Dividend Policy

HIRAKAWA HEWTECH CORP. - Filing #7245691

Concept	As at 2022-06-29	As at 2022-06-29
Dividend policy
Dividends of surplus
Date of resolution	2022-05-20	2021-11-02
Resolution	取締役会決議	取締役会決議
Total amount of dividends	189,000,000 JPY	189,000,000 JPY
Dividend per share	13.5	13.5