.00 EUR
2022-04-29 R.W. Blickman Non-Executive member Other 111,109 N/A
2022-02-18 R.W. Blickman Non-Executive member Sell 100,000 7,848,000.00 EUR
2021-10-27 R.W. Blickman Non-Executive member Sell 100,000 7,416,000.00 EUR
2021-07-27 R.W. Blickman Non-Executive member Sell 100,000 7,202,000.00 EUR
2021-05-25 R.W. Blickman Non-Executive member Sell 100,000 6,490,000.00 EUR
2021-04-30 R.W. Blickman Non-Executive member Other 118,026 N/A
2021-02-19 R.W. Blickman Non-Executive member Sell 100,000 6,451,000.00 EUR

Peer Companies

Company Country Ticker View
FUJI CORPORATION LIMITED Logo
Develops robotic automation, SMT assembly machines & CNC lathes for precision manufacturing.
Japan 8860
FUJI JAPAN CO. LTD. Logo
Manufactures robotic SMT equipment & CNC lathes for electronics and automotive industries.
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Furonteer Inc. Logo
High-precision automation for ADAS & autonomous vehicle camera assembly and inspection.
South Korea 370090
GENERAL PACKER CO., LTD. Logo
Develops rotary automatic packaging machines for bagging and pouching dry and powdered products.
Japan 6267
Genesem Inc. Logo
Global manufacturer of automated equipment for the semiconductor back-end process.
South Korea 217190
Develops automated optical inspection & repair systems for IC substrates and PCBs.
South Korea 420770
G.I.Tech Co.,Ltd. Logo
Manufactures ultra-precision slot dies & nozzles for the roll-to-roll manufacturing industry.
South Korea 382480
Glaston Oyj Abp Logo
Provides glass processing machinery and services for architectural, auto, and solar industries.
Finland GLA1V
GlobalStandardTechnologyCo.,Ltd. Logo
Manufactures exhaust & thermal systems like scrubbers & chillers for semiconductor/display industries.
South Korea 083450
Automates cash management with secure handling systems for financial and retail businesses.
Japan 6457

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