VPEC — Annual Report 2017

May 30, 2018

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Company Profile World-class leading edge with MOCVD

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Core Technolo gy

MOCVD( 有機金屬氣相沉積法 )

• Metal Organic Chemical Vapor Deposition

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Semiconductor(by Material)

Element Si Ge , IV-IV SiC, SiGe

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||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|,|
|Semiconductor|IV-IV|
|SiC,|SiGe|
|III-V|
|GaAs,|InP, GaN, GaP, GaSb...|
|Com|ound|
|p|
|II-VI|
|ZnSe,|ZnS, CdS, etc.|
|Period|Column II|III|IV|V|VI|
|Be|鈹|B|硼|C|碳|N|氮|O|氧|
|2|
|Beryllium|Boron|Carbon|Nitrogen|Oxygen|二元化合物|Binary : GaAs, InP, GaP,GaN, etc.|
|Mg|鎂|Al|鋁|Si|矽|P|磷|S|硫|
|3|Magnesium|Aluminum|Silicon|Phosphorus|Sulfur|三元化合物|Ternary : InGaAs, InGaP, AlGaAs, etc.|
|4|Zn|鋅|Ga|鎵|Ge|鍺|As|砷|Se|硒|四元化合物|Quaternary : AlGaInP, InGaAsP, etc.|
|Zinc|Gallium|Germanium|Arsenic|Selenium|
|Cd|鎘|In|銦|Sn|錫|Sb|銻|Te|碲|五元化合物|Pentanary : AlGaInAsN, etc.|
|5|
|Cadmium|Indium|Tin|Antimony|Tellurium|
|Hg|汞|Tl|鉈|Pb|鉛|
|6|
|Mercury|Thallium|Lead|

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Semiconductor

二元化合物 Binary : GaAs, InP, GaP,GaN, etc. 三元化合物 Ternary : InGaAs, InGaP, AlGaAs, etc. 四元化合物 Quaternary : AlGaInP, InGaAsP, etc. 五元化合物 Pentanary : AlGaInAsN, etc.

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Chemical Reaction Durin E itax g p y

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化學反應式：

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主要原物料:

MO Source + Hydride + Carrier Gas ： H2

A s H 3[: rs ne] A i PH3 : Phosphine SiH 4 : Silane Si H 2 6 : Disiline H2Se : Hydrogen Selenide CBr 4 : Carbon Tetrabromide

TEAl : Tri-ethyl-Aluminum ( C2H5 )3Al TMGa : Tri-Methyl-Gallium ( CH3 )3 Ga SiH TMIn : Tri-Methyl-Indium ( CH3 )3In Si H 2 DETe : Di-ethyl-Tellurium ( C2H5 )2Te DEZn : Di-ethyl-Zinc ( C2H5 )2Zn CBr CP2Mg : Bis (cyclo-penta-dienyl ) Magnesium 環戊二烯鎂

TMAl Tri - Methyl - Aluminum ( CH3 )3Al 三 甲基 鋁

CH 3

Al

CH 3

CH 3

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Advantages of Com oundsemiconductor p

1. High Electron Mobility高電子移動速率(5.7x higher than CM0S)

2. High Frequency Response高頻率響應

3. Wide Band Width 寬幅之頻寬 4 . High Linearity高線性度

4. High Power高功率

5. Alternative Choice of Material材料選擇多元性 7. 抗輻射 適用於無線通訊、光纖通訊、光顯示(LED)& 太陽能產 業

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GaAs in Wireless Communication Su l Chain pp y

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IDM :Skyworks, RFMD, TriQuint, Avago, Anadigics

Sumitomo, Freiberg, AXT 4~6 ”GaAs Substrate

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GaAs Epi- Wafer 磊晶片

Microelectronics IC Process

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Wireless Communication Substrate

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MOCVD Reactor

Foundry: WIN, AWSC, GCS IC Package & Testing

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- 2014 2017 Financial Result

	2017	%	2016	%	2015	%	2014	%
Revenue	2,137,109	100.00%	2,182,825	100.00%	2,391,899	100.00%	2,073,370	100.00%
Gross margin	743,467	34.79%	809,059	37.06%	896,369	37.48%	720,975	34.77%
Operating Profit	515,093	24.10%	588,072	26.94%	670,700	28.04%	524,487	25.30%
Financial Income	-35,375	-1.66%	-29,431	-1.35%	20,258	0.85%	40,133	1.94%
Tax	-85,366	-3.99%	-91,534	-4.19%	-98,301	-4.11%	-96,209	-4.64%
Net income	394,352	18.45%	467,107	21.40%	592,657	24.78%	468,411	22.59%
EPS	2.15		2.12		2.40		1.90

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