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VPEC Annual Report 2018

Mar 12, 2019

52095_rns_2019-03-12_e558064e-e620-4047-b052-052bd39018a7.pdf

Annual Report

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Company Profile World-class leading edge with MOCVD

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Core Technology

MOCVD( 有機金屬氣相沉積法 )

  • Metal Organic Chemical Vapor Deposition

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Semiconductor(by Material)

Element Si Ge , IV-IV SiC, SiGe

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||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|,|
|Semiconductor|IV-IV|
|SiC,|SiGe|
|III-V|
|GaAs,|InP, GaN, GaP, GaSb...|
|Com|ound|
|p|
|II-VI|
|ZnSe,|ZnS, CdS, etc.|
|Period|Column II|III|IV|V|VI|
|Be|鈹|B|硼|C|碳|N|氮|O|氧|
|2|
|Beryllium|Boron|Carbon|Nitrogen|Oxygen|二元化合物|Binary : GaAs, InP, GaP,GaN, etc.|
|Mg|鎂|Al|鋁|Si|矽|P|磷|S|硫|
|3|Magnesium|Aluminum|Silicon|Phosphorus|Sulfur|三元化合物|Ternary : InGaAs, InGaP, AlGaAs, etc.|
|4|Zn|鋅|Ga|鎵|Ge|鍺|As|砷|Se|硒|四元化合物|Quaternary : AlGaInP, InGaAsP, etc.|
|Zinc|Gallium|Germanium|Arsenic|Selenium|
|Cd|鎘|In|銦|Sn|錫|Sb|銻|Te|碲|五元化合物|Pentanary : AlGaInAsN, etc.|
|5|
|Cadmium|Indium|Tin|Antimony|Tellurium|
|Hg|汞|Tl|鉈|Pb|鉛|
|6|
|Mercury|Thallium|Lead|
|3|

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Semiconductor

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Chemical Reaction During Epitaxy

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化學反應式:

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主要原物料:

MO Source + Hydride + Carrier Gas H2

A s H 3[: rs ne] A i PH3 : Phosphine SiH 4 : Silane Si H 2 6 : Disiline H2Se : Hydrogen Selenide CBr 4 : Carbon Tetrabromide

TEAl : Tri-ethyl-Aluminum ( C2H5 )3Al TMGa : Tri-Methyl-Gallium ( CH3 )3 Ga SiH TMIn : Tri-Methyl-Indium ( CH3 )3In Si H 2 DETe : Di-ethyl-Tellurium ( C2H5 )2Te DEZn : Di-ethyl-Zinc ( C2H5 )2Zn CBr CP2Mg : Bis (cyclo-penta-dienyl ) Magnesium 環戊二烯鎂

TMAl Tri - Methyl - Aluminum ( CH3 )3Al 三 甲基 鋁

CH 3

Al

CH 3

CH 3

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Advantages of Com oundsemiconductor p

  1. High Electron Mobility高電子移動速率(5.7x higher than CM0S)

  2. High Frequency Response高頻率響應

  3. Wide Band Width 寬幅之頻寬 4 . High Linearity高線性度

  4. High Power高功率

  5. Alternative Choice of Material材料選擇多元性 7. 抗輻射 適用於無線通訊、光纖通訊、光顯示(LED)& 太陽能產 業

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GaAs in Wireless Communication Su l Chain pp y

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IDM :Skyworks, RFMD, TriQuint, Avago, Anadigics

Sumitomo, Freiberg, AXT 4~6 ”GaAs Substrate

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GaAs Epi- Wafer 磊晶片

Microelectronics IC Process

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Wireless Communication Substrate

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MOCVD Reactor

Foundry: WIN, AWSC, GCS IC Package & Testing

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2014-2018 Financial Result 2014-2018 Financial Result 2014-2018 Financial Result 2014-2018 Financial Result 2014-2018 Financial Result 2014-2018 Financial Result 2014-2018 Financial Result 2014-2018 Financial Result 2014-2018 Financial Result 2014-2018 Financial Result 2014-2018 Financial Result
2018 % 2017 % 2016 % 2015 % 2014 %
Revenue 2,062,120 100.00% 2,137,109 100.00% 2,182,825 100.00% 2,391,899 100.00% 2,073,370 100.00%
Gross margin 774,359 37.55% 743,467 34.79% 809,059 37.06% 896,369 37.48% 720,975 34.77%
Operating Profit 463,906 22.50% 515,093 24.10% 588,072 26.94% 670,700 28.04% 524,487 25.30%
Financial Income 25,273 1.23% -35,375 -1.66% -29,431 -1.35% 20,258 0.85% 40,133 1.94%
Tax -92,009 -4.46% -85,366 -3.99% -91,534 -4.19% -98,301 -4.11% -96,209 -4.64%
Net income 397,170 19.26% 394,352 18.45% 467,107 21.40% 592,657 24.78% 468,411 22.59%

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