Tower Semiconductor Ltd. — Call Transcript 2006

Jul 23, 2006

July 17, 2006

Tower Semiconductor Ltd. Second Quarter and Six Months 2006 Earnings Conference Call

Monday July 17, 6:00 am ET

MIGDAL HAEMEK, Israel, July 17 /PRNewswire-FirstCall/ -- Tower Semiconductor Ltd. (Nasdaq: TSEM; TASE: TSEM), a pure-play independent specialty foundry, will hold its quarterly conference call to discuss second quarter and six months 2006 results on Wednesday, July 26, 2006, at 11:00 a.m. Eastern Time, 10:00 a.m. Central, 9:00 a.m. Mountain, 8:00 am Pacific and 18:00 Israel Time.

Tower Semiconductor will issue the second quarter and six months 2006 earnings release on Wednesday, July 26, 2006 during pre-market hours.

This call is being webcast by Thomson/CCBN and can be accessed at Tower Semiconductor's web site at http://www.towersemi.com or you can call in the U.S. and in Israel to participate in the conference by calling a domestic number.

    1-866-744-5399 (U.S. Toll-Free)
    03-918-0609 (Israel)
    972-3-918-0609 (International)

The teleconference will be available for replay for 90 days at: http://www.companyboardroom.com.

The webcast is also being distributed through the Thomson StreetEvents Network to both institutional and individual investors. Individual investors can listen to the call at http://www.earnings.com, Thomson/CCBN's individual investor portal, powered by StreetEvents. Institutional investors can access the call via Thomson's password-protected event management site, StreetEvents (http://www.streetevents.com).

About Tower Semiconductor

Tower Semiconductor Ltd. is a pure-play specialty wafer foundry established in 1993. The company manufactures integrated circuits with geometries ranging from 1.0 to 0.13 microns; it also provides complementary manufacturing services and design support. In addition to digital CMOS process technology, Tower offers advanced non-volatile memory solutions, mixed-signal and CMOS image-sensor technologies. To provide world-class customer service, the company maintains two manufacturing facilities: Fab 1 has process technologies from 1.0 to 0.35 microns and can produce up to 16,000 150mm wafers per month. Fab 2 features 0.18-micron and below process technologies, including foundry-standard technology. Fab 2 has current capacity of up to 15,000 200mm wafers per month.