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SÜSS MicroTec SE
Regulatory Filings • Mar 13, 2017
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News Details
Corporate | 13 March 2017 13:30
SUSS MicroTec Launches XBS200 – A New Automated Permanent Wafer Bonding System
DGAP-News: SÜSS MicroTec AG / Key word(s): Product Launch
13.03.2017 / 13:30
The issuer is solely responsible for the content of this announcement.
SUSS MicroTec Launches XBS200 – A New Automated Permanent Wafer Bonding System
Garching, March 13, 2017 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, launched a brand-new automated permanent wafer bonding system today. The XBS200 is a universal platform, designed for aligned wafer bonding of wafer sizes up to 200 mm.
Its versatility and modular design offer maximum process flexibility in all permanent bonding tasks. A novel aligned wafer transfer method eliminates the complexity of traditional systems and offers consistent process results with excellent system availability. The XBS200 platform provides low cost of ownership for high-volume production of MEMS, LED and 3D stacked devices.
Its new bond aligner uses SUSS MicroTec’s proprietary Inter-Substrate Alignment (ISA) technology and delivers consistent submicron alignment. Automated calibration and overlay verification ensures optimum repeatability.
The bond chamber is based on the very successful stand-alone XB8 bonder. It offers a wide parameter window with temperatures of up to 550 C and bond forces of up to 100kN. Its innovative mechanical and thermal chamber design results in optimal bonding force and temperature distribution across the wafer and therefore ensures high yield.
“With the development of the new XBS200 platform, SUSS MicroTec enters the attractive market for automated permanent bonding systems. The XBS200 is based on our successful temporary bonding equipment platform and was designed according to the needs and demands of our customers”, says Stefan Lutter, General Manager of the bonder product line. “The XBS200 offers high throughput along with a small footprint, high alignment accuracy and repeatability as well as excellent temperature and bond force uniformity for maximum yield.”
For more information visit: www.suss.com
About SUSS MicroTec
SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit http://www.suss.com
Contact:
SUSS MicroTec AG
Franka Schielke
Senior Manager Investor Relations
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
Email: [email protected]
13.03.2017 Dissemination of a Corporate News, transmitted by DGAP – a service of EQS Group AG.
The issuer is solely responsible for the content of this announcement.
The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases.
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| Language: | English |
| Company: | SÜSS MicroTec AG |
| Schleissheimer Strasse 90 | |
| 85748 Garching | |
| Germany | |
| Phone: | +49 (0)89 32007-161 |
| Fax: | +49 (0)89 32007-451 |
| E-mail: | [email protected] |
| Internet: | www.suss.com |
| ISIN: | DE000A1K0235 |
| WKN: | A1K023 |
| Listed: | Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange |
| End of News | DGAP News Service |