SÜSS MicroTec SE

Investor Presentation • Apr 8, 2014

SUSS MICROTEC INVESTOR PRESENTATION

April 2014

This presentation contains forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec AG and its subsidiaries and associates. Forward-looking statements are based on current plans, estimates, projections and expectations and are therefore subject to risks and uncertainties, most of which are difficult to estimate and which in general are beyond the control of SUSS MicroTec AG. Consequently, actual developments as well as actual earnings and performance may differ materially from those which explicitly or implicitly assumed in the forwardlooking statements. SUSS MicroTec AG does not intend or accept any obligation to publish updates of these forward-looking statements.

TABLE OF CONTENT

I. SUSS MicroTec at a Glance

• II. Products and Markets
• III. Growth Opportunities
• IV. Enhanced Lithography Portfolio
• V. Financials
• VI. Outlook

SUSS MICROTEC AT A GLANCE

• SUSS MicroTec: A global leader in semiconductor equipment
• Our equipment and process solutions create the micro structures that build and connect micro electronic devices
• We are focused on high growth market segments: Semiconductors, MEMS, LEDs

Key Data:

• Stock Exchange Symbol: SMHN
• Share price*: 6.98 €
• Market Cap*: 133 € million
• Net Cash, December 31, 2013: 35.7 € million

* March 28, 2014

SUSS MICROTEC IN THE VALUE CHAIN

• Development of highly innovative process solutions with industry and R&D partners
• Components for electronic devices like cell phones, PCs and tablet computers are produced on SUSS MicroTec's equipment

THE SEMICONDUCTOR MARKET

SUSS MICROTEC – A GLOBAL PLAYER

MAIN PRODUCTION SITES

Germany USA

Garching*

• SUSS MicroTec HQ
• Development/production:
• Mask Aligner
• Bond Aligner
• Core competencies:
• Exposure (proximity exposure)
• Alignment
• * Production site owned by SUSS MicroTec ** Production sited rented by SUSS MicroTec

Sternenfels*

• Development/production :
• Bonder
• Coater and Developer
• Photomask Equipment
• Core competencies:
• Wet processing
• Wafer bonding

Corona**

• Development/production:
• Stepper/Scanner
• Laser Processing
• Core competencies:
• Exposure (UV projection lithography)
• Laser Ablation

TABLE OF CONTENT

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities
• IV. Enhanced Lithography Portfolio
• V. Financials
• VI. Outlook

KEY MARKETS

RESTRUCTURING OF PERMANENT BONDING

Reevaluation of the business situation in permanent bonding

• ongoing losses
• expansion of the restructuring measures, which have been taken in Q2, 2013

Cease production of cluster systems for permanent bonding applications

Losses of the Substrate Bonding Division will be reduced significantly

The successful manual permanent bonding systems are not affected

• One-off expense of € 8.3 million was taken in Q4 2013:
• € 6.7 million for write-offs on raw materials, unfinished goods and demonstration tools
• € 1.6 million for precautionary formed accruals for single customer projects

Total expense for the restructuring of the permanent bonding in 2013 amounts to € 13.2 million

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities
• IV. Enhanced Lithography Portfolio
• V. Financials
• VI. Outlook

TECHNOLOGY EVOLUTION

14 SUSS MicroTec Investor Presentation

GROWTH DRIVER SMARTPHONES AND TABLETS

Source: Yole Developpement

MICROCHIPS, MEMS UND LED: BUILDING BLOCKS FOR TECHNOLOGICAL PRODUCT ADVANCEMENT

Digital Lifestyle	- The "Digital Lifestyle" is characterized by permanent internet connectivity and convergence of media - Mobile devices like smartphones and tablet PCs provide this capability at affordable cost - New device generations offer higher functionality
E-Mobility	- Alternative transportation / mobility solutions are getting more traction with attractive price / performance ratios - EVs, Hybrid-Cars, Segways, E-Bikes, but also trains drive the need for power devices but also high performance ICs
Energy Efficiency	- Increase environmental awareness and rising energy prices and fuel the demand for energy efficient solutions in electricity usage i.e. lighting - Energy efficiency in industrial production - Smart energy management in household applications safes energy

With its strong position in the fast growing target markets 3D Integration / Advanced Packaging, LED and MEMS, SUSS MicroTec can benefit from the market developments:

Advanced Packaging	Wafer level packaging and flip chip is expected to remain more robust than the overall market, primarily driven by mobile devices like smart phones and tablets
3D Integration (TSV)	Transition to production volume in the years to come
Compound Semiconductors	LED, MEMS, RF, Optoelectronics, III-V Power are expected to remain robust based on smartphone and tablet growth and will drive further demand for advanced packaging solutions

Segment growth 2011 - 2016E CAGR ~ 15% (Gartner and industry estimates)

SCALING TECHNOLOGIES FROM 2D TO 3D

2D Packaging 2.5D Packaging 3D Integration (TSV) - Combining of several (and heterogeneous) semiconductor components on an interposer addresses limitations of traditional shrinking - Increased packaging density - Reduced footprint - Complementary technology to Moore's Law - The extension beyond the conventional shrink roadmap is called "More than Moore" - Packaging becomes key enabler for scaling and some manufacturing value is shifting from silicon to the package - Performance and complexity increase combined with smaller footprint - Reduced energy consumption - Increased performance and complexity of ICs by shrinking transistor geometry according to Moore's Law - New technologies like EUV and multiple pattering allow further scaling - Technical challenges and limitations make it increasingly more difficult and expensive to reduce the feature size

SUSS MicroTec"s equipment and process solutions enable 2D shrinking ("Moore's Law") and 3D stacking ("More than Moore")

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities

IV. Enhanced Lithography Portfolio

• V. Financials
• VI. Outlook

LITHOGRAPHY COMPETENCY

• Increasing chip performance requires the adoption of innovative lithography technologies in the semiconductor backend
• Not one single exposure technology fits all needs at the same time
• The newly acquired Stepper/Scanner products supplement our Mask Aligner product line and enlarges our technology portfolio by the key competencies UV-projection lithography and laser ablation
• SUSS MicroOptics S.A. adds key know how for critical lithography performance improvements

EXPOSURE SOLUTIONS

Only SUSS MicroTec offers complete exposure solutions for the mid-/back-end

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities
• IV. Enhanced Lithography Portfolio

V. Financials

VI. Outlook

LONG TERM BUSINESS DEVELOPMENT

EBIT, FREE CASH FLOW AND NET CASH DEVELOPMENT

* one-off effects from restructuring of the product line permanent bonding

in € million	2013	2012	in %
Order Intake	135.0	157.2	-14.1%
Order Backlog 12/31	85.7	86.5	-0.9%
Revenue	134.5	163.8	-17.9%
EBIT	-19.4	11.7	--
EBIT in % of Sales	-14.4%	7.6%	-21.5%pt.
Earnings after tax (continuing operations)	-16.0	7.6	--
Earnings after tax	-16.0	9.1	--
EPS in € (continued op.)	-0.84	0.40	--
Net Cash*	35.7	32.3	+10.5%
Free Cash Flow**	4.1	-4.5	--
Employees 12/31	655	704	-7.0%

* incl. stock of interest-bearing securities

** before consideration of purchased interest-bearing securities , the acquisition of Tamarack Scientific and the gain out of the sale from the Test Business

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities
• IV. Enhanced Lithography Portfolio
• V. Financials
• VI. Outlook

2013:	-	Milestone achievement in temporary bonding
-------	---	--------------------------------------------	--	--

• - Restructuring of product line Permanent Bonding expanded
• - Further integration of SUSS MicroTec Photonic Systems

Fundamental growth in target markets

Strong competitive positioning: first or second in the target markets

Leading equipment company in the semiconductor backend, enabling "Moore"s Law" as well as "More than Moore"

Outlook

FY 2014: - Sales of 135 - 145 € million - EBIT: -5 to 0 € million

Q1 2014: - Order Intake 25 - 35 € million

SÜSS MicroTec AG Schleissheimer Str. 90 85748 Garching

www.suss.com

Franka Schielke

Tel.: +49 (0) 89-32007- 161 Fax.: +49 (0) 89-32007- 451 Email: franka.schielke@suss.com

SÜSS MicroTec AG Schleissheimer Strasse 90 85748 Garching (Munich) Germany www.suss.com

Contact Financial Calendar 2014

Annual Report 2013	28 Mar
Quarterly Report 2014	8 May
Berenberg Investment Conference Paris	22 May
Deutsche Bank Investment Conference, Berlin	12 - 13 Jun
Shareholders' Meeting, Haus der Bayerischen Wirtschaft, Munich	17 Jun
Interim Report 2014	7 Aug
Nine-month Report 2014	6 Nov
German Equity Forum 2014, Frankfurt am Main	24 - 26 Nov

STOCK PERFORMANCE: JANUARY 2013 – MARCH 2014

(Price of the SUSS MicroTec Share at January 2, 2013: 8.85 € )

Average daily trading volume January 2013 – March 2014: ~ 103,000

SUSS MICROTEC PRODUCT PORTFOLIO