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WT — Investor Presentation 2022
Mar 8, 2022
52269_rns_2022-03-08_de86f21b-1595-47e6-b08c-d158085ef72f.pdf
Investor Presentation
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推動更智慧便捷的世界
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2022年3月
免責聲明
By attending the meeting where this presentation is made, or by reading the presentation materials, you agree to be bound by the following limitations:
The information in this presentation has been prepared by WT Microelectronics Co., Ltd. (the “Company”) for use at a non-deal road show presentation by the Company and does not constitute a recommendation regarding the securities of the Company.
This presentation does not constitute a prospectus, a statement in lieu of prospectus, offering circular or offering memorandum, private placement offer letter, an advertisement, and should not be construed as an offer, or a solicitation of any offer, or invitation of any offer to purchase, subscribe for or sell any securities of the Company in any jurisdiction. This presentation should not be considered as a recommendation that any investor should subscribe for or purchase any securities of the Company nor shall it or any part of it or the fact of its distribution form the basis of, or be relied on in connection with, any contract or commitment. This presentation is for general information purposes only, without regard to any specific objectives, financial situations or informational needs of any particular person. This presentation should not be used as a basis for any investment decision or be relied upon in connection with, any contract, commitment or investment decision whatsoever. This presentation does not constitute financial, legal, tax or other product advice. You will be solely responsible for your own assessment of the market and the market position of the Company and you will conduct your own analysis and be solely responsible for forming your own view of the potential future performance of the business of the Company. It should be understood that subsequent developments may affect information contained in this presentation, which neither the Company, nor its affiliates, advisors or representatives are under an obligation to confirm.
No representation or warranty, express or implied, is made as to, and no reliance should be placed on, the fairness, accuracy, completeness or correctness of the information or the opinions contained herein. Neither the Company nor any of the Company’s advisors or representatives shall have any responsibility or liability whatsoever (for negligence or otherwise) for any loss howsoever arising from any use of this presentation or its contents or otherwise arising in connection with this presentation. The information set out herein may be subject to updating, completion, revision, verification and amendment and such information may change materially.
This presentation is based on the economic, regulatory, market and other conditions as in effect on the date hereof. It should be understood that subsequent developments may affect the information contained in this presentation, which neither the Company nor its advisors or representatives are under an obligation to update, revise or affirm.
The information communicated in this presentation contains certain statements that are or may be forward-looking. These statements typically contain words such as “will,” “expects” and “anticipates” and words of similar import. By their nature forward-looking statements involve risk and uncertainty because they relate to events and depend on circumstances that will occur in the future. Any investment in the Company will also involve certain risks. There may be additional material risks that are currently not considered to be material or of which the Company and its advisors or representatives are unaware. Accordingly, you should not rely on these forward-looking statements. The Company assumes no responsibility to update forward-looking statements or to adapt them to future events or developments.
This presentation is not an offer of securities for sale in the United States. Any securities referred to herein have not been and will not be registered under the United States Securities Act of 1933, as amended (the “Securities Act”) or any United States state securities laws, and may not be offered or sold in the United States except pursuant to an exemption from, or in a transaction not subject to, the registration requirements of the Securities Act and in accordance with any applicable United States state securities laws. There is no intention to register any securities referred to herein in the United States or to make a public offering of the securities in the United States.
This presentation and the information contained herein is being furnished to you solely for your information and may not be reproduced or redistributed by you to any other person, in whole or in part. Neither the information contained herein nor any copy hereof may be, directly or indirectly, transmitted into or distributed in the U.S. or to any U.S. person (as defined in Regulation S under the Securities Act), including their U.S. branches or affiliates, except (i) to “qualified institutional buyers” as defined under Rule 144A of the Securities Act (“U.S. QIBs”) or (ii) in compliance with applicable securities laws, or transmitted into or distributed in jurisdiction which prohibits such transmission or distribution. Any failure to comply with this restriction may constitute a violation of the securities laws of the United States or other jurisdictions. No money, securities or other consideration is being solicited, and, if sent in response to this presentation or the information contained herein, will not be accepted.
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文曄科技簡介:
卓越的半導體元件通路商
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公司理念
以專業的服務幫助合作夥伴取得成功 並兼顧所有股東的權益
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1
營運亮點
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第2名
亞太區排名[(][1][,][2][)]
7.6%
全球市佔率[(][1][,][2][ )]
新台幣4,480億元 2021年營業收入
50,000+
元件種類數
第4名
全球排名[(][1][,][2][)]
3.7%
過去5年之市佔率之成⾧[(][1][,][2][)] 為同業中最快[(][3][)]
2.3x
相對市場增速[(][4][)]
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80
代理原廠數
8,000+ 客戶數
~2,500
亞洲員工數
~290億
晶片年出貨量
45 營運據點
註:圖表由文曄科技編製。本簡報中所有歸屬 Gartner 的陳述均表示對 Gartner, Inc. 作為聯合訂閱服務的㇐部分發布的數據、研究意見或觀點的解釋,不應被視為事實陳述。每個 Gartner 出版物均以其原 始發布日期為準(而不是本簡報的日期),表達的觀點如有更改,恕不另行通知。(1) 按收入排名。(2) 截至2022年3月的數據。來源: Gartner Market Share: Semiconductor Distributors, Worldwide, 2021。 (3) 以全球4大半導體通路商Arrow、Avnet、大聯大和文曄科技為基準。(4) 根據公司年報,公司之2016年至2021年均複合年增⾧率為25.5%;而根據 Gartner截至2021年12月的數據,2016年至2021年全球 半導體業之複合年增⾧率為11.0%。來源: Gartner Semiconductor Forecast Database, Worldwide, 4Q21 Update。
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2
文曄科技發展歷程
強勁的有機增⾧
, 2016年至2021年之營業收入複合年增⾧率達25.5% 超越整體產業成⾧速度
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全球排名 亞太地區
股票上市 第4名 [(1)] 排名第2名 [(1)]
QCE Limited
of Solomon
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成功的策略併購
過去15年的成功併購帶來11億美元的淨收入
註: (1) 截至2022年3月之數據並按收入排名。圖表由文曄科技編製。來源: Gartner Market Share: Semiconductor Distributors, Worldwide, 2021。本簡報中所有歸屬 Gartner 的陳述均表示對 Gartner, Inc. 作為 聯合訂閱服務的㇐部分發布的數據、研究意見或觀點的解釋,不應被視為事實陳述。每個 Gartner 出版物均以其原始發布日期為準(而不是本簡報的日期),表達的觀點如有更改,恕不另行通知。
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3
立基7,000億美元的全球市場機會
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2025 2021 – 2025
汽車電子 [(][2][)]
– 潛在市場規模 年均複合成⾧率
全球半導體市場預測 依產品應用別 [(][1][)]
(美金十億元)
820億美元 12.5%
工業與儀器 [(][3][)]
685
750億美元 8.3%
577
通訊 [(][4][)]
物聯網
520億美元 4.4%
消費性 [(][5][)]
740億美元 4.0%
伺服器
電腦及周邊 [(][6][)]
2,390億美元 2.6%
2021 2025
手機 電腦及周邊 消費性 通訊 工業與儀器 汽車電子 手機 [(][7][)]
1,630億美元 2.3%
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註: 圖表由文曄科技編製。截至2021年12月的數據。來源: Gartner Semiconductor Forecast Database, Worldwide, 4Q21 Update。本簡報中所有歸屬 Gartner 的陳述均表示對 Gartner, Inc. 作為聯合訂閱服 務的㇐部分發布的數據、研究意見或觀點的解釋,不應被視為事實陳述。每個 Gartner 出版物均以其原始發布日期為準(而不是本簡報的日期),表達的觀點如有更改,恕不另行通知。
(1) 不包括軍用和用於航太電子的半導體。 (2) 汽車包括用於汽車、先進駕駛輔助系統和售後市場的半導體。 (3) 工業包括用於工業電子的半導體,不包括軍用和用於航空電子的半導體。 (4) 通訊包括用於 有線通訊和無線通訊電子(移動基礎設施、無線區域網路基礎設施等)的半導體。 (5) 消費性電子包括用於消費電子產品(電視、穿戴設備、遊戲等)的半導體。 (6) 電腦包括用於電腦產品(個人電腦和 周邊應用)以及儲存的半導體。 (7) 手機包括用於智慧型手機和傳統手機的半導體。
4
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奠基於產業成⾧實現高速增⾧
2016年至2021年市場規模及文曄的營業收入之年均複合成⾧率
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文曄於亞太區半導體通路業之市佔率
(1)由 2016年之 6.0%
成⾧至2021年之 10.1%
亞太區半導體通路市場
佔亞太區半導體業 [(1)] 的百分比
由2016年之 31.4%
亞太區佔全球半導體市場 [(1) ] 的 成⾧至2021年之 36.0%
百分比由2016年之 69.8%
成⾧至2021年之 75.3%
25.5%
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15.9%
12.8%
11.1%
WT
全球半導體 亞太區半導體 亞太區半導體通路業
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WT
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註: 圖表由文曄科技編製。亞太區範圍不計入日本。截至2022年3月的數據。來源: Gartner Market Share: Semiconductor Distributors, Worldwide, 2021。本簡報中所有歸屬 Gartner 的陳述均表示對 Gartner, Inc. 作為聯合訂閱服務的㇐部分發布的數據、研究意見或觀點的解釋,不應被視為事實陳述。每個 Gartner 出版物均以其原始發布日期為準(而不是本簡報的日期),表達的觀點如有更改,恕不另行通知。 (1) 市場大小與市佔率為依據營業收入作為計算。
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5
文曄科技為全球半導體通路領導商並為同業中市占率增速最快的公司
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鎖定成⾧速度更快與利潤率較高 之產品應用別
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第2名 第4名
亞太區市佔率排名 [(][1][,][2][)] 全球市佔率排名 [(][1][,][2][)]
10.1% 7.6%
亞太區市佔率 [(][1][,][2][)] 全球市佔率 [(][1][,][2][)]
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同業中市佔率增⾧最快 (2016年至2021年)[(2)]
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執行策略併購並成功整合實現 顯著綜效
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亞太區 全球
(3)
4.2% (3)
3.7%
0.9%
0.1%
(1.6%) (1.5%)
(3.4%)
(5.0%)
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註: (1) 依據2021年收入。(2)圖表由文曄科技編製。截至2022年3月的數據。來源: Gartner Market Share: Semiconductor Distributors, Worldwide, 2021。本簡報中所有歸屬 Gartner 的陳述均表示對 Gartner, Inc. 作為聯合訂閱服務的㇐部分發布的數據、研究意見或觀點的解釋,不應被視為事實陳述。每個 Gartner 出版物均以其原始發布日期為準(而不是本簡報的日期),表達的觀點如有更改,恕不另行通知。 (3) 數字可能因為四捨五入進位而不完全相同。
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6
與半導體領導供應商建立⾧期並值得信賴的合作關係
與全球主要半導體供應商建立了 平均10年以上 之合作關係[(1,2)]
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……
80家供應商
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註: (1) 主要供應商包括上述表列之公司。 (2) 在計算合作關係平均年數時,針對通過併購而獲得之供應商,僅考慮與文曄的合作年數。
7
與供應商的無縫整合及深度合作
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強勁的 需求創造 能力
具有豐富經驗的
產品應用工程師 (FAE)
廣泛覆蓋逾 8,000名優質客戶
產品的 市場情報及應用趨勢
上游供應商
下游客戶
優異的 供應鏈解決方案
值得信賴的
⾧期合作夥伴關係
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為具附加價值之服務
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8
提供客戶高度技術含量的綜合解決方案
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強力服務支援以
加速產品上市時間
彙集廣泛供應商產品類別的
單㇐窗口
卓越的設計 和 應用技術
完整產品生命週期 之管理
上游供應商
下遊客戶
優異的 供應鏈解決方案
持續且可靠的 合作夥伴關係
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為具附加價值之服務
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貫穿產品生命週期的全面性服務
於產品的完整生命週期中提供技術服務和供應鏈解決方案
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加速產品開發 產品量產 生命週期再造工程
產品 需求
產品 產量 成熟 下降 產品週期
概念 產品規格 平台 產品 產品原型 產品發佈 提升 結束
設計 除錯 試運行
提供技術支援以縮短產品上市時間 進行供應鏈管理以滿足量產計畫 產品壽命最大化並接軌下㇐代
• 解決方案建議 • 產品試產服務 • 智慧存貨計畫管理
• 硬體和軟體支援 • 供應鏈規劃與市場情報 • 產品元件保固管理
• 產品原型驗證支持 • 配送和物流 • 產品再造
• 產品生產協助 • 提供區域商業整合服務 • 產品新設計開發
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案例說明: 提供ODM客戶智慧鑰匙設計服務
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逾15種零組件推薦
射頻積體電路
微控制器
微處理器
記憶體
…
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技術支援
硬體電路設計
印刷電路板配置圖規劃
軟體整合
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10
聚焦高成⾧潛力和高毛利產品應用之產品組合
掌握新興應用的未來技術趨勢
實現相較產業更大規模之增⾧ 綜合高獲利及以量為主 之產品應用組合
– 文曄營業收入 依產品應用別[(][1][)]
實現相較產業2016年至2021年之收年均複合增⾧率更大規模之增⾧[(2)]
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25.5%
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11.0%
全球半導體收入
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2021年至2025年全球半導體產業收入年均複合增⾧率 [(][3][)]
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12.5%
8.3%
4.0% 4.4%
2.3% 2.6%
手機 電腦及周邊 消費性 通訊 工業與儀器 汽車電子
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註: 圖表由文曄科技編製。本簡報中所有歸屬 Gartner 的陳述均表示對 Gartner, Inc. 作為聯合訂閱服務的㇐部分發布的數據、研究意見或觀點的解釋,不應被視為事實陳述。每個 Gartner 出版物均以其原始 發布日期為準(而不是本簡報的日期),表達的觀點如有更改,恕不另行通知。(1) 截至2021。 (2) 根據公司財務報告和Gartner。來源: Gartner Semiconductor Forecast Database, Worldwide, 4Q21 Update。(3) 截至2021年12月的數據。來源: Gartner Semiconductor Forecast Database, Worldwide, 4Q21 Update。
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11
透過數位化提高效率並擴大經濟規模
提供更好的客戶服務
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-
向客戶擴展B2B/EDI服務
-
及時滿足客戶需求和技術支援
持續增進的營業效率
- 自動化工具和流程可節省人工作業並減少錯誤
支持商業決策
-
對商業和產業趨勢進行大資料分析並以數據驅動商業決策
-
將資料視覺化呈現於儀錶板和報告中以獲得更好的洞察
利用數位化工具優化營運 並降低營業費用支出比率[(1)]
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1.7%
1.6%
1.4%
2019 2020 2021
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註: (1) 營業費用比率為營業費用除以收入。
12
文曄科技追求卓越的營運表現同時履行社會責任
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環境
社會
公司治理
-
環境承諾 – 每年 減少1%的溫室氣體 排放
-
臺灣高薪100指數成分股 – 重視員工 的健康、安全、薪資與福利
-
榮獲2020年 臺灣證券交易所治理 排名前5%
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循環經濟 –自2015年來,減少了 315萬 張紙的浪費,使用了 120萬 個 永續包裝
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生態設計 鼓勵使用低功耗模組並 設計環境友善的電子產品
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性別、經驗和產業知識的 多樣性 女 ,
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性員工佔全體員工40% 女性董事會 成員佔全體董事43%
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新冠肺炎疫情期間積極採取措施並為 社區捐款
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7名董事會成員中有 3名獨立董事
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成立 風險管理委員會 執行文曄內部 風險管理機制
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幫助更美好的未來 – 自2014年通過 文 曄教育基金會 累計捐款及活動支出達 新台幣4,700萬元
在Sustainalytics對在416家臺灣上市櫃公司的 ESG風險評分 中排名 第4
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領導團隊富有遠見並有強大執行力
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鄭文宗
許文紅 楊欽舜
董事⾧ & 執行⾧
資深副總經理 業務行銷⾧
文興康 孫萬力 楊幸瑜
產品行銷⾧ 應用工程⾧ 財務⾧
廣泛的 平均任期 雄厚的 團隊合作的
產業知識 ⾧且穩定 技術基礎 組織文化
高階管理層擁有 員工穩定 員工中46%有工程背景 企業由創辦人領導
平均超過20年之 人員離職率低 15%有博士或碩士學位 並重視團隊合作、
半導體產業經驗 誠信和透明度
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為⾧期價值創造做好充足準備
1 持續追求高品質和價值驅動的業務以確保永續成⾧和競爭優勢 2 聚焦重點策略產業並持續強化業務組合 3 進㇐步加強產品技術能力 4 深耕現有客戶並持續開發新客戶以擴大市佔率 5 透過數位化平台和自動化流程提高營運效率 持續策略投資和併購以增加產品線、擴大客戶群、提高市場滲透 6 率並擴展營運範圍
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財務表現
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財務亮點
2021年度
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新台幣4,480億元 營業收入
26.8% 年增率
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新台幣9.8元 擬制每股盈餘[(1)]
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新台幣106億元 營業利益
2.4% 營業利益率
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15.9% 股東權益報酬率
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新台幣79億元 淨利
1.8% 淨利率
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50天 營運資金回收天期
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註: (1)截至期末,歸屬於母公司之淨利除以發行在外的股份。
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強勁的收入成⾧與不斷提升之利潤率
營業收入和營業毛利率
營業利潤和利潤率
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(新台幣百萬元) 12, 000
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(新台幣百萬元) 500 ,000
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450 ,000 447,896 10,557 9.0%
25. 0%
10, 000
400 ,000 8.0%
353,152 20. 0%
350 ,000 335,187 7.0%
8,000
300 ,000 15. 0% 6.0%
250 ,000 10. 0% 6,000 5,253 5,316 5.0%
200 ,000 3.2% 3.1% 3.8% 5.0 % 4,000 2.4% 4.0%
150 ,000 3.0%
0.0 % 1.5%
100 ,000 1.6% 2.0%
2,000
50,000 (5.0%) 1.0%
0 (10.0%) 0 0.0%
2019 2020 2021 2019 2020 2021
Revenue營業收入 Gross Profit Margin %營業毛利率 (%) 營業利益Operating Profit 營業利益率% Margin (%)
營業費用與營業費用率 淨利和淨利率
(新台幣百萬元) 7,0 00 5.0% (新台幣百萬元) 9,0 00 20.0%
6,430
8,0 00 7,923 18.0%
6,0 00
5,547 5,458 4.0% 7,0 00 16.0%
5,0 00 14.0%
6,0 00
3.0% 12.0%
4,0 00 5,0 00
3,0 00 4,0 00 3,795 10.0%
1.7% 1.5% 2.0% 8.0%
1.4% 3,0 00 2,531
2,0 00 6.0%
2,0 00
1,0 00 1.0% 1.8% 4.0%
1,0 00 0.8% 1.1% 2.0%
0 0.0% 0 0.0%
2019 2020 2021 2019 2020 2021
Operating Expenses營業費用 Opex as % of Revenue營業費用率 (%) Net Income淨利 淨 % Margin利率 (%)
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專注於成⾧快和利潤高的終端應用市場
營收比重
年增率比較 (YoY) – 2020 (左) 與 2021 (右) 營業收入(新台幣百萬元)
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100% 營業收入(新台幣百萬元)
5.2% 5.3% 6.5%
現金牛 優質業務 明星應用
9.0% 7.7%
9.0%
明星應用 160
YoY +23%
80% 14.8%
18.3% 15.9%
140
13.2%
12.5% 120
60% 14.6%
YoY +18%
100
優質業務
24.4%
22.6%
22.1% 80 YoY +36%
40%
YoY +20%
60
YoY +47%
YoY +55%
40
20%
34.6% 33.5% 現金牛
30.8%
20
0
0%
2019 2020 2021
手機 電腦及周邊 消費性 通訊 工業與儀器 汽車電子
手機 電腦及周邊 消費性 通訊 工業與儀器 汽車電子
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嚴謹的營運資金管控與穩健的股東權益報酬
營運資金回收天期
股東權益報酬率與股東權益
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(天)(Days) (新台幣百萬元)
60,000
53,768
50
49 49
50,000 15.9%
46,078
56
55
54
53
52
48 40,000
47 47
44
11.2% 10.9%
30,000
23,478
20,000
10,000
0
2019 2020 2021
2019 2020 2021
Accounts Receivable Days應收帳款天數 Inventory Days存貨天數 Shareholders’ Equity股東權益 ROE股東權益報酬率 (%)
Accounts Payable Days應付帳款天數 Cash Conversion Cycle營運資金回收天期
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營運展望
2022年第㇐季
新台幣1,150億元 – 1,210億元 \2022年第㇐季收入預測
21% 年增率 營收預測區間中點
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3.75 – 3.95% 毛利率
2.25 – 2.45% 營業利益率
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註 : 營業收入假設美元兌台幣匯率約為1:27.8。
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問與答
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附錄
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歷史損益表
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(新台幣百萬元,每股盈餘除外) 截至當年12月31日
2019 2020 2021
營業收入 335,187 353,152 447,896
年增率( % ) 22.6% 5.4% 26.8%
營業成本 (324,387) (342,378) (430,909)
營業毛利 10,800 10,774 16,987
營業毛利率( % ) 3.2% 3.1% 3.8%
推銷費用 (4,150) (4,070) (4,522)
管理費用 (988) (979) (1,296)
研究發展費用 (407) (386) (609)
預期信用減損損失 (3) (24) (3)
營業費用合計 (5,547) (5,458) (6,430)
營業利益 5,253 5,316 10,557
營業利益率( % ) 1.6% 1.5% 2.4%
利息收入 22 16 6
其他收入 52 210 339
其他利益及損失 21 278 (2)
財務成本 (1,953) (991) (715)
採用權益法認列之關聯企業及合資損益之份額 (86) (31) (6)
營業外收入和支出合計 (1,944) (517) (377)
稅前淨利 3,309 4,799 10,180
所得稅費用 (778) (1,004) (2,325)
本期淨利 2,531 3,795 7,923
淨利率( % ) 0.8% 1.1% 1.8%
基本每股盈餘 (元) 4.32 5.22 9.96
擬制每股盈餘 (元) 4.28 4.81 9.80
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歷史資產負債表
| 歷史資產負債表 | |||
|---|---|---|---|
| (新台幣百萬元) | 截至當年12月31日 | ||
| 2019 | 2020 | 2021 | |
| 現金及約當現金 | 3,107 | 3,627 | 4,680 |
| 應收帳款總額 | 46,249 | 61,926 | 76,994 |
| 存貨 | 45,795 | 44,314 | 66,524 |
| 不動產、廠房及設備 | 1,010 | 1,003 | 1,004 |
| 其他資產 | 5,026 | 20,139 | 24,147 |
| 資產總計 | 101,367 | 131,010 | 173,349 |
| 短期借款和應付短期票據 | 26,460 | 24,062 | 35,547 |
| 應付帳款總額 | 47,493 | 56,669 | 71,993 |
| ⾧期借款 | 0 | 800 | 7,750 |
| 其他負債 | 3,935 | 3,362 | 4,198 |
| 負債總計 | 77,888 | 84,893 | 119,489 |
| 股東權益 | 23,478 | 46,078 | 53,768 |
| 非控制權益 | 1 | 38 | 92 |
| 權益總計 | 23,479 | 46,116 | 53,860 |
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歷史現金流量表
| 歷史現金流量表 | |||
|---|---|---|---|
| (新台幣百萬元) | 截至當年12月31日 | ||
| 2019 | 2020 | 2021 | |
| 本期稅前淨利 | 3,309 | 4,799 | 10,180 |
| 應收帳款變動 | (9,660) | (18,889) | (16,266) |
| 存貨變動 | 115 | (1,367) | (23,574) |
| 應付帳款變動 | 9,357 | 14,122 | 17,383 |
| 其他 | (254) | (321) | (703) |
| 營業活動之淨現金(流出)流入 | 2,867 | (1,656) | (12,980) |
| 資本支出 | (110) | (106) | (171) |
| 其他 | 68 | (152) | (822) |
| 投資活動的淨現金流出 | (42) | (258) | (993) |
| 短期借款淨減少 | (1,386) | (2,371) | 11,527 |
| ⾧期借款淨增加 | 280 | 680 | 6,950 |
| 發行特別股 | 0 | 6,750 | 0 |
| 發放現金股利 | (1,388) | (1,645) | (2,590) |
| 其他 | (158) | (139) | (288) |
| 籌資活動的淨現金(流出)流入 | (2,653) | 3,274 | 15,600 |
| 匯率變動之影響 | (401) | (839) | (575) |
| 本期現金及約當現金增加(減少)數 | (229) | 520 | 1,052 |
| 期初現金及約當現金餘額 | 3,335 | 3,107 | 3,627 |
| 期末現金及約當現金餘額 | 3,107 | 3,627 | 4,680 |
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