TRI — Investor Presentation 2020

May 22, 2020

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Test Research, Inc. www.tri.com.tw

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Test Research, Inc.

• Establishment: April, 1989

• Founder & CEO: Jason Chen

• Capital: TWD 2362 million

( USD 78 million)

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Main Product Line

• IT(Image Tester)

• SPI(Solder Paste Inspection)

• � Pre-reflow AOI / Post-reflow AOI � AXI(Automatic X-ray Inspection)

• BT(In-Circuit Board Tester)

• � MDA � ICT

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One Stop Solution Provider in PCBA Production

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Global Service Network

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TRI Office
Distributors
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Electronic Industry/Revenue Movement

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4
12 Industrial/Defense
16
Automobile
29 12
Household/Game
16
14 Phone/Peripheral
13 Network
27
11
PC/NB/Peripheral
15
14
Semiconductor/IC
8 9
201901-201904 202001-202004
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Major Competitors

� Korea: Koh Young � Japan: Omron � China: Jutze/Sinic-Tek/Holly � Malaysia: Vitrox � USA: Keysight/Teradyne � Europe: Viscom/SPEA

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10000 Annual Sales
NTD Million
-
9000 Uncertainty of global economy
-Delay of 3D AOI launch
-Low price competition in China
8000
-
Economic
Increase of smart
Decline of PC/NB mobile devices recovery
7000 application application - Blue-ocean
Rush capacity 5870
6000 buy triggered by
economic recovery 5388
4919
5000 4754
4387
New FCT
New AOI 7500
4084
+7500/L/D
is not launched 3778 3894
4000 T
until ’06. 3601
New 7500
Economic
+7006L 3100
New SPI recession
3000 7006
2541
+7100EP
2055 2074
2000 New AOI 1706
7100 15531470
1000 569 [777] [902]
0
'01 '02 '03 '04 '05 '06 '07 '08 '09 '10 '11 '12 '13 '14 '15 '16 '17 '18 '19
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CONFIDENTIAL

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Red & Blue-ocean Market Movement in Revenue
NTD Million
Blue-ocean Red-ocean Gross margin %
8,000 80%
Blue-ocean:
-
3D AOI
7,000
-
Dimensional metrology for electronic parts
- 70%
Semiconductor process
6,000 -
AXI
-
BT
5,000
60%
57%
55%
53% 56%
4,000 53% 53%
1,453 Q1
1,856
3,123 50%
3,000 46%
1,592
1,517
4,955
2,000
3,063
2,934 40%
(62%) 559
2,009 (67%)
1,000 1,631 1,583
914 (34%) (51%) (56%) 1,084
(16%) (66%)
0 30%
2014 2015 2016 2017 2018 2019 2020.4
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TRI Integrated Total Solution
Metrology
Multi-Sensing
AOM
2D/3D
AOI & AVI
Industry 4.0
Hermes/CFX
TRI
SECS/GEM AI
AOI
10
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Upgrade DFF 3D Technology

� Optimal focus position � Clearer 2D Images � Sharper images � Shadow-free 3D Image

0.5 µm 1 µm Ultra High Resolution

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Semiconductor -Wire bond

SMT –Solder joint

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11

TRI New TRI Measurement Functions

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• UI: New designed and friendly user interface

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� Features: More complete measurement functions will be available

Measure Feature Construction Method Measure Target Assign System

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� High Flexibility: Multi-Layer measurements

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12

AOM Development Progress

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2019 2020 Q1 Q1-Q2 Ellipse/Rectangle Point/Line/Circle/Distance/Angle GRR/Cpk Bisect Line/Regression Line Component center system/pin edit/ shift XY angle calculate LED matrix tool 2019 2020 Q3-Q4 Q2 ～ System/Calculator Plane(3D flatness)/Arc/Slot Perpendicular Line Outlier Rejection(2D/3D) System Level

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TRI 3D AOI Product Roadmap

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TR7700Q SII/TR7700QE SII/ TR7500QE SII

TR7700Q/TR7700QE/ TR7500QE • 4M/15um,12M/10um

• • 4 x Angled Cameras

• 4x DLP + Omni color RGBW lighting

• • Optional Laser module

• TR7500QE SII: Top 12M Camera/ 15,10um +1 DLP + 4 Angled Cameras

• 25 % speed up

• AOM and AI capability

• Omni color RGBW lighting

• Optional Laser module

• Optional DFF module

• Optional DFF module

• TR7700QE-S 5.5um/3.45um (for 0201M, Die/Wire bonding)

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2018

2020

2019

2021

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NEW
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TR7700Q SII 3D AOI Highlight

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Industry-Leading Inspection Speed up to 57 cm [2] /sec

Ease of Programming with TRI’s Smart Library Multiple 3D Technologies: Zero-escapes Inspection

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15

Confidential

TR7700QE-S 3D AOI Highlight

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Supports 3.45 / 5.5um Ultra High Resolution

Inspection Solutions for Semiconductor Packaging Level:

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SMD
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Underfill
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16

Confidential

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TRI’s SPI Innovations
Fast Inspection Precision Smart
Speed Inspection Factory
5.5
μm
Large FOV High Resolution Closed Loop
CoaXpress Technology Shadow Free IPC-CFX
Dynamic Imaging Smart Warpage Technology Smart Library
Stop & Go Imaging High Inspection Range YMS 4.0
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Confidential

A Full Line of 3D In-Line AXI

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TR7600F3D SII
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TR7600TL SIII TR7600F3D SII High performance and high Faster inspection speed 3D AXI for the speed, ultra high largest server, networking resolution 3D CT X-ray and power PCBs. TRI's inspection, highest Planar CT technology image quality brings true 3D solder joint maximize production review for maximum yields on any inspection accuracy. production line.

TR7600 SIII

A new generation of TRI’s
hallmark inline PCBA inspection
solutions. Designed for 100%
inspection coverage at production
line speed, industry’s fastest high
resolution imaging speed with
greatly improved image quality in
the industry's most advanced
automatic X-ray inspection.

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BT Parallel Test for Different DUTs (Multi-Program)

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TR5001 SII Quad-code System
Testing Time Comparision
10
101.1%
100% 100.2%
9
TR5001 SII Single-Core TR5001 SII Dual-Core TR5001 SII Quad-Core
(100.0%) (100.2%) (101.1%)
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High Density Pin Count ICT TR8100LV SII / LLV SII

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Model 測試點數 / 腳位 New SII Model TR8100LV 3584 ins 5264 ins p p TR8100LLV 5632 ins 8272 ins p p

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NEW
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20

Confidential

TRI Support Closed Loop Solutions TRI SPI, AOI, AXI Inspection Integration CFX ( data ) /HERMES ( M2M )

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D ata & I Ski b d
mage p oar
Feedback Feedforward
Feedback data
P re-re fl ow P os t -re fl ow
SPI AXI
AOI AOI
TR7007QI TR7600 SIII
TR7710 TR7700QE
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YMS 4.0 Support Industry 4.0 TRI combines SPI, AOI & AXI Data to Improve Yields with Yield Management System (YMS) by:

• Overall Image and Data Integration

• SPC Trend Monitoring

• Drill Down Root Cause Analysis

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TRI AI Application

� Front Section

• For Defect & Appearance inspection/OCR/Measurement Assistance

• Purpose: Improve the over-kill and under-kill rate.

� Rear Section

• Repair Station: After AOI machine, review the defects and classify between real defects and false alarms.

• Purpose: To decrease the loading of operators.

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TRI’s AI Development Roadmap

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AI Road Map:

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Short Term Mid-Term Long Term
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• �Fast development �Technical cultivation �Unmanned AOI � Commercial Library � Open-source Solution � Zero escape and false call � Cooperation � Inference/Training Server � TRI Standard Spec � Faster and more accurate

AI applications:

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♦ RS Second ♦ Cosmetic ♦ Anomaly
stage review Inspection inspection
♦ AI Foreign ♦ IC Lift lead ♦ Auto
material inspection programming
inspection ♦ AI Alignment ♦ Agile training
♦ AI OCR (at customer
♦ Wire Bond
site)
Inspection
2019 2020 2021~
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In-house RD Team

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.
•Optical Dept. • system S/W
• Mechanical Dept. YMS, R/S
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•PLC control
•Lighting control
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IT
BT
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180 [+] RD

Outside Support

Department of Computer science, National Taiwan Univ. - Image processing / Understanding Department of Power Mechanical, Tsing Hua Univ., Taiwan - X-ray 3D Reconstruction/Digital Tomosynsis Algorithm/ CT algorithm Center of Measurement Standards, Industrial Technology Research Institute Taiwan

• -- Length/ Camera / Color calibration

Recent Awards

� 2016 EM Asia Best Supplier Award � 2016 Global Technology Award � 2017 EM Asia Innovation Award � 2017 Circuits Assembly NPI Award � 2018 Circuits Assembly NPI Award � 2018 EM Asia Innovation Award � 2018 EM Asia Best Supplier Award � 2019 EM Best Product Award

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EPS
7
6.43
6
5.34
4.87
5 4.67 [5.03]
4.48
4.51
4.23
4.45
4 3.97
3.41
3.19
3
2.53
2.17 2.52
2
1.82
1 1.02
0
'03 '04 '05 '06 '07 '08 '09 '10 '11 '12 '13 '14 '15 '16 '17 '18 '19
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Safe Harbor Notice

TRI’s statements of its current expectations are forward looking statements subject to significant risks and uncertainties and actual results may differ materially from those contained in the forward-looking statements. Except as required by law, we undertake no obligation to update any forward-looking statement, whether as a result of new information, future events, or otherwise.

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Better Testing Better Quality

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THANK YOU! For more information about Test Research, Inc. Please visit: www.tri.com.tw

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