Skip to main content

AI assistant

Sign in to chat with this filing

The assistant answers questions, extracts KPIs, and summarises risk factors directly from the filing text.

VPEC Investor Presentation 2020

Nov 19, 2020

52095_rns_2020-11-19_7ac8f474-7f9d-4898-8f48-b7456be9538b.pdf

Investor Presentation

Open in viewer

Opens in your device viewer

==> picture [635 x 32] intentionally omitted <==

==> picture [635 x 32] intentionally omitted <==

==> picture [635 x 32] intentionally omitted <==

==> picture [635 x 31] intentionally omitted <==

Company Profile World-class leading edge with MOCVD

==> picture [143 x 146] intentionally omitted <==

1

==> picture [77 x 78] intentionally omitted <==

Core Technolo gy

MOCVD (有機金屬氣相沉積法) - Metal Organic Chemical Vapor Deposition

==> picture [461 x 69] intentionally omitted <==

==> picture [461 x 193] intentionally omitted <==

2

==> picture [77 x 78] intentionally omitted <==

Core Technolo gy

Production MOCVD Reactor

Metal Organic Chemical Vapor Deposition

Through the organic metal chemical vapor deposition method, the W ay o t sem con i d uc or t fil m s grown on e su i th b s ra e, an t t d th e ep it ax a i l Produce layer is accurately controlled through the real-time monitoring of the machine to complete the production of epitaxial wafers for 、 different products such as GaAs InP and GaN.

Production Principle

The epitaxial layer is heated by MOCVD in the cavity of the substrate, and an atomic layer is stacked layer by layer to form an epitaxial layer.

3

==> picture [77 x 78] intentionally omitted <==

Semiconductor by Material

Element Si Ge ,

==> picture [700 x 372] intentionally omitted <==

----- Start of picture text -----

||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|,|
|Semiconductor|IV-IV|
|SiC,|SiGe|
|III-V|
|GaAs,|InP, GaN, GaP, GaSb...|
|Com|ound|
|p|
|II-VI|
|ZnSe,|ZnS, CdS, etc.|
|Period|Column II|III|IV|V|VI|
|Be|鈹|B|硼|C|碳|N|氮|O|氧|
|2|
|Beryllium|Boron|Carbon|Nitrogen|Oxygen|二元化合物|Binary : GaAs, InP, GaP,GaN, etc.|
|Mg|鎂|Al|鋁|Si|矽|P|磷|S|硫|
|3|Magnesium|Aluminum|Silicon|Phosphorus|Sulfur|三元化合物|Ternary : InGaAs, InGaP, AlGaAs, etc.|
|4|Zn|鋅|Ga|鎵|Ge|鍺|As|砷|Se|硒|四元化合物|Quaternary : AlGaInP, InGaAsP, etc.|
|Zinc|Gallium|Germanium|Arsenic|Selenium|
|Cd|鎘|In|銦|Sn|錫|Sb|銻|Te|碲|五元化合物|Pentanary : AlGaInAsN, etc.|
|5|
|Cadmium|Indium|Tin|Antimony|Tellurium|
|Hg|汞|Tl|鉈|Pb|鉛|
|6|
|Mercury|Thallium|Lead|
|4|

----- End of picture text -----

Semiconductor

4

==> picture [77 x 78] intentionally omitted <==

Chemical Reaction During Epitaxy

==> picture [274 x 97] intentionally omitted <==

化學反應式:

==> picture [70 x 61] intentionally omitted <==

主要原物料:

MO Source + Hydride + Carrier Gas H2

A s H 3[: rs ne] A i PH3 : Phosphine SiH 4 : Silane Si H 2 6 : Disiline H2Se : Hydrogen Selenide CBr 4 : Carbon Tetrabromide

TEAl : Tri-ethyl-Aluminum ( C2H5 )3Al TMGa : Tri-Methyl-Gallium ( CH3 )3 Ga SiH TMIn : Tri-Methyl-Indium ( CH3 )3In Si H 2 DETe : Di-ethyl-Tellurium ( C2H5 )2Te DEZn : Di-ethyl-Zinc ( C2H5 )2Zn CBr CP2Mg : Bis (cyclo-penta-dienyl ) Magnesium 環戊二烯鎂

CH Al CH Al 3 3 TMAl Tri - Methyl - Aluminum ( CH3 )3 三 甲基 鋁 CH 5 3

==> picture [77 x 78] intentionally omitted <==

Advantages of Compoundsemiconductor

  1. High Electron Mobility 高電子移動速率 (5.7x higher than CM0S)

  2. High Frequency Response 高頻率響應

  3. Wide Band Width 寬幅之頻寬 4 . High Linearity 高線性度

  4. High Power 高功率

  5. Alternative Choice of Material 材料選擇多元性 7. 抗輻射 適用於無線通訊、光通訊、雷射

6

==> picture [77 x 78] intentionally omitted <==

GaAs in Wireless Communication Supply Chain

==> picture [115 x 164] intentionally omitted <==

IDM Qorvo, Avago, Skyworks

Sumitomo, Freiberg, AXT 4~6 ”GaAs Substrate

==> picture [80 x 32] intentionally omitted <==

GaAs Epi- Wafer 磊晶片

Microelectronics IC Process

==> picture [130 x 48] intentionally omitted <==

==> picture [125 x 45] intentionally omitted <==

==> picture [125 x 52] intentionally omitted <==

Wireless Communication Substrate

==> picture [147 x 113] intentionally omitted <==

==> picture [233 x 44] intentionally omitted <==

MOCVD Reactor

Foundry WIN, AWSC, GCS IC Package & Testing

7

==> picture [77 x 78] intentionally omitted <==

2016-2020 Q3 Financial Result

==> picture [721 x 114] intentionally omitted <==

==> picture [721 x 144] intentionally omitted <==

==> picture [9 x 10] intentionally omitted <==

----- Start of picture text -----

8
----- End of picture text -----

==> picture [77 x 78] intentionally omitted <==

2021 Outlook

==> picture [706 x 381] intentionally omitted <==

----- Start of picture text -----

5G mobile phone penetration rate WiFi6 & WiFi6E IoT Smart Link
Microelectronics
Automotive PA 5G millimeter wave base station PA Defense industry Low-orbit satellite LNA
----- End of picture text -----

==> picture [77 x 78] intentionally omitted <==

2021 Outlook

3D Sensing

5G Base station infrastructure

==> picture [257 x 136] intentionally omitted <==

==> picture [242 x 136] intentionally omitted <==

==> picture [125 x 38] intentionally omitted <==

==> picture [645 x 210] intentionally omitted <==

----- Start of picture text -----

Optoelectronics
LiDAR for vehicles 智慧機器視覺
----- End of picture text -----