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SÜSS MicroTec SE

Investor Presentation Nov 25, 2015

422_ip_2015-11-25_670e062b-2265-41c2-a73a-cca75323a0fa.pdf

Investor Presentation

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SUSS MICROTEC INVESTOR PRESENTATION

November 2015

DISCLAIMER

This presentation contains forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec AG and its subsidiaries and associates. Forward-looking statements are based on current plans, estimates, projections and expectations and are therefore subject to risks and uncertainties, most of which are difficult to estimate and which in general are beyond the control of SUSS MicroTec AG. Consequently, actual developments as well as actual earnings and performance may differ materially from those which explicitly or implicitly assumed in the forwardlooking statements. SUSS MicroTec AG does not intend or accept any obligation to publish updates of these forward-looking statements.

TABLE OF CONTENT

I. SUSS MicroTec at a Glance

  • II. Products & Markets
  • III. Financials
  • IV. Strategy Update and Outlook

SUSS MICROTEC AT A GLANCE

Global leader in manufacturing equipment for semiconductor devices

  • SUSS' Equipment creates micro structures that connect micro electronic devices
  • Focus on growth segments: advanced packaging, MEMS, and 2.5D / 3D Integration
  • Attractive end markets: smartphones, tablets, automotive, LED, sensors, IoT, …

Sales FY 2014: €145.3 million

  • EBIT FY 2014: € 8.4 million (EBIT-margin: 5.8%)
  • Net Cash 9M 2015: € 25.5 million
  • Market Cap 10/30/2015: € 135 million

SUSS MICROTEC – A GLOBAL PLAYER

NORTH AMERICA

Order Entry 18.9 € million Sales 21.5 € million Employees 118

EUROPE

Order Entry 41.9 € million Sales 42.7 € million Employees 419

ASIA

Order Entry 67.6 € million Sales 81.1 € million Employees 122

TABLE OF CONTENT

I. SUSS MicroTec at a Glance

II. Products & Markets

  • III. Financials
  • IV. Strategy Update and Outlook

SUSS MICROTEC IN THE VALUE CHAIN

MARKET DRIVERS

Connectivity &
Data Processing
+
Connection through apps, social media, data streaming
+
Connectivity of devices, Internet of Things (IoT)
+
Permanent internet connectivity provided by
smartphones and tablet PCs at affordable cost
+
Industry 4.0 connectivity of manufacturing units
Mobility &
Automotive
+
Autonomous, electric and plug in hybrid cars,
E-Bikes, trains drive the need for power devices
and high performance ICs at the same time
+
Growing electronic content and sensors (MEMS)
for autonomous cars
Energy
Efficiency
+
Environmental awareness and rising energy costs
drive the demand for energy efficient devices
+
Energy efficiency in industrial production
+
Smart energy management in household applications
+
Green energy management systems

SEGMENTS AND MARKETS

Adjacent Markets

Micro Optics

SEGMENTS AND PRODUCTS

11 SUSS MicroTec Investor Presentation

12 SUSS MicroTec Investor Presentation

Wafer-level packaging (WLP) and assembly equipment

Source: Gartner, July 2015

Attractive growth opportunities within wafer-level packaging:

  • Fan-out WLP
  • Copper pillar
  • Bumping
  • Grow market share for core products in advanced packaging: coater/developer, mask aligner
  • Achieve traction for new advanced lithography products from SUSS MicroTec Photonic Systems:
  • Further HVM orders for scanner products
  • Qualification of laser products at key customers

  • Internet of Things (IoT)

  • Smartphones and tablets
  • Automotive applications
  • Health/biomedical applications
  • Grow market share for core products for MEMS: coater/developer, mask aligner, substrate bonder
  • Market re-entry permanent bonder with new differentiated product

Source: Yole, May 2015

IC SCALING TECHNOLOGIES FROM 2D TO 3D

  • Increased performance and complexity of ICs by shrinking transistor geometry according to Moore's Law
  • New technologies like EUV and multiple patterning drive further scaling
  • Technical challenges and limitations make it increasingly more difficult and expensive to reduce the feature size

  • Combining of several devices on an interposer addresses the limitations of traditional shrinking while enhancing performance

  • Increased packaging density
  • Reduced footprint
  • Packaging becomes enabler and addresses performance slow down of Moore's Law

2D Packaging 2.5D Packaging 3D Integration (TSV)

  • Stacking of several devices horizontally enables high performance at a low footprint
  • TSV and bonded thin Si technology becomes key enabler for scaling
  • Performance and complexity increase combined with smaller footprint
  • Reduced energy consumption

SUSS MicroTec's equipment and process solutions enable 2D shrinking ("Moore's Law") and 2.5D / 3D integration ("More than Moore")

  • I. SUSS MicroTec at a Glance
  • II. Products & Markets

III. Financials

IV. Strategy Update and Outlook

Order Entry by Segment Order Entry by Region

Order Entry in € million Sales in € million

Order Backlog in € million

Free Cash Flow in € million

Net Cash in € million

EBIT in € million

* Including a -13.2 € milion one-off effect from restructuring of the product line permanant bonding (-0,69 € per share)

Order Backlog in € million

Free Cash Flow EBIT in € million in € million

Net Cash in € million

in € million Q3 2015 Q3 2014 in % 9M 2015 9M 2014
Order Intake 39.2 29.1 34.7% 108.9 90.3
Order Backlog 9/30 -- -- -- 92.1 82.2
Revenue 38.3 25.6 49,6% 93.4 95.0
EBIT 2.2 -3.3 -- -1.7 0.1
EBIT in % of Sales 5.7% -12.9% -- -1.8% 0.1%
Earnings after tax 1.2 -2.9 -- -3.4 -0.9
EPS in € 0.06 -0.16 -- -0.18 -0.05
Free Cash Flow* 0.1 -1.7 -- -13.1 -4.1
Net Cash -- -- -- 25.5 31.8
Employees 9/30 -- -- -- 693 658

* before consideration of purchased interest-bearing securities

TABLE OF CONTENT

  • I. SUSS MicroTec at a Glance
  • II. Products & Markets
  • III. Financials
  • IV. Strategy Update and Outlook
Short-term
Grow market share for core products in all market segments

Traction for new advanced lithography products from SUSS MicroTec
Photonic Systems

Stabilize Company at positive EBIT and cash generation, continue revenue growth:

Gross margin 30-35%
Mid-term
Focused product portfolio

Positive EBIT from Bonder Division and Photonic Systems

Successful new adjacent market entries (leverage existing technologies to grow SAM)

Continue revenue growth at positive EBIT and cash generation:

Sales of >200M

Gross margin >35%

EBIT margin >5%
Long-term
Continue revenue growth at positive EBIT and cash generation:

Sales of >200M

Gross margin >35%

EBIT margin 10%

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