SÜSS MicroTec SE — Investor Presentation 2014

Sep 25, 2014

SUSS MICROTEC INVESTOR PRESENTATION

September 2014

DISCLAIMER

This presentation contains forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec AG and its subsidiaries and associates. Forward-looking statements are based on current plans, estimates, projections and expectations and are therefore subject to risks and uncertainties, most of which are difficult to estimate and which in general are beyond the control of SUSS MicroTec AG. Consequently, actual developments as well as actual earnings and performance may differ materially from those which explicitly or implicitly assumed in the forwardlooking statements. SUSS MicroTec AG does not intend or accept any obligation to publish updates of these forward-looking statements.

TABLE OF CONTENT

I. SUSS MicroTec at a Glance

• II. Products and Markets
• III. Growth Opportunities
• IV. Financials
• V. Outlook

SUSS MICROTEC AT A GLANCE

• A global leader in manufacturing equipment for the semiconductor mid- and backend market
• Our equipment and process solutions create the micro structures that build and connect micro electronic devices
• Focused on attractive growth markets: Semiconductors, MEMS and LED
• Leading market position in target markets
• SUSS MicroTec is listed in the Prime Standard of Deutsche Boerse

SUSS MICROTEC IN THE VALUE CHAIN

are produced on SUSS MicroTec's equipment

THE SEMICONDUCTOR MARKET

SUSS MICROTEC – A GLOBAL PLAYER

MAIN PRODUCTION SITES

Germany USA

Garching*

• SUSS MicroTec HQ
• Development/production:
• Mask Aligner
• Bond Aligner
• Core competencies:
• Exposure (proximity exposure)
• Alignment

Sternenfels*

• Development/production :
• Bonder
• Coater and Developer
• Photomask Equipment
• Core competencies:
• Wet processing
• Wafer bonding

Corona

• Development/production:
• Stepper/Scanner
• Laser Processing
• Core competencies:
• Exposure (UV projection)
• Laser Ablation

*Production site is owned by SUSS MicroTec

TABLE OF CONTENT

I. SUSS MicroTec at a Glance

II. Products and Markets

• III. Growth Opportunities
• IV. Financials
• V. Outlook

SEGMENTS, PRODUCTS AND MARKETS

TABLE OF CONTENT

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities
• IV. Financials
• V. Outlook

GROWTH DRIVER SMARTPHONES AND TABLETS

Source: Yole Developpement

MICROCHIPS, MEMS UND LED: BUILDING BLOCKS FOR TECHNOLOGICAL PRODUCT ADVANCEMENT

Digital Lifestyle	+ The "Digital Lifestyle" is characterized by permanent internet connectivity and convergence of media + Mobile devices like smartphones and tablet PCs provide this capability at affordable cost + New device generations offer higher functionality
E-Mobility	+ Alternative transportation / mobility solutions are getting more traction with attractive price / performance ratios + EVs, Hybrid-Cars, Segways, E-Bikes, but also trains drive the need for power devices and high performance Ics at the same time
Energy Efficiency	+ Increased environmental awareness and rising energy cost drive the demand for energy efficient solutions i.e. solid state lighting + Energy efficiency in industrial production + Smart energy management in household applications

2D Packaging	2.5D Packaging	3D Integration (TSV)
- Increased performance and complexity of ICs by shrinking transistor geometry according to Moore's Law - New technologies like EUV and multiple pattering allow further scaling - Technical challenges and limitations make it increasingly more difficult and expensive to reduce the feature size	- Combining of several (and heterogeneous) semiconductor components on an interposer addresses limitations of traditional shrinking - Increased packaging density - Reduced footprint - Complementary technology to Moore's Law	- The extension beyond the conventional shrink roadmap is called "More than Moore" - Packaging becomes key enabler for scaling and some manufacturing value is shifting from silicon to the package - Performance and complexity increase combined with smaller footprint - Reduced energy consumption

SUSS MicroTec's equipment and process solutions enable 2D shrinking ("Moore's Law") and 3D stacking ("More than Moore")

TABLE OF CONTENT

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities
• IV. Financials
• V. Outlook

Order backlog in € million

Free Cash Flow in € million

Net cash in € million

EBIT in € million

* Including a -13.2 € milion one-off effect from restructuring of the product line permanant bonding (-0,69 € per share)

KEY FINANCIALS

in € million	Q2 2014	Q2 2013	in %	H1 2014	H1 2013
Order Intake	36.2	36.7	-1.4%	61.2	71.6
Order Backlog 6/30	--	--	--	77.7	102.5
Revenue	30.4	24.9	+22.1%	69.4	55.0
EBIT	1.9	-11.7	--	3.4	-15.0
EBIT in % of Sales	6.3%	-47,0%	--	4.9%	-27.3%
EBIT (adjusted)	--	-5.7	--	--	-9.0
EBIT (adjusted) in % of Sales	--	-22.8%	--	--	-16.4%
Earnings after tax	0.9	-9.1	--	2.0	-11.6
EPS in €	0.05	-0.48	--	0.11	-0.61
Free Cash Flow*	1.8	-5.2	--	-2.4	-12.4
Net Cash**	--	--	--	33.3	19.5
Employees 6/30	--	--	--	649	680
* incl. stock of interest-bearing securities ** before consideration of purchased interest-bearing securities

TABLE OF CONTENT

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities
• IV. Financials
• V. Outlook

OUTLOOK PER PRODUCT LINE

	Mask Aligner and Coaters /Developers Current and expected sales level around 80 – 90 € million per year
Lithography	UV Projection Scanners, and Laser Ablation Steppers: Several customer installations; the products are in an early market introduction phase Current annual sales at around 10 € million

Photomask	Stable sales level at around €
Equipment	20 million per year

	Permanent Bonding After discontinuation of cluster systems reduced sales level vs. previous years
Substrate Bonders	Temporary Bonding 3D integration is a significant growth opportunity with volume ramp difficult to predict
	Expected sales level of the division: 15 – 20 € million

OUTLOOK

Improved Guidance	FY 2014: Sales: 135 to 145 € million EBIT: slightly positive
Outlook	Q3 2014: Order Intake: 25 - 35 € million Q4 2014: Order Intake: 30 - 40 € million

SÜSS MicroTec AG Schleissheimer Str. 90 85748 Garching

www.suss.com

Management Board
Michael Knopp, CFO (Speaker)	Walter Braun, COO
Finance, Tax, Legal, HR, IT, Sales, Service & Marketing, Strategy, Investor Relations	Operations, Quality, Supply Chain Management, R & D, Patents, Environmental Protection, Work Safety, Strategy

Divisions
Lithography	Photomask Equipment	Bonder

Sales & Service Europe, USA, Japan, China, Taiwan, Singapore, Korea

Franka Schielke

Tel.: +49 (0) 89-32007- 161 Fax.: +49 (0) 89-32007- 451 Email: franka.schielke@suss.com

SÜSS MicroTec AG Schleissheimer Strasse 90 85748 Garching (Munich) Germany www.suss.com

Contact Financial Calendar 2014 / 2015

German Corporate Conference, Berenberg/Goldman Sachs, München	22. Sep.
Neunmonatsbericht 2014	6. Nov.
Eigenkapitalforum 2014, Frankfurt am Main	24. - 26. Nov.

KeplerCheuvreux Investorenkonferenz, Frankfurt	19. Jan.
Geschäftsbericht 2013	30. Mrz.
Quartalsbericht 2014	7. Mai.

SHARE PRICE DEVELOPMENT AND MAJOR HOLDERS

(Price of the SUSS MicroTec Share at January 2, 2014: 6.38 € )

Average daily trading volume January 2014 – September 2014: ~ 103,000

LONG TERM BUSINESS DEVELOPMENT BY QUARTER

EBIT, FREE CASH FLOW AND NET CASH DEVELOPMENT

* one-off effect from restructuring the product line permanent bonding