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VPEC Management Reports 2023

Aug 31, 2023

52095_rns_2023-08-31_7d2a22aa-b8c0-4046-92e5-e1142d5829cb.pdf

Management Reports

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Company Profile

World-class leading edge with MOCVD

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Core Technolo gy

MOCVD (有機金屬氣相沉積法)

  • Metal Organic Chemical Vapor Deposition

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Core Technolo gy

Production MOCVD Metal Organic Chemical Vapor Deposition Reactor

Through the organic metal chemical vapor deposition method, the Way to semiconductor film is grown on the substrate, and the epitaxial Produce layer is accurately controlled through the real-time monitoring of the machine to complete the production of epitaxial wafers for 、 different products such as GaAs InP and GaN.

Production Principle

The epitaxial layer is heated by MOCVD in the cavity of the substrate, and an atomic layer is stacked layer by layer to form an epitaxial layer.

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Semiconductorb Materialy

Element Si Ge ,

Semiconductor

IV-IV SiC, SiGe

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||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|III-V|
|GaAs,|InP, GaN, GaP, GaSb...|
|Compound|
|II-VI|
|ZnSe,|ZnS, CdS, etc.|
|Period|Column II|III|IV|V|VI|
|Be|鈹|B|硼|C|碳|N|氮|O|氧|
|2|
|Beryllium|Boron|Carbon|Nitrogen|Oxygen|二元化合物|Binary : GaAs, InP, GaP,GaN, etc.|
|Mg|鎂|Al|鋁|Si|矽|P|磷|S|硫|
|3|Magnesium|Aluminum|Silicon|Phosphorus|Sulfur|三元化合物|Ternary : InGaAs, InGaP, AlGaAs, etc.|
|4|Zn|鋅|Ga|鎵|Ge|鍺|As|砷|Se|硒|四元化合物|Quaternary : AlGaInP, InGaAsP, etc.|
|Zinc|Gallium|Germanium|Arsenic|Selenium|
|Cd|鎘|In|銦|Sn|錫|Sb|銻|Te|碲|五元化合物|Pentanary : AlGaInAsN, etc.|
|5|
|Cadmium|Indium|Tin|Antimony|Tellurium|
|Hg|汞|Tl|鉈|Pb|鉛|
|6|
|Mercury|Thallium|Lead|
|4|

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Chemical Reaction During Epitaxy

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化學反應式:

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主要原物料 :

MO Source + Hydride + Carrier Gas : H2

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AsH3 : Arsine PH3 : Phosphine SiH 4 : Silane Si H 2 6 : Disiline H2Se : Hydrogen Selenide CBr 4 : Carbon Tetrabromide

TEAl : Tri-ethyl-Aluminum ( C2H5 )3Al TMGa : Tri-Methyl-Gallium ( CH3 )3 Ga TMIn : Tri-Methyl-Indium ( CH3 )3In DETe : Di-ethyl-Tellurium ( C2H5 )2Te

DEZn : Di-ethyl-Zinc ( C2H5 )2Zn

CP2Mg : Bis (cyclo-penta-dienyl ) Magnesium 環戊二烯鎂

CH Al CH Al 3 3 TMAl Tri - Methyl - Aluminum ( CH3 )3 三 甲基 鋁 CH 3

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Advantages of Compoundsemiconductor

  1. High Electron Mobility 高電子移動速率 (5.7x higher than CM0S)

  2. High Frequency Response 高頻率響應

  3. Wide Band Width 寬幅之頻寬

  4. High Linearity 高線性度

  5. High Power 高功率

  6. Alternative Choice of Material 材料選擇多元性

  7. 抗輻射

- 、 、 、 適用於 微電子產品 HBT pHEMT BiHEMT GaN on XX - 、 、 光電子產品 PIN PD APD )、 VCSEL LD

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GaAs in Wireless Communication Supply Chain

IDM : Qorvo, Skyworks Sumitomo, Freiberg, AXT Fabless : Avago, 2~6 ”GaAs Substrate Qualcomm, Richwave, GaAs Epi- Wafer Microelectronics 磊晶片 IC Process Wireless Communication Substrate VPEC is a Pure FoundryMOCVD Reactor Epi Provider WIN, AWSC

Sumitomo, Freiberg, AXT

IC Package & Testing

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2020-2023H1 Financial Result

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2023 Outlook-Microelectronics

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5G Mobile Penetration
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WiFi6/6E and WiFi7 (Developing)

IoT Smart Link

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Micro
Electron
ics
V2X PA LEO Satellite 5G Base Station Military
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2023 Outlook-Optoelectronics

AR / VR Sensing (VCSEL/PD)

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Car LiDAR (LD/PD)

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Opto electron Data Center Communication (PD/VCSEL) ics Special Heat/IR Imaging (SWIR PD) CCD SWIR

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AR / VR

~~Detector: PD~~

Wireless

LiDAR Turnkey Solution

~~Detector: GaAs PIN, APD~~

V2X

VPEC Proprietary and Confidential

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THE ~~WALL STREET JOURNAL~~

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