Dividend Policy

HIRAKAWA HEWTECH CORP. - Filing #7245531

Concept	As at 2021-06-29	As at 2021-06-29
Dividend policy
Dividends of surplus
Date of resolution	2020-11-02	2021-05-20
Resolution	取締役会決議	取締役会決議
Total amount of dividends	168,000,000 JPY	182,000,000 JPY
Dividend per share	12.0	13.0