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VPEC Interim / Quarterly Report 2025

Sep 10, 2025

52095_rns_2025-09-10_fe85ea17-aae7-4498-b182-a7e18a3ef5e9.pdf

Interim / Quarterly Report

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公司簡介 MOCVD 創造世界級之競爭力

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1

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心 核 技術

MOCVD (有機金屬氣相沉積法)

  • Metal Organic Chemical Vapor Deposition

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2

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生產 機台

生產
方式

生產 原理

核心技術

MOCVD 有機金屬化學氣相沉積法 Metal Organic Chemical Vapor Deposition

透過有機金屬化學氣相沉積法,在基板上生
長半導體薄膜的方式,同時透過機台即時監
、、
控,精確控制磊晶層,完成砷化鎵磷化銦
氮化鎵等不同產品磊晶片生產。

磊晶層是由 MOCVD 在腔體中加熱基板,一 個原子層,層層堆疊,行成磊晶層。

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半導體分類依使用材料

Element Si Ge ,

Semiconductor

IV-IV SiC, SiGe III-V GaAs, InP, GaN, GaP, GaSb... Compound

II-VI ZnSe, ZnS, CdS, etc.

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||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|Period|Column II|III|IV|V|VI|
|Be|鈹|B|硼|C|碳|N|氮|O|氧|
|2|
|Beryllium|Boron|Carbon|Nitrogen|Oxygen|二元化合物|Binary : GaAs, InP, GaP,GaN, etc.|
|Mg|鎂|Al|鋁|Si|矽|P|磷|S|硫|
|3|Magnesium|Aluminum|Silicon|Phosphorus|Sulfur|三元化合物|Ternary : InGaAs, InGaP, AlGaAs, etc.|
|4|Zn|鋅|Ga|鎵|Ge|鍺|As|砷|Se|硒|四元化合物|Quaternary : AlGaInP, InGaAsP, etc.|
|Zinc|Gallium|Germanium|Arsenic|Selenium|
|Cd|鎘|In|銦|Sn|錫|Sb|銻|Te|碲|五元化合物|Pentanary : AlGaInAsN, etc.|
|5|
|Cadmium|Indium|Tin|Antimony|Tellurium|
|Hg|汞|Tl|鉈|Pb|鉛|
|6|
|Mercury|Thallium|Lead|
|4|

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磊晶過程中之化學反應

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化學反應式:

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主要原物料 :

MO Source + Hydride + Carrier Gas : H2

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AsH3 : Arsine PH3 : Phosphine SiH 4 : Silane Si H 2 6 : Disiline H2Se : Hydrogen Selenide CBr 4 : Carbon Tetrabromide

TEAl : Tri-ethyl-Aluminum ( C2H5 )3Al TMGa : Tri-Methyl-Gallium ( CH3 )3 Ga SiH TMIn : Tri-Methyl-Indium ( CH3 )3In Si H 2 DETe : Di-ethyl-Tellurium ( C2H5 )2Te DEZn : Di-ethyl-Zinc ( C2H5 )2Zn CBr CP2Mg : Bis (cyclo-penta-dienyl ) Magnesium 環戊二烯鎂

CH Al CH Al 3 3 TMAl Tri - Methyl - Aluminum ( CH3 )3 三 甲基 鋁 5 CH 3

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化合物半導體材料特性

  1. High Electron Mobility 高電子移動速率 (5.7x higher than CM0S)

  2. High Frequency Response 高頻率響應

  3. Wide Band Width 寬幅之頻寬

  4. High Linearity 高線性度

  5. High Power 高功率

  6. Alternative Choice of Material 材料選擇多元性

  7. 抗輻射

- 、 、 、 適用於 微電子產品 HBT pHEMT BiHEMT GaN on XX - 、 、 、 、 光電子產品 PIN PD APD )、 VCSEL LD SC - CW Laser GaN on XX

6

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微電子產品產業供應鏈

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IDM : Qorvo, Skyworks Fabless : Avago, Qualcomm, Richwave,

Sumitomo, Freiberger, AXT

2~6 ”GaAs Substrate

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GaAs Epi- Wafer Microelectronics 磊晶片 IC Process Substrate VPEC is a Pure FoundryEpi Provider WIN, AWSC

Wireless Communication

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VPEC is a Pure MOCVD Reactor Epi Provider

IC Package & Testing

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2022 -2025 H1 損益情形

2025 H1 % 2024 % 2023 % 2022 %
Revenue 1,507,750 100% 3,241,217 100% 2,694,104 100% 2,603,629 100%
Gross margin 562,216 37% 1,278,964 39% 1,108,914 41% 1,089,007 42%
Operating
Profit
301,054 20% 721,214 22% 542,069 20% 579,950 22%
Non-
operating
income &
expense
-80,027 -5% 96,460 3% -347 0% 87,533 3%
Tax -27,431 -2% -146,619 -5% -91,490 -3% -122,755 -5%
Net income 193,596 13% 671,055 21% 450,232 17% 544,728 21%
EPS 1.05 3.63 2.43 2.95

8

2025 Outlook

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的内容入您的内容输入您的内
容输入您的内容输入您的内容
5G Mobile
内容输入您的内容.
01
Penetration
WiFi 7
02
微電子
V2X
03
04 IoT Smart Link
(4G PA)
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VPEC Proprietary and Confidential

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2025 Outlook

Data Center High Speed Connectivity

PD for 800G VCSEL for 400G & 800G VCSEL / PD

01

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3D-sening

02

光電子 03

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VCSEL
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AR/VR 機器視覺

低軌道衛星

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Future Driving Engines 、 、 P-sensor 3D Sensing ToF

04

車用光達 (LD/PD)

無人機

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AI glass
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VPEC Proprietary and Confidential 矽光子
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