VPEC — Investor Presentation 2019

Sep 11, 2019

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Company Profile World-class leading edge with MOCVD

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Core Technolo gy

MOCVD( 有機金屬氣相沉積法 )

• Metal Organic Chemical Vapor Deposition

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Semiconductor(by Material)

Element Si Ge , IV-IV SiC, SiGe

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,
Semiconductor	IV-IV
SiC,	SiGe
III-V
GaAs,	InP, GaN, GaP, GaSb...
Com	ound
p
II-VI
ZnSe,	ZnS, CdS, etc.
Period	Column II	III	IV	V	VI
Be	鈹	B	硼	C	碳	N	氮	O	氧
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Beryllium	Boron	Carbon	Nitrogen	Oxygen	二元化合物	Binary : GaAs, InP, GaP,GaN, etc.
Mg	鎂	Al	鋁	Si	矽	P	磷	S	硫
3	Magnesium	Aluminum	Silicon	Phosphorus	Sulfur	三元化合物	Ternary : InGaAs, InGaP, AlGaAs, etc.
4	Zn	鋅	Ga	鎵	Ge	鍺	As	砷	Se	硒	四元化合物	Quaternary : AlGaInP, InGaAsP, etc.
Zinc	Gallium	Germanium	Arsenic	Selenium
Cd	鎘	In	銦	Sn	錫	Sb	銻	Te	碲	五元化合物	Pentanary : AlGaInAsN, etc.
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Cadmium	Indium	Tin	Antimony	Tellurium
Hg	汞	Tl	鉈	Pb	鉛
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Mercury	Thallium	Lead

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Semiconductor

二元化合物 Binary : GaAs, InP, GaP,GaN, etc. 三元化合物 Ternary : InGaAs, InGaP, AlGaAs, etc. 四元化合物 Quaternary : AlGaInP, InGaAsP, etc. 五元化合物 Pentanary : AlGaInAsN, etc.

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Chemical Reaction Durin E itax g p y

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化學反應式：

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主要原物料:

MO Source + Hydride + Carrier Gas ： H2

A s H 3[: rs ne] A i PH3 : Phosphine SiH 4 : Silane Si H 2 6 : Disiline H2Se : Hydrogen Selenide CBr 4 : Carbon Tetrabromide

TEAl : Tri-ethyl-Aluminum ( C2H5 )3Al TMGa : Tri-Methyl-Gallium ( CH3 )3 Ga SiH TMIn : Tri-Methyl-Indium ( CH3 )3In Si H 2 DETe : Di-ethyl-Tellurium ( C2H5 )2Te DEZn : Di-ethyl-Zinc ( C2H5 )2Zn CBr CP2Mg : Bis (cyclo-penta-dienyl ) Magnesium 環戊二烯鎂

TMAl Tri - Methyl - Aluminum ( CH3 )3Al 三 甲基 鋁

CH 3

Al

CH 3

CH 3

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Advantages of Com oundsemiconductor p

1. High Electron Mobility高電子移動速率(5.7x higher than CM0S)

2. High Frequency Response高頻率響應

3. Wide Band Width 寬幅之頻寬 4 . High Linearity高線性度

4. High Power高功率

5. Alternative Choice of Material材料選擇多元性 7. 抗輻射 適用於無線通訊、光纖通訊、光顯示(LED)& 太陽能產 業

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GaAs in Wireless Communication Su l Chain pp y

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IDM :Skyworks, RFMD, TriQuint, Avago, Anadigics

Sumitomo, Freiberg, AXT 4~6 ”GaAs Substrate

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GaAs Epi- Wafer 磊晶片

Microelectronics IC Process

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Wireless Communication Substrate

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MOCVD Reactor

Foundry: WIN, AWSC, GCS IC Package & Testing

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2016-2019 Q2 Financial Result

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