XTPL S.A.

Regulatory Filings • Oct 8, 2021

Title: Filing a patent application for the development of a conductivemesh printing method with the possibility of transferring the mesh ontoother substrates

Legal basis: Article 17(1) MAR - inside information

The Management Board of XTPL S.A. ("Issuer", "Company", "XTPL") herebyannounces that on 8 October 2021, the Issuer filed a patent applicationwith the United States Patent and Trademark Office (USPTO) relating tothe XTPL-developed technological solution ("Method") for printingconductive mesh and transferring it onto other substrates.

The Method described in the application concerns the printing ofconductive mesh on a particular substrate from which it can betransferred onto another substrate. Currently, XTPL's solution fortransferring the printed mesh from one substrate to another is unique inthe world and so far unattainable by any available method. Built oflongitudinal and transverse lines that conduct electricity, theconductive mesh is used to create transparent conductive layers, whichdo not absorb light while conducting electricity and can be used aselectrodes, e.g. in OLED displays.

The invention affords considerable freedom in designing devices thatincorporate conductive mesh. For example, it will be possible to printconductive mesh on a glass substrate, and then transfer it onto aflexible substrate. This Method will simplify the current process ofindustrial production of microelectronic devices that use conductivemesh.

Obtaining patent protection in this area will allow the Issuer toincrease its competitive edge by optimizing the electrical parameters ofthe mesh without substrate-related limitations.

The Issuer's Management Board has decided that the submission of thesaid patent application is inside information, as in the case of anentity operating in the deep-tech sector, effective protection by theCompany of its intellectual and industrial property, a factor whichinfluences the Company value, is one of the elements that investors maytake into account when making decisions about the Issuer's financialinstruments.

In the opinion of the Company's Management Board, ensuring anappropriate level of security and extensive patent protection (both inthe form of obtained patents and submitted patent applications) is asignificant competitive advantage for the Issuer and may contribute toensuring an appropriate bargaining position when negotiating commercialcontracts.

Accordingly, in the Management Board's opinion, the information onsubmission of the patent application meets the criteria of insideinformation within the meaning of Article 7(1) MAR.