Regulatory Filings • Sep 17, 2015
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Media | 17 September 2015 08:00
SUSS MicroTec Launches XB8 – a New Semi-Automated High-Force Wafer Bonder
(DGAP-Media / 2015-09-17 / 08:00)
SUSS MicroTec Launches XB8 – a New Semi-Automated High-Force Wafer Bonder
Garching, September 17, 2015 – SUSS MicroTec, a global supplier of equipment and applications for the semiconductor industry and related markets, has launched the new bonding platform XB8 today.
The XB8 wafer bonder is designed for a wide range of bonding processes. It supports substrates with a wafer size of up to 200 mm. Key process parameters can be adjusted in a wide range, which makes the system ideal for advanced process development. In a production environment, the high level of automation and reliability of the XB8 ensure a high level of process stability.
Typical applications include advanced packaging, MEMS, 3D integration and LED manufacturing. The XB8 wafer bonder offers a broad parameter window and is therefore suitable for carrying out all bonding processes. Bond force up to 100kN is available with a temperature range of up to 550 C. Different substrate shapes and wafer sizes are processed in specifically adapted fixtures. A multi-bond fixture, for example, enables the maximum possible throughput increase by bonding up to eight wafers at once.
“In addition to the high precision and the repeatability of the bonding process from wafer to wafer, a uniform process result across the wafer is essential for achieving a high yield.”, says Stefan Lutter, General Manager of the bonder product lines. “The independent new heaters guarantee an even temperature distribution and also ensure an optimal bonding force homogeneity within the entire temperature range. The innovative mechanical and thermal structure of the XB8 wafer bonder enables optimal bonding force and temperature distribution across the wafer, resulting in a high product quality and yield.”
For more information visit: www.suss.com/XB8
About SUSS MicroTec
SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit http://www.suss.com
Contact:
SUSS MicroTec AG
Franka Schielke
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
Email: [email protected]
End of Media Release
Issuer: SÜSS MicroTec AG
Key word(s): Research/Technology
2015-09-17 Dissemination of a Press Release, transmitted by DGAP – a service of EQS Group AG.
The issuer is solely responsible for the content of this announcement.
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Media archive at www.dgap-medientreff.de and www.dgap.de
| Language: | English |
| Company: | SÜSS MicroTec AG |
| Schleissheimer Strasse 90 | |
| 85748 Garching | |
| Germany | |
| Phone: | +49 (0)89 32007-161 |
| Fax: | +49 (0)89 32007-451 |
| E-mail: | [email protected] |
| Internet: | www.suss.com |
| ISIN: | DE000A1K0235 |
| WKN: | A1K023 |
| Listed: | Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Munich, Stuttgart |
| End of News | DGAP Media |
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| 395081 2015-09-17 |
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