Regulatory Filings • Feb 21, 2012
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Press Release | 21 February 2012 10:01
SUSS MicroTec and GenISys Announce Cooperation on Mask Aligner Lithography Simulation Software
SÜSS MicroTec AG / Key word(s): Research/Technology/
21.02.2012 / 10:01
PRESS RELEASE
SUSS MicroTec and GenISys Announce Cooperation on Mask Aligner Lithography Simulation Software
Garching, GERMANY, February 21, 2012 – SUSS MicroTec a leading supplier of equipment and process solutions for the semiconductor industry and related markets and GenISys GmbH, provider of high-performance software solutions for nano scale fabrication, today announced a cooperation agreement to combine the SUSS MicroTec mask aligner tools with the GenISys simulation software Layout LAB TM .
Within the cooperation GenISys Layout LAB TM has been enhanced to accurately model all available SUSS MicroTec mask aligner exposure optics. Both parties join forces to market the SUSS MicroTec mask aligner technology with the GenISys lithography simulation software Layout LAB TM . The combination of lithography equipment and matching simulation software is a key success factor for cost effective process and device development for the end user.
'The sophisticated and latest SUSS exposure optics technology, MO Exposure Optics, enables the use of frontend technologies like illumination shaping and mask layout optimization on mask aligner equipment', said Frank P. Averdung, President and CEO of SUSS MicroTec AG. 'This in combination with GenISys simulation software is a key technology enabler as it allows easy modeling of large numbers of different source shapes.'
'Layout LAB TM is a professional full 3D simulation platform for optical proximity lithography, which enables to optimize mask layout and exposure conditions by running a large number of simulations overnight. Besides saving direct costs, users are gaining time to market' said Nezih Unal, Vice President of GenISys.
About GenISys
Based in Munich, Germany, with offices in Tokyo, Japan, and Santa Clara, Calif., GenISys GmbH develops, markets and supports flexible, high-performance software solutions for the optimization of microstructure fabrication processes. Addressing the market for e-beam direct-write and optical lithography, GenISys combines deep technical expertise in layout data processing, process modeling, correction and optimization with high-caliber software engineering and a focus on ease of use. GenISys products give researchers, IC and MEMS manufacturers and system suppliers unparalleled efficiency, ease of use and optimal value in research, development and production of new micro-patterning technologies. For more information visit us at www.genisys-gmbh.com .
Contact:
Nezih Unal
+49 89 330919 760
About SUSS MicroTec
SUSS MicroTec, listed on TecDAX of Deutsche Boerse AG, is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit http://www.suss.com .
Contact:
SUSS MicroTec AG
Franka Schielke
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
Email: [email protected]
End of Media Release
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| Language: | English |
| Company: | SÜSS MicroTec AG |
| Schleissheimer Strasse 90 | |
| 85748 Garching | |
| Germany | |
| Phone: | +49 (0)89 32007-161 |
| Fax: | +49 (0)89 32007-451 |
| E-mail: | [email protected] |
| Internet: | www.suss.com |
| ISIN: | DE000A1K0235 |
| WKN: | A1K023 |
| Listed: | Regulierter Markt in Frankfurt (Prime Standard); Freiverkehr in Berlin, Düsseldorf, Hamburg, München, Stuttgart |
| End of News | DGAP-Media |
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| 157486 21.02.2012 |
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