TRI — Investor Presentation 2022

May 18, 2022

德律科技股份有限公司 www.tri.com.tw

May 2022

報告人 : 陳冠元 / 財務長兼代理發言人

德律科技股份有限公司

• 成立時間 : 1989年4月10日

• 創立人 : 陳玠源董事長

• 資本額 : 新台幣23.62億

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: 主力產品 電路板組裝檢測設備

• 自動光學檢測設備 (IT/Image Tester)

• 錫膏自動光學影像檢測機 (SPI)  自動光學影像檢測機 (AOI)  X-ray 自動檢測機 (AXI)

• 電路板測試機 (BT/In-Circuit Board Tester)

• 組裝電路板測試機 (MDA)  全功能電路板自動測試機 (ICT)

全球唯一 “ 一條龍 ” 電路板組裝檢測設備廠

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德律產品在客戶的電路板組裝產線的應用

主要競爭對手

 : 韓國 Koh Young  日本 : Omron  中國大陸 : Jutze/Sinic-Tek/Holly  馬來西亞 : Vitrox  美國 : Keysight/Teradyne  德國 : Viscom/SPEA

全球銷售服務網

More than 3000 customers have been serviced through worldwide partners More than 50 distributors and Rep. worldwide.

主要客戶為全球各 大電子產品組裝廠

Electronic Industry/Revenue Movement

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4
8 Industrial/Defense
19
Automobile
25
12
Household/Game
12
7
Phone/Peripheral
13
25
6
Network
25 NB/Tablet/Peripheral
20
Semiconductor/IC
11 12
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202101-202104

202201-202204

10000

年營收

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台幣百萬
-
9000 Uncertainty of global economy
-Delay of 3D AOI launch
-Low price competition in China
8000
Improved
Decline of PC/NB
Increase of smart product
application mobile devices competitiveness
7000
application
- -
Economic
Rush capacity
5870
6000 buy triggered by recovery
5607
economic recovery 5388 - Blue-ocean
4919 4951
5000 4754
4387
New FCT
New AOI 7500
4084
+7500/L/D
is not launched 3778 3894
4000 T
until ’06. 3601
New 7500
Economic
+7006L 3100
New SPI recession
3000 7006
2541
+7100EP
2055 2074
2000 New AOI 1706
7100 1553 1470
1000
569 [777 ] [902 ]
0
'01 '02 '03 '04 '05 '06 '07 '08 '09 '10 '11 '12 '13 '14 '15 '16 '17 '18 '19 '20 '21
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每股盈餘

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7
6.43
6
5.34
5.03 5.02
4.87
5 4.67 4.63
4.48 4.51
4.23
4 4.45
3.97
3.41
3 3.19 2.53
2.52
2 2.17
1.82
1
1.02
0
'03 '04 '05 '06 '07 '08 '09 '10 '11 '12 '13 '14 '15 '16 '17 '18 '19 '20 '21
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紅海與藍海市場營收變化

台幣百萬

藍海 紅海 毛利率 8,000 80% 紅海市場 : 藍海市場之產品與應用 : - - 較低技術門檻 3D AOI 7,000 - - 價格導向 高精密電子料件量測 70% - 先進半導體製程檢測需求 6,000 - AXI - 電路板測試機 5,000 54% 58% 60% 57% 55% 55% 1,825 (~Q1) 4,000 53% 53% 53% 1,856[1,453 1,689 ] 3,123 50% 3,000 46% 1,592 1,517 4,955 3,782 750 2,000 3,262 3,063 2,934 (67%) 40% (66%) (62%) 2,009 (67%) 1,000 1,631 1,583 1,710 (56%) 914 (34%) (51%) (70%) (16%) 0 30% 2014 2015 2016 2017 2018 2019 2020 2021 2022.4

60%

TRI 3D AOI Product Roadmap

TR7700QB SII TR7700Q(L) SII (DL) - -12M/15um 12M/15um -12M/12um TR7500QE Plus - -12M/10, 12, 15um 12M/10um + 4 Sideview - 12M/5.5um TR7700(L) QE -12M/15,10um - TR7700QM SII 12M/5.5um TR7500(L) QE -12M/15,10um+4 Sideview • TR7700 QE-S -12M/5.5um,3.45um AOM & AI SW module • • 4x DLP + Omni color RGBW lighting Optional Laser module • • Optional DFF module Optional Laser module • Optional DFF module

2019 2020

2021

2022

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Confidential

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NEW
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TR7500QE Plus 3D AOI 特點

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Multi-Angle 3D Side View Metrology-Grade Inspection

Industry-Leading Speed with High Accuracy Resolution

Powered by TRI’s Flexible Algorithms, Smart Programming and AI Technology

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Confidential

TRI AOI 產品應用

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SMT 元件
0201 >> 15 um
01005 >> 10 um
TR7700Q(M) SII
Mini LED 應用
2D TR7700 SIII Plus @ 5.5 um
3D TR7700Q(M) SII @ 5.5um
3D TR7700QE-S @ 5.5 / 3.45 um
系統封裝 (SiP)/
+ Laser @ 10/20 um
填充膠 (Underfill) TR7700QE-S
晶圓 (Wafer)
TR7700QE-S +IR
@ 3.45 um TR7960A (DFF)
黏晶 (Die Bond) + Laser @ 10/20 um
檢測
打線 (Wire Bond)
+ DFF @ 1.0 / 0.5 um
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TR7700QE-S 3D AOI 特點

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:
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Supports 3.45 / 5.5um Ultra High Resolution

: 可支援半導體封裝等級檢測應用 貼片元件 (SMD) 表面凸塊 (Bump) 黏晶 / 打線接合 (Die / Wire Bonding) 填充膠 (Underfill)

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Confidential

升級 DFF 3D 科技 Only available for TR7700Q

 Optimal focus position

0.5 µm 1 µm 超高解析度

 Clearer 2D Images  Sharper images  Shadow-free 3D Image

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Semiconductor - 打線接合 (Wire bond)

SMT – 錫點 (Solder joint)

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: 整合多項視覺核心新技術 因應

• 高精密電子料件量測需求

• - 先進半導體製程 / 封裝檢測需求

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Calibration
校正技術 雷射 條紋光 深度對焦
(Laser) (Fringe (DFF)
)
TRI AOI
Metrology
量測
Linear
共線性
Linearity
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Linearity

TRI 整合完整的解決方案

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Metrology
Multi-Sensing
AOM
2D/3D
AOI & AVI
Industry 4.0
Hermes/CFX
TRI
SECS/GEM AI
AOI
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全新 TRI 量測功能 (AOM)

 UI: New designed and friendly user interface

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 Features: More complete measurement functions will be available

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量測元素
構造方法
量測目標
指定座標系
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• High Flexibility: Multi-Layer measurements

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TRI’s SPI 最新應用項目

Fast Inspection Precision Speed Inspection

Smart Factory

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5.5
μm
Large FOV High Resolution Closed Loop
CoaXpress Technology Shadow Free IPC-CFX
Dynamic Imaging Smart Warpage Technology Smart Library
Stop & Go Imaging High Inspection Range YMS 4.0
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Confidential

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NEW
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TR7007D/Q Plus Series SPI 新應用特點

Improved Inspection Stability and Capability

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Enhanced 2D Light Improved Imaging

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Full Size Support Pin (Optional)

Easy Maintenance

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New Log Interface

Easy hardware Upgrading design

NEW Motion Controller

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NEW
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TR7007 SII Ultra Series SPI 特點

Next Generation of the Award Winning TR7007 SII Plus

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Confidential
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New Mechanical Structure 13%[+ ] Minimal Vibration, More Rigid Frame Improved GR&R

New Motion Controller Flexible Communication Protocol Max. Solder Height Dual Fringe Pattern Projection 420 μm / 385 μm Higher Top Clearance 50mm * Compared to TR7007 SII Plus

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完備的 3D 在線型 AXI

NEW

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TR7600(LL/TL) SIII

NEW

TR7600F3D(LL) SII

TRI 新一代具指標性的在線型 PCBA 檢測解決方案。結合了業界 最快速的高解析取像速度，並在先 進的自動 X 光檢測中大大提升了影 像品質。

大幅提升檢測速度的高解析度 在線型 3D AXI ，並可應用 CT 電腦斷層掃描科技 ，專門用於 檢測需要高影像品質的組裝電 路板和軟板組件。

* Linear Motion

* Circular Motion

( 運作機制 : 區域環形掃描 )

( 運作機制 : 線性掃描 )

TRI AXI - BGA 檢測應用

Product Type Examples Inspection Criteria TRI AXI Application

ADAS, Radar Module, Communication Module BGA Void, Open 3D CT Inspection

3D CT ( 電腦斷層掃描 )

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TR7600F3D SII 影像

TRI ICT/BT 應用

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Automation

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Laptops

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White Goods

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Flex Boards

Automobile

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Smart Factory

Customized FCT

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Confidential

TR5001 SII Series ICT/BT 特點

• Multi/Merge Core Parallel Testing

• Improved Test Accuracy and Capability

• New and Improved Test Modules

• Intelligent Software Interface

• QDI Fixture Interface

• Inline and Manual Handler

• In System LED Analyzer

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Confidential

高密度測試點數 ICT TR8100H SII / TR8100HL SII

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Cable-less High Pin Count ATE NEW
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Original Test Points. New SII Model Model TR8100LV 3584 pins 7056 pins ~~SII~~ TR8100LLV 5632 pins 11088 pins

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Confidential

TR8100H SII ICT - 產業應用

• Server/Data Center/Networking main boards

• Test pins range 3000~5000

• 5G Base Stations

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NEW
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• Charging facility

智慧工廠解決方案

Big Data Ready

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Smart Monitoring

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TRI 支援封閉迴路控制系統 TRI SPI, AOI, AXI 檢測資訊的串流 IPC CFX(data)/HERMES(M2M)

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Data & Image Skip board
Feedback Feedforward
Feedback data
SPI Pre-reflow AOI Post-reflow AOI AXI
TR7007Q Plus TR7710 TR7700Q SII TR7600 SIII
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TRI YMS 4.0 良率管理系統 協助客戶提升生產力及品質管理

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• 實時狀態檢查

• 監控生產問題改善狀況

• SPC 和生產力監控

• PDCA 改善循環

• 列出排名前 10 的不良項目和對應圖像

• 支持品質優化

• 依各站別 , 線別 , 流程找出問題點

• 輸出報告到 MES / SFCS

工業 4.0 解決方案

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Confidential

TRI 的 AI 應用

檢測階段 AI

缺陷檢測 / 字元識別 / 視覺檢測 / 量測輔助 優點：提高檢測品質，減少誤判

複判階段

維修站缺陷分類和複檢 優點：減少人工複檢的工作量

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AOI
SPI
AXI
TRI 檢測解決方案 TRI AI 工作站 維修 / 複判站
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TRI 的 AI 應用

1. AI 智慧編程 (Smart Programing)

• 2. AI 工作站 : 伺服器 終端架構的 AI 檢測及調試

3. AI 智能複判主機 (Verify Host): AI 維修 / 複判站 (Repair Station) 管理

4. AI : 檢測

• 字元辨識 (OCV/OCR)

• 瑕疵檢測

• 待測物外觀檢測

• 異物檢測

TRI AI 發展藍圖

 Future Plans

短期

中期

長期

 技術深耕

• AI Station/Training Tool

• Big Data: 更多內建 AI 網路  提升檢測能力

 擴大發展

 願景

 更快速及更精確  零漏測、零誤判  更簡易及更快速的訓練  無人化 AOI  應用面擴展

 AI 應用:

♦ 自動編程

• ♦ 字元辨識/錫點/ 外觀 檢測 /定位

• ♦ 維修站覆判

• ♦ 半導體 : Wire bond

• ♦ 智能參數調試 ♦ 異常偵測

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♦ 3D 資料重建
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♦ 新軟體平台
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♦ 將 AI 內化到設計中
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34

內部研發團隊

• .

• •Optical Dept. • system S/W • Mechanical Dept. YMS, R/S

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•PLC control
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•Lighting control

光學檢測 電路板測試

200[+] RD

外部機構技術支援

Department of Computer science, 台灣大學 - 影像處理 / Understanding

Department of Power Mechanical, 清華大學

• X-ray 3D Reconstruction/Digital Tomosynsis Algorithm/ 電腦切層演算法

• Center of Measurement Standards, 工研院

• Length/ Camera / 色彩校正

近年獲獎

 2016 Global Technology Award  2017 Circuits Assembly NPI Award  2017 EM Asia 創新獎  2018 Circuits Assembly NPI Award  2018 EM Asia 最佳供應商獎  2019 Global Technology Award  2019 EM Asia 傑出產品獎  2020 Global Technology Award  2021 EM Asia 創新獎  2021 Global Technology Award

• TRI’s Company Milestones: https://www.tri.com.tw/tw/about/about-21-1-2.html

免責聲明

本簡報資料所提供之資訊，包含所有前瞻性的 看法，德律科技股份有限公司（本公司）將不 會因任何新的資訊、未來事件、或任何狀況的 產生而負有更新或修正本簡報資料內容之責 任。本簡報資料中所提供之資訊並未明示或暗 示的表達或保證其具有正確性、完整性、或可 靠性，亦不代表本公司、產業狀況或後續重大 發展的完整論述。

Better Testing Better Quality

THANK YOU! For more information about

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Test Research, Inc. Please visit:

www.tri.com.tw

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