TA LIANG — Investor Presentation 2026

Jun 1, 2026

大量科技
TA LIANG

Precision Intelligence for
Advanced Packaging & High-Complexity Manufacturing

大量科技 · TWSE Listed · Investor Presentation 2025

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大量科技
TA LIANG

Dual Growth Engines

OCR FOUNDATION

Proprietary Controller

Proprietary SW Stacks

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大量科技
TA LIANG

From through-hole to sub-mil

MORE LAYERS - FINER PITCH

Complexity-Led Growth

Value driven by board complexity, not mere volume

ACCURACY · REPEATABILITY

Precision & Spindle Count

Rewards control, software intelligence over raw throughput

HIGH VALUE PER UNIT

AI Boards Drive CapEx

AI/server boards consume outsized drilling/routing CapEx

MARGIN EXPANSION

High-End Pricing Power

Physics-limited supply improves pricing discipline industry-wide

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大量科技
TA LIANG

Vertically integrate intelligence, control logic & motion

Intelligence is invented

• Full control of the roadmap
• Pre-tuned to our machine's exact mechanics
• Independent of supplier release cycles

1980
Founded

Hardware is sourced

2012
Vision alignment

2018
Semiconductor BU

High-speed spindle

XY table

Chassis

Depth control

Dust & cooling

CCD

Sensors

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In real time – our controller manages

• Orchestrates six spindles across three axes simultaneously
• Executing closed-loop corrections at sub-millisecond intervals
• Delivering micron-class repeatability at full production throughput

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Accumulated intelligence of the entire platform

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大量科技
TA LIANG

PCB product line

| | Commodity
High-throughput baseline | Premium
Precision alignment | Metrology
Specialty / depth-control |
| --- | --- | --- | --- |
| PCB
Drilling | | | |
| | Standard | CCD Series | StubMapper™ |
| PCB
Routing | | | |
| | Standard | CCD Series | Depth Control |
| Edge
Coater | | | |
| | Single Station | Multi Station | |

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大量科技
TA LIANG

PCB competitive landscape

Metrology	Ta Liang	Company A	Company B
	Sole Provider
StubMapper™ — exclusive	Not Present	Not Present
Premium	Gaining Share
Metrology-driven execution	Established
High ASP, established position	Discounted
Lower ASP
Commodity	Slow growth
Capacity preserved for premium	Limited
Premium-only focus	Large Capacity
Aggressive pricing

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大量科技
TA LIANG

PCB manufacturing capacity

All capacity → commodity model
300 Unit/m

Actual mix based on customer orders
200 – 300 unit/m

All capacity → premium model
200 unit/m

	NJ-New	NJ-Old	LS (漣水)	Taoyuan
Manufacturing space (M²)	22,000	8,565	14,154	4,060
Work station (unit)	114	50	60	15

Outsource Commodity
Preserve Premium Capacity
Metrology-Driven Gains

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大量科技
TA LIANG

Ta Liang Advanced Intelligence

大量先進智能

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大量科技
TA LIANG

AOI + Metrology for advanced packaging

Intelligent metrology

Where we operate

CoWoS

CoPoS

3D IC

CPO

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Typical CoWoS packaging process

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Strong
Partial
Limited / None

Competitive landscape

Dimension	Ta Liang（大量）	Company K	Company B	Company U
IDENTITY
Core focus	Yield quantification
(physical metrology)	Wafer geometry &
lifetime inspection	Inspection + measurement	Full-node AOI systems
Main strength	CMP pad · step-height · warpage ·
wafer-edge	Flatness (sub-nm) · edge shape ·
surface · μ-PCD lifetime	AI algorithms	Yellow-light fluorescence patent
PHYSICAL METROLOGY
Alignment 3D	☑ Full-field	N/A (wafer stage only)	Partial	Limited
Warpage	☑ Full-field 3D	Flatness / bow / warp ☑	Some capability	None
CMP pad	☑ Co-dev w/ TSMC	None	None	None
Step-height /
wafer-edge	☑ In production	Edge shape ☑ (LEP series)	None	None
AP NODE COVERAGE
CoWoS	Metrology at key nodes	Upstream only	AOI	AOI
FOPLP / InFO	Warpage at key nodes	Upstream only	AOI	AOI
Front-end
(wafer fab)	☑ CMP · 3DIC 3nm/2nm	☑ Wafer production QC	Limited	Limited

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大量科技
TA LIANG

Revenue mix

2026 revenue outlook

• Revenue growth with margin expansion
• CN remains the core revenue engine
• Premium mix targeting 60% of revenue
• Semi BU targeting 5% revenue contribution

2025 revenue distribution by region

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文量科技
TA LIANG

Semiconductor BU revenue mix

'25 Revenue by Customer

Growth momentum

• Foundry-qualified
• OSAT scale-out underway
• Capacity ramping for both foundry and OSAT
• OSAT revenue growth outpacing foundry

'25 Revenue by Technology

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文量科技
TA LIANG

Scalable expansion

Early Production Adoption

Glass Edge Coater

Stress suppression

Blocks ambient light

In Pipeline

Multi-probe StubMapper™

Quadruple TM speed

Planning

Precision router

1.6T optical module

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大量科技
TA LIANG

Product portfolio aligned with advanced packaging workflows

OS
- Flux Jetting AOI
- Die Bond AOI
- R2R AOI(FVI)
- Bonding Tool Metrology

CoW
- HBM Incoming AOI
- FOROL Cosmetic AOI
- Wafer Flux Jetting AOI
- Wafer Die Bond AOI
- Wafer Underfill AOI
- Wafer Edge Die AOI
- Wafer Molding AOI

SoIC

• CMP Pad Metrology
• Step-Height Metrology

• Wafer Edge Profile Metrology

• In development

• Matches most advanced foundry nodes
• Revenue follows industry adoption curve

FOPLP/CoPoS/CPO

• FOPLP Warpage Metrology
• Bond Shift_Edge Profile Metrology