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TRI — Investor Presentation 2020
Nov 23, 2020
52263_rns_2020-11-23_f93334f1-5aa5-4098-b9c0-7cf777b676ff.pdf
Investor Presentation
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Test Research, Inc. www.tri.com.tw
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Test Research, Inc.
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Establishment: April, 1989
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Founder & CEO: Jason Chen
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Capital: TWD 2362 million
( USD 78 million)
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Main Product Line
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IT(Image Tester)
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SPI(Solder Paste Inspection)
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� Pre-reflow AOI / Post-reflow AOI � AXI(Automatic X-ray Inspection)
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BT(In-Circuit Board Tester)
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� MDA � ICT
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One Stop Solution Provider in PCBA Production
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Integration of Vision Technologies for the Demands :
- Dimensional Metrology for Electronic Parts
- Semiconductor Manufacturing/Packaging Process
Calibration
校正技術
Laser Fringe DFF
TRI AOI
Metrology
Linear
共線性
Linearity
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Global Service Network
More than 3000 customers have been serviced through worldwide partners More than 50 distributors and Rep. worldwide.
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Electronic Industry/Revenue Movement
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4
8 Industrial/Defense
15
Automobile
27
13
Household/Game
17
14
Phone/Peripheral
11
15
Network
10
24 PC/NB/Peripheral
19
Semiconductor/IC
11 12
201901-201909 202001-202009
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Major Competitors
� Korea: Koh Young � Japan: Omron � China: Jutze/Sinic-Tek/Holly � Malaysia: Vitrox � USA: Keysight/Teradyne � Europe: Viscom/SPEA
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10000 Annual Sales
NTD Million
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9000 Uncertainty of global economy
-Delay of 3D AOI launch
-Low price competition in China
8000
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Economic
Increase of smart
Decline of PC/NB mobile devices recovery
7000 application application - Blue-ocean
Rush capacity 5870
6000 buy triggered by
economic recovery 5388
4919
5000 4754
4387
New FCT
New AOI 7500
4084
+7500/L/D
is not launched 3778 3894
4000 T
until ’06. 3601
New 7500
Economic
+7006L 3100
New SPI recession
3000 7006
2541
+7100EP
2055 2074
2000 New AOI 1706
7100 15531470
1000 569 [777] [902]
0
'01 '02 '03 '04 '05 '06 '07 '08 '09 '10 '11 '12 '13 '14 '15 '16 '17 '18 '19
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EPS
7
6.43
6
5.34
4.87
5 4.67 [5.03]
4.48
4.51
4.23
4.45
4 3.97
3.41
3.19
3
2.53
2.17 2.52
2
1.82
1 1.02
0
'03 '04 '05 '06 '07 '08 '09 '10 '11 '12 '13 '14 '15 '16 '17 '18 '19
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CONFIDENTIAL
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Red & Blue-ocean Market Movement in Revenue
NTD Million
Blue-ocean Red-ocean Gross margin %
8,000 80%
Blue-ocean:
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3D AOI
7,000
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Dimensional metrology for electronic parts
- 70%
Semiconductor process
6,000 -
AXI
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BT
5,000
60%
57%
55%
55%
53%
4,000 53% 53%
1,453
1,856 1,306
3,123 50%
3,000 46%
1,592
1,517
4,955
2,000
3,063
2,934 40%
2,702
(62%)
2,009 (67%) (67%)
1,000 1,631 1,583
(56%)
914 (34%) (51%)
(16%)
0 30%
2014 2015 2016 2017 2018 2019 2020.9
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TRI Integrated Total Solution
Metrology
Multi-Sensing
AOM
2D/3D
AOI & AVI
Industry 4.0
Hermes/CFX
TRI
SECS/GEM AI
AOI
12
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Upgrade DFF 3D Technology
� Optimal focus position � Clearer 2D Images � Sharper images � Shadow-free 3D Image
0.5 µm 1 µm Ultra High Resolution
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Semiconductor -Wire bond
SMT –Solder joint
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13
TRI 3D AOI Product Roadmap
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SMT Components
0201 >> 15 um
01005 >> 10 um
Mini LED Application
2D TR7700 SIII Plus @ 5.5 um
3D TR7700QE-S @ 5.5 / 3.45 um
SiP/Underfill INSP + Laser @ 10/20 um
Wafer / InFO
(TR7700QE-S
+IR) @ 4 um
7960A (DFF)
Die Bond
+ Laser @ 10/20 um
Inspection
Wire Bond INSP
+ DFF @ 1.0 / 0.5 um
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TRI 3D AOI Product Roadmap
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TR7700Q SII/TR7700QE SII/ TR7500QE SII
TR7700Q/TR7700QE/ TR7500QE • 4M/15um,12M/10um
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- 4 x Angled Cameras
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4x DLP + Omni color RGBW lighting
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•Optional Laser module -
TR7500QE SII: Top 12M Camera/ 15,10um +1 DLP + 4 Angled Cameras
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25 % speed up
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AOM and AI capability
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Omni color RGBW lighting
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Optional Laser module
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Optional DFF module
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Optional DFF module
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TR7700QE-S 5.5um/3.45um (for 0201M, Die/Wire bonding)
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2018
2020
2019
2021
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NEW
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TR7700Q SII 3D AOI Highlight
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Industry-Leading Inspection Speed up to 57 cm [2] /sec
Ease of Programming with TRI’s Smart Library Multiple 3D Technologies: Zero-escapes Inspection
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16
Confidential
TR7700QE-S 3D AOI Highlight
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Supports 3.45 / 5.5um Ultra High Resolution
Inspection Solutions for Semiconductor Packaging Level:
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SMD
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Underfill
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17
Confidential
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TRI’s SPI Innovations
Fast Inspection Precision Smart
Speed Inspection Factory
5.5
μm
Large FOV High Resolution Closed Loop
CoaXpress Technology Shadow Free IPC-CFX
Dynamic Imaging Smart Warpage Technology Smart Library
Stop & Go Imaging High Inspection Range YMS 4.0
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Confidential
A Full Line of 3D In-Line AXI
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TR7600F3D SII
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TR7600TL SIII TR7600F3D SII High performance and high Faster inspection speed 3D AXI for the speed, ultra high largest server, networking resolution 3D CT X-ray and power PCBs. TRI's inspection, highest Planar CT technology image quality brings true 3D solder joint maximize production review for maximum yields on any inspection accuracy. production line.
TR7600 SIII
A new generation of TRI’s
hallmark inline PCBA inspection
solutions. Designed for 100%
inspection coverage at production
line speed, industry’s fastest high
resolution imaging speed with
greatly improved image quality in
the industry's most advanced
automatic X-ray inspection.
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BT Parallel Test for Different DUTs (Multi-Program)
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TR5001 SII Quad-code System
Testing Time Comparision
10
101.1%
100% 100.2%
9
TR5001 SII Single-Core TR5001 SII Dual-Core TR5001 SII Quad-Core
(100.0%) (100.2%) (101.1%)
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High Density Pin Count ICT TR8100H SII / TR8100HL SII
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NEW
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Original Test Points. New SII Model Model TR8100LV 3584 pins 7056 pins ~~SII~~ TR8100LLV 5632 pins 11088 pins
21
Confidential
New TRI Measurement Functions(AOM)
- UI: New designed and friendly user interface
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- Features: More complete measurement functions will be available
Measure Feature Construction Method Measure Target Assign System
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� High Flexibility: Multi-Layer measurements
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22
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The Benefits of AI
Combines traditional Integrates different TRI
Reduces the labor cost
Image process data models to enhance the
of the production line
and AI technology production process
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Confidential
TRI's AI Application Can be divided in Two Phases
AI Defect Detection / Character Recognition / Visual Inspection / Measurement assistance Inspection PhasePhase Advantage: Improve Inspection Quality and Reduce False Calls RS Repair Station Defect Classification and Re-Inspection Phase Advantage: Reduce the workload of manual Re-Inspection AOI SPI AXI TRI Inspection Solutions TRI AI Station Repair Station(s)
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TRI’s AI Development Roadmap
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AI Road Map:
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Short Term Mid-Term Long Term
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Fast development�Technical cultivation�Unmanned AOI� Commercial Library � Open-source Solution � Zero escape and false call � Cooperation � Inference/Training Server � TRI Standard Spec � Faster and more accurate
AI applications:
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♦ RS Second ♦ Cosmetic ♦ Anomaly
stage review Inspection inspection
♦ AI Foreign ♦ IC Lift lead ♦ Auto
material inspection programming
inspection ♦ AI Alignment ♦ Agile training
♦ AI OCR (at customer
♦ Wire Bond
site)
Inspection
2019 2020 2021~
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YMS 4.0
Yield Management System
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•Improvement Monitoring -
•Real-Time Inspection Status -
•Support Quality Improvement -
•SPC and Productivity Monitoring -
•Output Reports to MES/SFCS -
•Top 5 or 10 defects & Images -
•PDCA improvement cycle -
•Issue Drill Down line, station or process
Industry 4.0 Solution
Confidential
TRI Support Closed Loop Solutions TRI SPI, AOI, AXI Inspection Integration CFX ( data ) /HERMES ( M2M )
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D ata & I Ski b d
mage p oar
Feedback Feedforward
Feedback data
P re-re fl ow P os t -re fl ow
SPI AXI
AOI AOI
TR7007QI TR7600 SIII
TR7710 TR7700QE
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In-house RD Team
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.
•Optical Dept. • system S/W
• Mechanical Dept. YMS, R/S
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•PLC control
•Lighting control
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IT
BT
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180 [+] RD
Outside Support
Department of Computer science, National Taiwan Univ. - Image processing / Understanding Department of Power Mechanical, Tsing Hua Univ., Taiwan - X-ray 3D Reconstruction/Digital Tomosynsis Algorithm/ CT algorithm Center of Measurement Standards, Industrial Technology Research Institute Taiwan
- -- Length/ Camera / Color calibration
Recent Awards
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2016 EM Asia Best Supplier Award
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�2016 Global Technology Award -
�2017 EM Asia Innovation Award�2017 Circuits Assembly NPI Award -
�2018 Circuits Assembly NPI Award -
�2018 EM Asia Innovation Award�2018 EM Asia Best Supplier Award -
�2019 EM Best Product Award�2020 Global Technology Award -
TRI’s Company Milestones:- - - -
https://www.tri.com.tw/tw/about/about 21 1 2.html
Safe Harbor Notice
TRI’s statements of its current expectations are forward looking statements subject to significant risks and uncertainties and actual results may differ materially from those contained in the forward-looking statements. Except as required by law, we undertake no obligation to update any forward-looking statement, whether as a result of new information, future events, or otherwise.
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Better Testing Better Quality
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THANK YOU! For more information about Test Research, Inc. Please visit: www.tri.com.tw
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