AI assistant
WEEBIT NANO LTD — Investor Presentation 2019
Jul 21, 2019
66042_rns_2019-07-21_4e7a6822-aa5b-4ce3-a46d-dd754e10c294.pdf
Investor Presentation
Open in viewerOpens in your device viewer
July 2019
==> picture [303 x 58] intentionally omitted <==
1
==> picture [222 x 450] intentionally omitted <==
WEEBIT NANO AT A GLANCE
Listed on the ASX in August 2016 and headquartered in Melbourne Operations in Israel and R&D partnership with CEA-Leti in France Developing next-gen memory solution based on Silicon Oxide (SiOx) ReRAM Successfully completed development ReRAM working production protype Engaged with potential customer, developing a module based on their spec Patents Registered in the USA, filed in France
==> picture [208 x 59] intentionally omitted <==
2
2
SHARE INFORMATION
CAPITAL STRUCTURE
SHAREHOLDING BREAKDOWN
==> picture [344 x 277] intentionally omitted <==
----- Start of picture text -----
01 ASX Code: WBT
02 Share price: $0.52 [1]
03 Shares on issue: 63.6m [1]
04 Options: 8.9m [1&2]
05 Market cap: A$35.6m [1]
06 Cash: A$2.95M [3]
1. As of 18 July 2019
----- End of picture text -----
- Including performance shares 3. As of 31 March 2019
==> picture [460 x 221] intentionally omitted <==
----- Start of picture text -----
5.88% 21.12% 73%
TOP 20 [] OTHER [#]
BOARD &
Excluding Board &
MANAGEMENT [^]
Management
----- End of picture text -----*
^ On a fully diluted view, this number is 10.09%
==> picture [209 x 59] intentionally omitted <==
- On a fully diluted view, this number is 24.32% # On a fully diluted view, this number is 65.59%
3
WEEBIT LEADERSHIP TEAM
==> picture [915 x 183] intentionally omitted <==
----- Start of picture text -----
CEO
CHAIRMAN EXECUTIVE DIRECTOR CTO CFO
----- End of picture text -----
40 years of experience in the semiconductor industry, including 2 exits at Verisity Design and Jasper Design Automation
CEO of PacketLight, turned it around from the verge of bankruptcy
Leading WW sales teams for almost 25 years
Served as Executive Vice
President and General Manager at the Intel Architecture Group (IAG) and Chief Product Officer of Intel Corporation
IEEE Fellow and winner of the prize for innovation in industrial development from the Israeli President
Received his PhD researching non-volatile memories, under the supervision of Prof Dov Frohman, the inventor of the first nonvolatile memory technology
Led the creation of Tower Semiconductor and was its CEO for almost 10 years, including taking it public on NASDAQ
Over 20 years of experience in the NVM domain in companies like Intel, Sandisk, Micron and Marvell, including development of the most advanced 45nm NOR Flash technology to date
Was part of Automotive division at Intel
Over 20 years of experience as a Certified Public Accountant. Served as a senior manager at PWC Israel
Audited large public
companies traded on the TASE and US Stock Exchanges and served as the CFO of several start-up companies
Serves on the board of Mellanox as well as several other semiconductor startups
Co-founder of Saifun Semiconductor, a NVM company which was subsequently sold to Spansion
Active Board member of multiple companies in TASE and NASDAQ
4
ATIQ RAZA APPOINTED TO THE BOARD
Over 40 years experience in the semiconductor industry
-
Chairman and CEO of NextGen Inc for 7.5 years where he revolutionized the design of x86 processors
-
Became President and COO of Advanced Micro Devices (AMD) after NextGen was acquired by AMD
-
Led AMD’s transition from running behind Intel Processors to being a direct competitor gaining significant market share in PCs and Cloud
Held multiple roles as investor, Chairman and CEO of several semiconductor companies
-
Chairman and CEO of Raza Microelectronics (Now RMI Corporation) for 5.5 years
-
Chairman and CEO of Calient Technologies for 6 years, a global leader in pure photonic Optical Circuit Switching technology and systems
Served on the boards of Mellanox, Magma Design Automation, Matrix and Solantro Semiconductor Corporation Master’s Degree in Materials Science and Engineering at Stanford University
==> picture [315 x 308] intentionally omitted <==
==> picture [208 x 59] intentionally omitted <==
5
WHY MEMORY?
==> picture [92 x 91] intentionally omitted <==
----- Start of picture text -----
Surveillance
5G
----- End of picture text -----
Internet Of Things
==> picture [77 x 10] intentionally omitted <==
----- Start of picture text -----
Data Centers
----- End of picture text -----
==> picture [108 x 86] intentionally omitted <==
----- Start of picture text -----
Facial Recognition
Drones
----- End of picture text -----
Robotics Autonomous Vehicles
==> picture [92 x 89] intentionally omitted <==
----- Start of picture text -----
Gaming
Smartphones
----- End of picture text -----
==> picture [208 x 59] intentionally omitted <==
6
THE MEMORY MARKET
Volatile Non-Volatile Practically every digital device contains embedded non-volatile memory (NVM) eFlash Weebit’s NVM market expected to go over SRAM ReRAM current US$60B in 2019 (source: statista) Embedded memory: Current NVM solution for embedded MRAM focus Internal on chip has many drawbacks, the market is looking for new solutions Emerging memory technologies, External memory Chip: and specifically ReRAM, are starting Flash to enter the market Integrated on board DRAM ReRAM Weebit’s ReRAM resolves key drawbacks while improving key others
- Weebit’s ReRAM resolves key drawbacks while improving key technical parameters
CPU = Central Processing Unit SRAM = Static Random Access Memory DRAM = Dynamic Random Access Memory
eFlash – Embedded flash ReRAM = Resistive RAM MRAM = Magnetic RAM
==> picture [208 x 59] intentionally omitted <==
7
Source: Yole Development, October 2018
Confidential
WEEBIT’S RERAM SOLUTION
Weebit’s Silicon Oxide (SiOx) ReRAM technology addresses the shortcomings of the existing Flash technology. It is now preparing for transfer to a production facility and being adapted to a first potential customer. Its key competitive advantage compared to embedded Flash and to other new technologies is that it is based on standard materials and can be easily adapted to any fab.
| Embedded Flash | Embedded Flash | Weebit’s ReRAM | Weebit’s ReRAM | |
|---|---|---|---|---|
| Speed | Does not provide the speed improvement required for tomorrow’s needs |
X | ~1000X faster programming and read operations | |
| Energy Efficiency | High energy consumption | X | ~1000X more energy efficient by low voltage and fast write |
|
| Manufacturability | Challenging manufacturing process, not compatible with standard logic process (difficult to embed) Can’t scale below 40-28nm |
X | Simple process, utilises standard SiOx material and machinery, compatible with standard logic process, can scale to smallest geometries |
|
| Density | Provides increased capacity for the near future | | Scalability allows higher future density | |
| Reliability | High error rate and limited endurance | X | 10-100X higher endurance | |
==> picture [208 x 59] intentionally omitted <==
8
EXPECTATIONS MET
APR 2019
Production level endurance and retention
Every committed technology milestone met!
==> picture [82 x 82] intentionally omitted <==
JUN 2018 40nm 1Mbit Array
FEB 2018 40nm 4Kbit Array
==> picture [83 x 83] intentionally omitted <==
NOV 2017 40nm working cells OCT 2017
300nm 4Kbit Array SEPT 2016 Development kicked off at Leti
==> picture [216 x 62] intentionally omitted <==
9
PRODUCTISATION AND COMMERCIALISATION ROADMAP
4Kb Array Initiate engagement with first potential customer
28nm/300mm Production Fab wafers available Qualification
==> picture [914 x 198] intentionally omitted <==
----- Start of picture text -----
Currently received their Technology transfer
specification and started and IP qualification
to implement it
Feb Jun Dec Apr Mar Jun Dec
18 18 18 19 20 20 20
1Mb Array Process Deliver first memory
Optimisation module to potential
customer
----- End of picture text -----
Demonstrated endurance of 1M and Retention of 10 years at 130-150[o] C
Schedule reflects priority given to first potential customer engagement
==> picture [208 x 59] intentionally omitted <==
10
TARGET MARKETS
==> picture [44 x 44] intentionally omitted <==
==> picture [49 x 41] intentionally omitted <==
==> picture [42 x 44] intentionally omitted <==
Internet of Things
- Key Applications: Wearables, security, smart cities, etc.
Key advantages: Ease of manufacturing and low power
Analog
- Key Applications: All types of sensors, automotive, GPS, Wifi, etc.
Key advantages: Ease of manufacturing, doesn’t impact the design
Artificial Intelligence
- Key Applications: Facial & object recognition and big data manipulation
Weebit is a strong fit for many other markets which will be targeted in the future
- Key advantages: Able to manufacture in most advanced geometries
==> picture [208 x 59] intentionally omitted <==
11
==> picture [420 x 540] intentionally omitted <==
----- Start of picture text -----
per
----- End of picture text -----
WEEBIT BUSINESS MODEL
License to semiconductor customers - Revenue per customer project consists of 3 main elements:
-
IP Licensing Fees: P aid upon engagement, ranging from $500K to $2M per license, typically ~$1M
-
Royalties: Range from 1-3% of the revenues from sales of the customer, typically ~1.5%
-
Non-Recurrent Engineering (NRE) fees: Covers costs to adapt the technology to customer specific needs, varies based on the specific customer needs
License to fabs - Revenue per wafer consists of: Royalties: Range from 1-3% of the revenues from sales of the wafer, typically ~1.5%
12
==> picture [56 x 45] intentionally omitted <==
RERAM TECHNOLOGY FOR TOMORROW
Mimic the brain as accurately as possible
o ReRAM resembles biological Neurons o Physical similarities lead to functional similarities o Highly energy efficient
==> picture [75 x 88] intentionally omitted <==
Brain inspired computing systems
Object recognition
Weebit can enable Brain Inspired Artificial Intelligence systems using ReRAM for AI applications Machine learning ReRAM is the solution for tomorrow’s needs achieving artificial intelligence capabilities
==> picture [208 x 59] intentionally omitted <==
13
SIGNIFICANT PROGRESS WITH PARTNERS
Continuing positive progress and discussions on many additional fronts
Potential customers Production fabs
Strategic investors Industrial partners
Announced Partnerships
==> picture [94 x 70] intentionally omitted <==
==> picture [49 x 69] intentionally omitted <==
==> picture [66 x 66] intentionally omitted <==
==> picture [116 x 41] intentionally omitted <==
Politecnico IIT Delhi di Milano
Silvaco
Technion
Developing TCAD Neuromorphic Neuromorphic In Memory simulation models Computing Computing Compute of our ReRAM research research research
==> picture [208 x 59] intentionally omitted <==
14
THANK YOU
==> picture [208 x 59] intentionally omitted <==
15
DISCLAIMER
This presentation contains certain statements that constitute forward-looking statements. Examples of such statements include, but are not limited to, statements regarding the design, scope, initiation, conduct and results of our research and development programs; our plans and objectives for future operations; and the potential benefits of our products and research technologies. In some cases, forward-looking statements can be identified by the use of terminology such as “may,” “will,” “expects,” “plans,” “anticipates,” “estimates,” “potential” or “continue” or the negative thereof or other comparable terminology. These statements involve a number of risks and uncertainties that could cause actual results and the timing of events to differ materially from those anticipated by these forward-looking statements. These risks and uncertainties include a variety of factors, some of which are beyond our control. All forward-looking statements and reasons why actual results may differ are based on information available to us when initially made, and we assume no obligation to update these forward-looking statements or reasons why actual results might differ or the information set forth herein.
In addition, we do not make any representations or warranties, express or implied, with regard to the information included in this presentation of any other related document or information disclosed or furnished in connection thereto, including, without limitation, with respect to the accuracy, reliability, completeness or its sufficiency for any particular purpose. This information is proprietary and confidential of Weebit and is provided on a confidential basis and may not be disclosed or used without our prior written consent. You acknowledge that the disclosure and use of the information may be further prohibited under applicable securities or other laws. This presentation is made for informational purposes only and does not constitute an offer to sell
any interest in Weebit not does it form the basis of any contract or agreement between the parties.
Third party data
This presentation includes or is otherwise based on information obtained from publicly available information, such as Statistica 2018, Yole Développement June 2017 and Advanced Materials Progress Report, 2018; and (iii) other information publicly released by corporations and government departments. Weebit has not independently verified or audited this information or any information. Accordingly, the accuracy and completeness of such information is not guaranteed. This data has been accurately reproduced and, as far as Weebit is aware, no facts have been omitted that would render the information provided inaccurate or misleading. Investors should note that market data is inherently predictive and subject to uncertainty and is not necessarily reflective of actual market, industry and macroeconomic conditions. Specifically, there is no assurance that any of the forecasts or projections will be achieved. Forecasts and projections involve risks and uncertainties and are subject to change based on various factors, including those discussed above.
==> picture [208 x 59] intentionally omitted <==
16
16