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WEEBIT NANO LTD Investor Presentation 2018

Nov 27, 2018

66042_rns_2018-11-27_73c09f56-39d6-4dc7-9330-dd50daa971c9.pdf

Investor Presentation

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Weebit Nano Ltd
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28 November 2018

KEY HIGHLIGHTS

  • 2018 has been a very productive year for Weebit

  • Company de-risked through continued technology development

  • Computing world is undergoing a huge revolution, including memory

  • We are well positioned to capitalise on this revolution

  • WBT transitioning from early development phase to productisation

  • Multiple discussions with potential partners initiated & progressing

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CY2018 SUMMARY

  • Capital raise and SPP > $4.5M

  • Achieved working 1Mb array at 40nm, continuing technology improvement

  • Initiated partnership/collaboration discussions with many partners in different domains

  • Produced samples to enable partnerships

  • Brought 2 very experienced directors on board

  • We are being noticed

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  • 2018 Red Herring 100 Europe Winner

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  • EETimes Silicon 60 – second year in a row

Started the productisation process

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NEW DIRECTORS

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DIRECTOR
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Chairman and major shareholder of Electro Optics Systems (EOS) Chairman of Audio Pixels (AKP)

Owns a wide variety of companies worldwide

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EXECUTIVE DIRECTOR
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PhD. in Applied Physics, focus on SiOx memories, under the guidance of Dov Frohman – the inventor of non-volatile memories

CEO of Tower Semiconductor for almost 10 years Board member, Saifun Semiconductor (NROM Flash)

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WEEBIT RERAM TECHNOLOGY Next generation memory technology

1Mb prototype array achieved on 40nm development vehicle Findings show that our working cells will fit on much smaller geometries (smaller than 28nm)

Faster and more efficient than flash memory

Silicon oxide, the most commonly used material in the industry, enables lower cost and shorter time to market

WBT enables smart integration with most advanced processing technology

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Confidential

EXPECTATIONS MET Every committed technology milestone met

NOV 2018 Working on productisation

JUN 2018 40nm 1Mbit Array

FEB 2018 40nm 4Kbit Array

NOV 2017 40nm working cells OCT 2017

300nm 4Kbit Array

SEPT 2016 Development kicked off at Leti

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S P E E C H
R E C O G N I T I O N
P R E D I C T I V E
T R A N S L A T I O N
A U T O N O M O U S
A N A L Y T I C S
R E C O G N I T I O N
C A R S
I M A G E P E R S O N A L
R E C O G N I T I O N A S S I S T A N C E
everyday lives
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THE ERA OF INTELLIGENT MACHINES Becoming part of our everyday lives

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S P E E C H
R E C O G N I T I O N
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P R E D I C T I V E T R A N S L A T I O N A U T O N O M O U S A N A L Y T I C S R E C O G N I T I O N C A R S

THE COMPUTING WORLD IS CHANGING!

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I M A G E P E R S O N A L
R E C O G N I T I O N A S S I S T A N C E
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Focus is extending from storage
to memory
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AND SO IS THE MEMORY WORLD

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Pushing the envelop on memory speed and
size
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WEEBIT: FOCUSED ON SMART INTEGRATION OF MEMORY

CLASSIC INTEGRATION: MEMORY INTO COMPUTE

  • Memory moving more and more into Compute - Embedded memory blocks

  • AI requires fast and larger memory arrays

MEMORY COMPUTE MEMORY

MEMORY

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EVOLVING INTEGRATION: IN-MEMORY COMPUTE

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COMPUTE
MEMORY
COMPUTE MEMORY
MEMORY COMPUTE
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  • Computation is moving into the memory

  • Processing units are placed embedded in the memory, performing AI specific operations

ReRAM will play a big role in this architecture

STEPS TOWARDS COMMERCIALISATION

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Mid Q1 Q4 Q4
> 2021
2018 2019 2019 2020
40nm 4Kb Array 40nm 1Mb Array Process 28nm/300mm Production Fab IP revenues
demonstrated Demonstrated Optimisation Integration Qualification
Done
Done Baseline
State of the art Technology
improvement to embedded transfer and IP
achieve robust
process qualification
Technology readiness
parameters
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  • Timeline refers to calendar year

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MOVING TO MANUFACTURING

  • WBT used 40nm on 200mm wafers as a vehicle for development

  • Cheaper

  • Faster

  • Now moving to 28nm on 300mm wafers as a vehicle for productisation - Standard in the production fabs

  • Analysis shows we can potentially integrate cells developed on 28nm vehicles in a smaller dimension product

  • This opens up significant markets for us

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LETI COOPERATION
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Next stage agreement being finalised Initiates the move to 28nm / 300mm wafers which is needed for manufacturing Focuses on productisation

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Develop tools and models needed to integrate our ReRAM in a design Multiple cooperation talks taking place

We are responding to inputs from these potential partners

We want to build the partnership on a strong foundation

PARTNERSHIPS BUILDING AN ECOSYSTEM

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RESEARCH PROGRAM

Universities & research institutes approaching Weebit to cooperate on research in advanced topics including

  • Neuromorphic Computing

  • In-Memory Compute

Weebit is engaging with them by

• Supplying samples of its ReRAM chips

• Cooperating in the research

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First announced cooperation:
IIT Delhi
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FURTHER DOWN THE ROAD: NEUROMORPHIC COMPUTATION

ReRAM may bring new capabilities in Artificial Intelligence

  • ReRAM mimics the biological computation at the synaptic level

  • Physical similarities lead to functional similarities

  • Combines memory and processing units using synapse and neuron like cells

  • ReRAM for AI is significantly more energy efficient than today’s data centres, and significantly smaller

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Ions migration leads to resistivity modulation

  • ReRAM is therefore very well placed to capitalise on the emergence of AI capabilities

ReRAM technology enables brain-inspired AI systems

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SUMMARY

  • CY2018 was a productive year for Weebit

  • Company de-risked through continued technology development

  • Computing world is undergoing a huge revolution, including memory

  • We are well positioned to capitalise on this revolution

  • WBT transitioning from early development phase to productisation

  • Multiple discussions with potential partners initiated

CY2019 – Productisation and Partnerships

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