Regulatory Filings • Oct 7, 2014
Regulatory Filings
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Media | 7 October 2014 08:00
SUSS MicroTec Launches SB6/8 Gen2: A Next-Generation Semi-Automated Permanent Wafer Bonder
(DGAP-Media / 07.10.2014 / 08:00)
SUSS MicroTec Launches SB6/8 Gen2: A Next-Generation Semi-Automated Permanent Wafer Bonder
Garching, October 7, 2014 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, has launched the SB6/8 Gen2 Wafer Bonder today. The semi-automated SB6/8 Gen2 is SUSS MicroTec’s state of the art universal permanent wafer bonding system that handles wafers up to 200 mm and supports various substrate types and sizes.
The tool allows for fully manual processing in research and development applications while at the same time providing the opportunity of an easy switch to volume production. It supports low force for adhesive bonding as well as high force for thermo compression or eutectic bonding and offers various chamber pressure conditions from vacuum to over pressure.
Flexible tooling allows for adapting to different requirements in the semiconductor industry. Major applications are in MEMS and LED packaging and production as well as 3D stacking.
The second tool generation provides an advanced heater and force control system as well as improved cooling rates. These new features lead to a more precise control of the bonding processes.
About SUSS MicroTec
SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit: www.suss.com
Contact:
SUSS MicroTec AG
Franka Schielke
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
Email: [email protected]
End of Media Release
Issuer: SÜSS MicroTec AG
Key word(s): Research/Technology
07.10.2014 Dissemination of a Press Release, transmitted by DGAP – a service of EQS Group AG.
The issuer is solely responsible for the content of this announcement.
The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases.
Media archive at www.dgap-medientreff.de and www.dgap.de
| Language: | English |
| Company: | SÜSS MicroTec AG |
| Schleissheimer Strasse 90 | |
| 85748 Garching | |
| Germany | |
| Phone: | +49 (0)89 32007-161 |
| Fax: | +49 (0)89 32007-451 |
| E-mail: | [email protected] |
| Internet: | www.suss.com |
| ISIN: | DE000A1K0235 |
| WKN: | A1K023 |
| Listed: | Regulierter Markt in Frankfurt (Prime Standard); Freiverkehr in Berlin, Düsseldorf, Hamburg, München, Stuttgart |
| End of News | DGAP-Media |
| - - - |
| 290328 07.10.2014 |
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