TRI — Investor Presentation 2020

Nov 23, 2020

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德律科技股份有限公司 www.tri.com.tw

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報告人 : 陳冠元 / 財務長兼代理發言人

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德律科技股份有限公司

• 成立時間 : 1989 年 4 月 10 日

• 創立人 : 陳玠源董事⻑

• 資本額 : 新台幣 23.62 億

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: 主力產品 電路板組裝檢測設備

• 自動光學檢測設備 (IT/Image Tester)

• � 錫膏自動光學影像檢測機 (SPI) � 自動光學影像檢測機 (AOI) � X-ray 自動檢測機 (AXI)

• 電路板測試機 (BT/In-Circuit Board Tester)

• � 組裝電路板測試機 (MDA) � 全功能電路板自動測試機 (ICT)

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全球唯一 “ 一條龍 ” 電路板組裝檢測設備廠 德律產品在客戶的電路板組裝產線的應用

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: 整合多項視覺核心新技術因應 - 高精密電子料件量測需求 - 先進半導體製程 / 封裝檢測需求

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Calibration
校正技術
Laser Fringe DFF
TRI AOI
Metrology
Linear
共線性
Linearity
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全球銷售服務網

主要客戶為全球各大電子產品組裝廠

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Electronic Industry/Revenue Movement

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4
8 Industrial/Defense
15
Automobile
27
13
Household/Game
17
14
Phone/Peripheral
11
15
Network
10
24 PC/NB/Peripheral
19
Semiconductor/IC
11 12
201901-201909 202001-202009
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主要競爭對手

� : 韓國 Koh Young �日本: Omron � 中國大陸: Jutze/Sinic-Tek/Holly �馬來西亞: Vitrox �美國: Keysight/Teradyne �德國: Viscom/SPEA

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10000
年營收
台幣百萬
-
9000 Uncertainty of global economy
-Delay of 3D AOI launch
-Low price competition in China
8000
-
Economic
Increase of smart
Decline of PC/NB mobile devices recovery
7000 application application - Blue-ocean
Rush capacity 5870
6000 buy triggered by
economic recovery 5388
4919
5000 4754
4387
New FCT
New AOI 7500
4084
+7500/L/D
is not launched 3778 3894
4000 T
until ’06. 3601
New 7500
Economic
+7006L 3100
New SPI recession
3000 7006
2541
+7100EP
2055 2074
2000 New AOI 1706
7100 15531470
1000 569 [777] [902]
0
'01 '02 '03 '04 '05 '06 '07 '08 '09 '10 '11 '12 '13 '14 '15 '16 '17 '18 '19
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每股盈餘
7
6.43
6
5.34
4.87
5 4.67 [5.03]
4.48
4.51
4.23
4.45
4 3.97
3.41
3.19
3
2.53
2.17 2.52
2
1.82
1 1.02
0
'03 '04 '05 '06 '07 '08 '09 '10 '11 '12 '13 '14 '15 '16 '17 '18 '19
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紅海與藍海市場營收變化

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台幣百萬
藍海 紅海 毛利率
8,000 80%
紅海市場 : 藍海市場之產品與應用 :
- -
較低技術門檻 3D AOI
7,000
- -
價格導向 高精密電子料件量測
70%
-
( 紅色供應鏈 ) 先進半導體製程檢測需求
6,000
-
AXI
-
電路板測試機
5,000
60%
57%
55% 55%
4,000 53% 53% 53%
1,453
1,856 1,306
3,123 50%
3,000 46%
1,592
1,517
4,955
2,000
3,063
2,934 40%
2,702
(62%)
2,009 (67%)
(67%)
1,000 1,631 1,583
(56%)
914 (34%) (51%)
(16%)
0 30%
2014 2015 2016 2017 2018 2019 2020.9
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TRI 整合完整的解決方案
Metrology
Multi-Sensing
AOM
2D/3D
AOI & AVI
Industry 4.0
Hermes/CFX
TRI
SECS/GEM AI
AOI
12
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升級 DFF 3D 科技

� Optimal focus position

0.5 µm 1 µm Ultra High Resolution

� Clearer 2D Images � Sharper images � Shadow-free 3D Image

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Semiconductor -Wire bond

SMT –Solder joint

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13

TRI 3D AOI Product Roadmap

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SMT Components
0201 >> 15 um
01005 >> 10 um
Mini LED Application
2D TR7700 SIII Plus @ 5.5 um
3D TR7700QE-S @ 5.5 / 3.45 um
SiP/Underfill INSP + Laser @ 10/20 um
Wafer / InFO
(TR7700QE-S
+IR) @ 4 um
7960A (DFF)
Die Bond
+ Laser @ 10/20 um
Inspection
Wire Bond INSP
+ DFF @ 1.0 / 0.5 um
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TRI 3D AOI Product Roadmap

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TR7700Q SII/TR7700QE SII/ TR7500QE SII

• TR7700Q/TR7700QE/ TR7500QE • 4M/15um,12M/10um

• • 4 x Angled Cameras

• 4x DLP + Omni color RGBW lighting

• • Optional Laser module

• TR7500QE SII: Top 12M Camera/ 15,10um +1 DLP + 4 Angled Cameras

• 25 % speed up

• AOM and AI capability

• Omni color RGBW lighting

• Optional Laser module

• Optional DFF module

• Optional DFF module

• TR7700QE-S 5.5um/3.45um (for 0201M, Die/Wire bonding)

2018

2019 2020

2021

15

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NEW
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TR7700Q SII 3D AOI 特點

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Industry-Leading Inspection Speed up to 57 cm[2] /sec Ease of Programming with TRI’s Smart Library Multiple 3D Technologies: Zero-escapes Inspection

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TR7700QE-S 3D AOI 特點

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Supports 3.45 / 5.5um Ultra High Resolution

Inspection Solutions for Semiconductor Packaging Level:

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SMD
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Underfill
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Confidential

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TRI’s SPI 最新應用項目
Fast Inspection Precision Smart
Speed Inspection Factory
5.5
μm
Large FOV High Resolution Closed Loop
CoaXpress Technology Shadow Free IPC-CFX
Dynamic Imaging Smart Warpage Technology Smart Library
Stop & Go Imaging High Inspection Range YMS 4.0
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Confidential

完備的3D在線型 AXI

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TR7600 SIII

TR7600TL SIII

TR7600F3D SII

為TRI新一代具指標性的在線 型PCBA檢測解決方案。 TR7600SIII包含可配合生產線 速度達到100%檢測覆蓋率的 設計，結合了業界最快速的高 解析取像速度，並在業界最先 進的自動X光檢測中大大提升 了影像品質。

針對大型伺服器、網通 應用和大型PCB所設計 的高性能、高速3D AXI 。

大幅提升檢測速度的 高解析度在線型3D AXI，並可應用CT電 腦斷層掃描科技，專 門用於檢測需要高影 像品質的組裝電路板 和軟板組件。

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- 電路板測試機 多核心配置

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TR5001 SII Quad-code System 單核心與多核心測試時間比較
10
101.1%
100% 100.2%
9
TR5001 SII Single-Core TR5001 SII Dual-Core TR5001 SII Quad-Core
(100.0%) (100.2%) (101.1%)
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高密度測試點數ICT TR8100H SII / TR8100HL SII

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NEW
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Original 測試點數 / 腳位 New SII Model Model TR8100LV 3584 pins 7056 pins ~~SII~~ TR8100LLV 5632 pins 11088 pins

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全新 TRI 量測功能 (AOM)

� UI: New designed and friendly user interface

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�
Features: More complete 量測元素
measurement functions will be
構造方法
available
量測目標
指定座標系
� High Flexibility: Multi-Layer
measurements
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22

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AI 應用優點
Combines traditional Integrates different TRI
Reduces the labor cost
Image process data models to enhance the
of the production line
and AI technology production process
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Confidential

TRI 的AI應用

Defect Detection / Character Recognition / Visual Inspection / Measurement assistance 檢測階段AI Advantage: Improve Inspection Quality and Reduce False Calls Repair Station Defect Classification and Re-Inspection 複判階段 Advantage: Reduce the workload of manual Re-Inspection

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AOI
SPI
AXI
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TRI Inspection Solutions TRI AI Station

Repair Station(s)

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TRI AI 發展歷程及 規劃 Roadmap

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AI Road Map:

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Short Term Mid-Term Long Term
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• Fast development � Technical cultivation � Unmanned AOI � Commercial Library � Open-source Solution � Zero escape and false call � Cooperation � Inference/Training Server � TRI Standard Spec � Faster and more accurate

AI applications:

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♦ RS Second ♦ Cosmetic ♦ Anomaly
stage review Inspection inspection
♦ AI Foreign ♦ IC Lift lead ♦ Auto
material inspection programming
inspection ♦ AI Alignment ♦ Agile training
♦ AI OCR (at customer
♦ Wire Bond
site)
Inspection
2019 2020 2021~
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TRI YMS 4.0 良率管理系統 協助客戶提升生產力及品質管理

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• 實時狀態檢查

• 監控生產問題改善狀況

• SPC 和生產力監控

• PDCA 改善循環

• 列出排名前 10 的不良項目和對應圖像

• 支持品質優化

• 依各站別 , 線別 , 流程找出問題點

• 輸出報告到 MES / SFCS

工業4.0解決方案

Confidential

TRI支援封閉迴路控制系統 TRI SPI, AOI, AXI 檢測資訊的串流 IPC CFX ( data ) /HERMES ( M2M )

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D ata & I Ski b d
mage p oar
Feedback Feedforward
Feedback data
P re-re fl ow P os t -re fl ow
SPI AXI
AOI AOI
TR7007QI TR7600 SIII
TR7710 TR7700QE
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內部研發團隊

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. •PLC control
•Optical Dept. • system S/W
•Lighting control
• Mechanical Dept. YMS, R/S
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光學檢測
電路板測試
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180 [+] RD

外部機構技術支援

Department of Computer science, 台灣大學 - 影像處理 / Understanding

Department of Power Mechanical, 清華大學

• X-ray 3D Reconstruction/Digital Tomosynsis Algorithm/ 電腦切層演算法

• Center of Measurement Standards, 工研院 - Length/ Camera / 色彩校正

近年獲獎

�2016 EM 最佳供應商獎 � 2016 Global Technology Award

�2017 EM 亞洲創新獎 � 2017 Circuits Assembly NPI Award � 2018 Circuits Assembly NPI Award �2018 EM 亞洲創新獎 �2018 EM 最佳供應商獎 �2019 EM 傑出產品獎 � 2020 Global Technology Award

*德律歷年研發成果/獲獎紀錄: - - - https://www.tri.com.tw/tw/about/about 21 1 2.html

免責聲明 本簡報資料所提供之資訊，包含所有前瞻性的 看法，德律科技股份有限公司（本公司）將不 會因任何新的資訊、未來事件、或任何狀況的 產生而負有更新或修正本簡報資料內容之責 任。本簡報資料中所提供之資訊並未明示或暗 示的表達或保證其具有正確性、完整性、或可 靠性，亦不代表本公司、產業狀況或後續重大 發展的完整論述。

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Better Testing Better Quality

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THANK YOU! For more information about Test Research, Inc. Please visit: www.tri.com.tw

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