Regulatory Filings • Mar 28, 2013
Regulatory Filings
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Ad-hoc | 28 March 2013 12:21
SÜSS MicroTec AG: A World Leading IDM places a follow up order for Bonding-Equipment for 300mm High-Volume Production
SÜSS MicroTec AG / Key word(s): Incoming Orders
28.03.2013 12:21
Dissemination of an Ad hoc announcement according to § 15 WpHG, transmitted
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The issuer is solely responsible for the content of this announcement.
A World Leading IDM places a follow up order for Bonding-Equipment for
300mm High-Volume Production
Garching, March 28, 2013 - SUSS MicroTecAG, a global supplier of equipment
and process solutions for the semiconductor industry and related markets
has received a follow up purchase order for the latest generation of high
volume manufacturing temporary bond clusters from a world-leading IDM
(Integrated Device Manufacturer). The customer, who has installed SUSS
MicroTec tools in 2012 already, plans to enter into a pilot production with
the new systems. The bonder systems are configured to temporarily bond and
debond 300mm wafers for 3D integration processes in logic and memory
applications using the TMAT (Thin Materials) process and adhesive
materials. Delivery of the bond cluster is expected for the second half of
the fiscal year 2013.
End of the ad hoc announcement
Contact:
SUSS MicroTec AG
Franka Schielke
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
Email: [email protected]
28.03.2013 DGAP's Distribution Services include Regulatory Announcements,
Financial/Corporate News and Press Releases.
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Language: English
Company: SÜSS MicroTec AG
Schleissheimer Strasse 90
85748 Garching
Germany
Phone: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
E-mail: [email protected]
Internet: www.suss.com
ISIN: DE000A1K0235
WKN: A1K023
Indices: TecDAX
Listed: Regulierter Markt in Frankfurt (Prime Standard); Freiverkehr
in Berlin, Düsseldorf, Hamburg, München, Stuttgart
End of Announcement DGAP News-Service
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