SÜSS MicroTec SE — Investor Presentation 2015

Mar 30, 2015

SUSS MICROTEC INVESTOR PRESENTATION

March/April 2015

DISCLAIMER

This presentation contains forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec AG and its subsidiaries and associates. Forward-looking statements are based on current plans, estimates, projections and expectations and are therefore subject to risks and uncertainties, most of which are difficult to estimate and which in general are beyond the control of SUSS MicroTec AG. Consequently, actual developments as well as actual earnings and performance may differ materially from those which explicitly or implicitly assumed in the forwardlooking statements. SUSS MicroTec AG does not intend or accept any obligation to publish updates of these forward-looking statements.

I. SUSS MicroTec at a Glance

• II. Products and Markets
• III. Growth Opportunities
• IV. Financials
• V. Outlook

SUSS MICROTEC AT A GLANCE

• A global leader in manufacturing equipment for the semiconductor mid- and backend market
• Our equipment and process solutions create the micro structures that build and connect micro electronic devices
• Focus on attractive growth markets: Semiconductors, MEMS and LED

Leading market position in target markets

Key figures 2014:

• Order Entry € 134.3 million
• Sales € 145.3 million
• Employees: 659

SUSS MICROTEC IN THE VALUE CHAIN

are produced on SUSS MicroTec's equipment

SUSS MICROTEC – A GLOBAL PLAYER

MAIN PRODUCTION SITES

7 SUSS MicroTec Investor Presentation

I. SUSS MicroTec at a Glance

II. Products and Markets

• III. Growth Opportunities
• IV. Financials
• V. Outlook

* EBIT Segment Others: -4.5 € million

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities
• IV. Financials
• V. Outlook

+ The "Digital Lifestyle" is characterized by permanent internet connectivity and convergence of media + Digital Lifestyle Mobile devices like smartphones and tablet PCs provide this capability at affordable cost + New device generations offer higher functionality
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	+ Alternative transportation / mobility solutions are getting more traction with attractive price / performance ratios
E-Mobility	+ EVs, Hybrid-Cars, Segways, E-Bikes, but also trains drive the need for power devices and high performance Ics at the same time

Energy Efficiency	+ Increased environmental awareness and rising energy cost drive the demand for energy efficient solutions i.e. solid state lighting
	+ Energy efficiency in industrial production
	+ Smart energy management in household applications

2D Packaging	2.5D Packaging	3D Integration (TSV)
- Increased performance and complexity of ICs by shrinking transistor geometry according to Moore's Law - New technologies like EUV and multiple pattering allow further scaling - Technical challenges and limitations make it increasingly more difficult and expensive to reduce the feature size	- Combining of several (and heterogeneous) semiconductor components on an interposer addresses limitations of traditional shrinking - Increased packaging density - Reduced footprint - Complementary technology to Moore's Law	- The extension beyond the conventional shrink roadmap is called "More than Moore" - Packaging becomes key enabler for scaling and some manufacturing value is shifting from silicon to the package - Performance and complexity increase combined with smaller footprint - Reduced energy consumption

SUSS MicroTec's equipment and process solutions enable 2D shrinking ("Moore's Law") and 3D stacking ("More than Moore")

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities
• IV. Financials
• V. Outlook

Order Entry in € million Sales in € million

Order backlog in € million

Free Cash Flow in € million

Net cash in € million

EBIT in € million

* Including a -13.2 € milion one-off effect from restructuring of the product line permanant bonding (-0,69 € per share)

Order Entry in € million Sales in € million

Order backlog in € million

Free Cash Flow EBIT in € million in € million

Net cash in € million

* Including a -13.2 € milion one-off effect from restructuring of the product line permanant bonding (-0,69 € per share)

in € million	2014	2013	in %
Order Intake	134.3	135.0	-0.5%
Order Backlog 12/31	75.6	85.7	-11.8%
Revenue	145.3	134.5	+8.1%
EBIT	8.4	-19.4	--
EBIT in % of Sales	5.8%	-14.4%	--
Earnings after tax	8.2	-16.0	--
EPS in €	0.24	-0.84	--
Net Cash*	38.0	35.7	+6.4%
Free Cash Flow**	2.1	4.1	-48.8%
Employees 12/31	659	655	-0.6%

* incl. stock of interest-bearing securities

**before consideration of purchased interest-bearing securities

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities
• IV. Financials
• V. Outlook

Lithography	Mask Aligner and Coaters /Developers: Current and expected sales level around 80 – 90 € million per year UV Projection Scanners and Laser Ablation Steppers: Current annual sales at around 10 € million
Photomask Equipment	Stable sales level at around 20 € million per year
Substrate Bonders	Permanent Bonding and Temporary Bonding: Expected sales level of the division: 15 – 20 € million
Guidance	FY 2015: Sales: 130 to 140 € million EBIT: break-even Q1 2015: Order Intake: 25 - 35 € million

Business Environment/Targets

• Enabling "Moore's Law" and "More than Moore"
• Fundamental growth in target markets
• Leveraging the existing technologies and core competencies into products
• Grow revenue in the Lithography segment and bring the core business back to its former strength
• Position SUSS MicroTec Photonic systems tools in the market and grow revenue
• Generate a positive EBIT in the Substrate Bonder Division

Balance Sheet and P&L

• (Maintain) tight cost structure
• Strong financial position and positive free cash flow
• Equity ratio > 60%
• Target gross margins: short-term 33 – 35% medium-term >35%
• Medium-term EBIT-margin of 5%+

SÜSS MicroTec AG Schleissheimer Str. 90 85748 Garching

www.suss.com

Management Board
Michael Knopp, CFO (Speaker) Walter Braun, COO
Finance, Tax, Legal, HR, IT, Sales, Service & Marketing, Strategy, Investor Relations	Operations, Quality, Supply Chain Management, R & D, Patents, Environmental Protection, Work Safety, Strategy

Divisions
Lithography	Photomask Equipment	Bonder

Sales & Service Europe, USA, Japan, China, Taiwan, Singapore, Korea

Franka Schielke

Tel.: +49 (0) 89-32007- 161 Fax.: +49 (0) 89-32007- 451 Email: franka.schielke@suss.com

SÜSS MicroTec AG Schleissheimer Strasse 90 85748 Garching (Munich) Germany www.suss.com

Contact Financial Calendar 2015

KeplerCheuvreux Investment Conference, Frankfurt	19 Jan
Annual Report 2014	30 Mar
Quarterly Report 2015	8 May
Annual General Meeting 2015, Munich	2 Jun
Interim Report 2015	6 Aug
Nine-month Report 2015	5 Nov

SHARE PRICE DEVELOPMENT AND MAJOR HOLDERS

(Price of the SUSS MicroTec Share at January 2, 2014: 6.38 € )

Major Shareholders: Henderson 5.13% Universal 5.04% ING Invest 3.42% Sycomore 3.14% Baillie Gifford 3.00%

Average daily trading volume January 2014 – March 2015: ~ 121,000

LONG TERM BUSINESS DEVELOPMENT BY QUARTER

EBIT, FREE CASH FLOW AND NET CASH DEVELOPMENT

* one-off effect from restructuring the product line permanent bonding

THE SEMICONDUCTOR MARKET