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WEEBIT NANO LTD — Investor Presentation 2017
Sep 10, 2017
66042_rns_2017-09-10_2bd8150d-7f6b-4eed-8317-90079ff13a10.pdf
Investor Presentation
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September 2017
KEY INVESTMENT HIGHLIGHTS
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MASSIVE STORAGE DEMAND
Exponential increase in demand for memory storage
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EXCELLENT DEVELOPMENT RESULTS
Scaled devices with a memory array significantly faster than Flash memory imminent
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KEY DEVELOPMENT PARTNERSHIP
CEA-Leti, world-class research institution
MARKET DRIVERS
Content explosion and Artificial Intelligence (AI) are creating new opportunities for memory technologies (e.g. ReRAM)
ON TRACK
On target for a working 40nm cell by year end of 2017
ADDRESSABLE MARKET > USD$40B+
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Confidential
SHARE INFORMATION
CAPITAL STRUCTURE
SHAREHOLDING BREAKDOWN
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01 ASX Code: WBT
02 Share price: 1.8 cents
03 Shares on issue: 1176m
04 Options: 80.3m
05 Market cap: $10.8m
06 Cash (30 Jun 17): $1.7m
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9.15% 50.92% 39.93%
TOP 20 OTHER
BOARD &
Excluding Board &
MANAGEMENT
Management
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*As of 08 Sep 2017
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Confidential
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Weebit Nano AT A GLANCE
Listed on the ASX in August 2016
Targeting the storage market which is estimated at > USD$40B R&D and HQ in Israel, R&D partnership with CEA-Leti, France Business & Tech partners – CEA-Leti France & Rice University, USA Developing next-gen solution based on Silicon Oxide (SiOx) ReRAM Patents Registered in the USA
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LEADERSHIP TEAM
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CEO
INVENTOR CHAIRMAN
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Ex-Intel EVP IEEE Fellow
Extensive management and financial experience
Scientist of the Year 2013 R&D magazine
Inducted to the National Academy of inventors
Has led intel into the Data Center
Financially led a variety of international companies
Feynman prize in Nano science
Brought to Market: Centrino™ mobile technology
Experience in equity raisings for public companies
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VP R&D
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Two decades in Semiconductors engineering
45nm NOR Flash Technology Development at Micron
Was part of Automotive division at Intel
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*Outgoing, to be replaced by new CEO effective October 2017
Confidential
EXPECTATIONS MET
Every committed milestone met
ON TRACK to reach 40nm miniaturisation by end of 2017
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SEPT 2017
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300nm Array imminent & 40nm engineering with fast write speeds
MAY 2017
Miniaturisation started MARCH 2017 Electrical results validation
NOVEMBER 2016
Successful Technology transfer to Leti
SEPT 2016 Development kicked off at Leti
2008-2016 SiOx ReRAM first pioneered at Rice university
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Confidential
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SEEING IS BELIEVING
Magnified images of our ReRAM semiconductor chip
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1Kb Array Cells
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40nm ReRAM Cell
6500x 20,000x M A G N I F C A T I O N M A G N I F C A T I O N
50,000x 200,000x M A G N I F C A T I O N M A G N I F C A T I O N
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Confidential
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S P E E C H R E C O G N I T I O N
P R E D I C T I V E A U T O N O M O U S T R A N S L A T I O N A N A L Y T I C S C A R S R E C O G N I T I O N
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INTELLIGENT MACHINES Becoming part of our everyday lives
P E R S O N A L
I M A G E R E C O G N I T I O N
A S S I S T A N C E
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Confidential
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DATA EXPLOSION IS COMING
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INDUSTRY ENDORSEMENT
NEW DATA ECONOMY
Marc Durcan Micron CEO Micron Feb 2017
“We live in a new data economy that will generate huge amounts of data. Autonomous vehicles and the network that connects them will generate lots of data. The Internet of Things will also be a big source of data. Cognitive computing and artificial intelligence will be used to analyze much of this data”
Confidential
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Now -The AI era Re VIRTUOUS CYCLE RAM 2015 3D NAND Innovation drives 256 80’s Flash GB technology which in turn generates 128 GB new demands. Faster and more Energy 60’s Magnetic GB efficient Hard Drive Unprecedented Data Storage Laptop & 5MB Smart phone 1956 IBM 1st magnetic drive Desktop
VIRTUOUS CYCLE
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A BETTER FIT WITH EMERGING COMPUTER ARCHITECTURES
Storage Class Memory (SCM) - Closes the Gap between Memory & Computing
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LOCAL,
LOW ENERGY & FAST
Weebit
Volatile memory ReRAM
COMPUTING SRAM DRAM
HUGE GAP
SPEED 1-20ns 50-100ns >100ns
ns 1 billionths of a second
us 1 millionths of a second
ms 1 thousandths of a second Confidential
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LOCAL, LOW ENERGY & FAST Volatile memory
REMOTE, HIGH ENERGY & SLOW Non-Volatile Storage Hard Disk Flash SSD Drive 100us-3ms 5ms-10ms
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WEEBIT ReRAM TECHNOLOGY Designed for next generation technology
ENERGY EFFICIENCY Ultra Low Power
SPEED – READ AND WRITE Significantly faster than Flash
INTEGRATION Bringing the memory closer to the processor
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LOW COST / NO SPECIAL MANFACTURING TECHNOLOGY & NO RETOOLING
Manufacturability - minimum added process steps and cost
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Confidential
PROMISING TECHNOLOGY
Ultra-fast write speed performance coupled with low energy requirements
FAST Very fast write speeds Significantly faster than flash memory
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ENERGY EFFICIENT SCALABLE Standard components 40nm array engineering voltage levels Ongoing integration, Very low voltage similar density to Flash levels memory
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BEST MANUFACTURBILITY = SHORTEST TIME TO MARKET
SILICON OXIDE Weebit NANO NEXT-GEN MEMORY SOLUTION
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✓ Fab Friendly – 50 year process & manufacturing experience
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✓ Compatibility – well integrated with existing proven processes
SILICON OXIDE MANUFACTURABLE ANYWHERE
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ReRAM Not Used in Semiconductor Fabs Used in Semiconductor Fabs
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✓ Any Fab – no need for specialised foundry
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✓ Any Tool – no need for special tool
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✓ Any process – no need for special process
Silicon Oxide – Shortest time to market
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Confidential
COMPETITIVE ADVANTAGE
Faster and Cheaper to Manufacture
Materials
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Silicon Oxide Pr, Ca, Mn* Silver
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Tellurium
Manufacturability
Production ready Difficult to run in Difficult to run in Difficult to run in materials a production Fab a production Fab a production Fab
Speed
Fast RD & WT
Fast RD Fast RD & WT no data on WT
Fast RD & WT
Conclusions
Most cost High Cost of High Cost of High Cost of effective process manufacturing manufacturing manufacturing
Based on public information
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Pr, Ce – rare earth Mn Ag, Ca – not fab friendly
SHORTEST TIME TO PROTOTYPE
Memory Capacity
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Kb Array this year No Array was 8Mb Array 512Kb Mb Array next year published
Dimension
300nm 40nm 40nm
40nm 130nm
Development <2 years 7 years time*
7 years >10 years
Based on public information
*Time to commercially viable product
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ALLIANCE WITH CEA - LETI
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FROM PROTOTYPES TO PRODUCTION
Proven international track record in moving from R&D to production
MEMORY EXPERTISE
Over 10 years of experience in memory technology development
NANOTECHNOLOGY SPECIALIST
State of the art industrial tools
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MANUFACTURING ALLIANCES
Over 330 industrial partners
INNOVATION HUB
60+ start-ups in semiconductor, architectures or software
COLLABORATION
Working on 40nm SiOx development since September 2016
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CUSTOMERS
Intel, ST Microelectronics, Globalfoundries
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TECHNOLOGY ROADMAP & KEY BUSINESS MILESTONES
~~TEC~~ HNOLOGY DEVELOPMENT
BUSINESS DEVELOPMENT
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Technology Technology Demonstration PARTNERSHIP WITH INDUSTRY LEADERS
transfer to Leti Initial discussion with Industry
leaders (manufacturing,
components, systems, Industry
leaders
Integration and characterisation
Scaling towards 300nm
300nm Kb 40nm 1Mb array
40nm Working cells targeted 40nm
Array
Significant Milestone Towards Working
40nm
40nm
cells 40nm
Kb Array
Mb Array
2017 2018
STRATEGY
MINIATURIZATION
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KEY INVESTMENT HIGHLIGHTS
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MASSIVE STORAGE DEMAND
Exponential increase in demand for memory storage
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EXCELLENT DEVELOPMENT RESULTS
Scaled devices with a memory array significantly faster than Flash memory imminent
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KEY DEVELOPMENT PARTNERSHIP
CEA-Leti, world-class research institution
MARKET DRIVERS
Content explosion and Artificial Intelligence (AI) are creating new opportunities for memory technologies (e.g. ReRAM)
ON TRACK
On target for a working 40nm cell by year end of 2017
ADDRESSABLE MARKET > USD$40B+
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DISCLAIMER
This presentation contains certain statements that constitute forward-looking statements. Examples of such statements include, but are not limited to, statements regarding the design, scope, initiation, conduct and results of our research and development programs; our plans and objectives for future operations; and the potential benefits of our products and research technologies. In some cases, forwardlooking statements can be identified by the use of terminology such as “may,” “will,” “expects,” “plans,” “anticipates,” “estimates,” “potential” or “continue” or the negative thereof or other comparable terminology. These statements involve a number of risks and uncertainties that could cause actual results and the timing of events to differ materially from those anticipated by these forward-looking statements. These risks and uncertainties include a variety of factors, some of which are beyond our control. All forward-looking statements and reasons why actual results may differ are based on information available to us when initially made, and we assume no obligation to update these forward-looking statements or reasons why actual results might differ or the information set forth herein. In addition, we do not make any representations or warranties, express or implied, with regard to the information included in this presentation of any other related document or information disclosed or furnished in connection thereto, including, without limitation, with respect to the accuracy, reliability, completeness or its sufficiency for any particular purpose. This information is proprietary and confidential of Weebit and is provided on a confidential basis and may not be disclosed or used without our prior written consent. You acknowledge that the disclosure and use of the information may be further prohibited under applicable securities or other laws. This presentation is made for informational purposes only and does not constitute an offer to sell any interest in Weebit not does it form the basis of any contract or agreement between the parties.
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THANK YOU
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STORAGE CLASS MEMORY – A PRIMER
Bridging the gap between memory & storage
Very Fast, close to the CPU but very Expensive
CPU VOLATILE MEMORY loses data when power is off SRAM DRAM
STORAGE CLASS MEMORY
Slow, cheap but far from the CPU
SSD - Flash Hard Drive - Magnetic
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NON-VOLATILE MEMORY Data is stored even when power is off
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Confidential