Investor Presentation • Mar 5, 2013
Investor Presentation
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March 2013
This presentation contains forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec AG and its subsidiaries and associates. Forward-looking statements are based on current plans, estimates, projections and expectations and are therefore subject to risks and uncertainties, most of which are difficult to estimate and which in general are beyond the control of SUSS MicroTec AG. Consequently, actual developments as well as actual earnings and performance may differ materially from those which explicitly or implicitly assumed in the forwardlooking statements. SUSS MicroTec AG does not intend or accept any obligation to publish updates of these forward-looking statements.
Photomask Equipment
Coater/Developer
Wafer Bonders
Alignment Verification Systems
| in € million | 2012 | 2011 | YoY in % |
|---|---|---|---|
| Revenue | 163.8 | 175.4 | -6.6% |
| Order Intake | 157.2 | 143.1 | 9.9% |
| Order Backlog 12/31 | 86.5 | 83.7 | 3.3% |
| EBIT | 11.7 | 18.6 | -37.1% |
*Based on preliminary numbers ** Based on 9m figures
8 SUSS MicroTec Investor Presentation
| Digital Lifestyle | - The "Digital Lifestyle" is characterized by permanent internet connectivity and convergence of media - Mobile devices like smartphones and tablet PCs provide this capability at affordable cost - New device generations offer higher functionality |
|
|---|---|---|
| E-Mobility | - Alternative transportation / mobility solutions are getting more traction with attractive price / performance ratios - Evs, Hybrid-Cars, Segways, E-Bikes, but also trains drive the need for power devices but also high performance ICs |
|
| Energy Efficiency |
- Increase environmental awareness and rising energy prices and fuel the demand for energy efficient solutions in electricity usage i.e. lighting - Energy efficiency in industrial production - Smart energy management in household applications safes energy |
With its strong position in the fast growing target markets 3D Integration / Advanced Packaging, LED and MEMS, SUSS MicroTec can benefit from the market developments:
| Advanced Packaging |
Wafer level packaging and flip chip is expected to remain more robust than the overall market, primarily driven by mobile devices like smart phones and tablets |
|---|---|
| 3D Trough Silicon Vias (TSV) |
Transition to production volume in the years to come |
| Compound Semiconductors |
LED, MEMS, RF, Optoelectronics, III-V Power are expected to remain robust based on smartphone and tablet growth and will drive further demand for advanced packaging solutions |
Segment growth 2011 - 2016E CAGR ~ 15% (Gartner and industry estimates)
| 2D Packaging | 2.5D Packaging | 3D Integration |
|---|---|---|
| - Increased performance and complexity of ICs by shrinking transistor geometry according |
- Combining of several (and heterogeneous) semiconductor components on an interposer |
- The extension beyond the conventional shrink roadmap is called "More than Moore" |
| to Moore"s Law - New technologies like EUV |
addresses limitations of traditional shrinking |
- Packaging becomes key enabler for scaling and some |
| and multiple pattering allow further scaling |
- Increased packaging density - Reduced footprint - Complementary technology to Moore"s Law |
manufacturing value is shifting from silicon to the package |
| - Technical challenges and limitations make it increasingly more difficult and expensive to |
- Performance and complexity increase combined with smaller footprint |
|
| reduce the feature size | - Reduced energy consumption |
|
Increasing chip performance requires adoption of innovative lithography technologies in the semiconductor backend
NanoImprint
Evolution: Innovative UV Lithography Alternatives:
| • Micro-optical arrays are important optical elements to enhance the performance of lithography solutions • For SUSS MicroTec this is a key competence |
|---|
| • Our innovation and technology leadership position is a solid base for continuous future growth • Over the last 10 years a CAGR of 20% could be achieved |
New fab allows to move from one shift (8h/5d) to 24/7 operation
I. SUSS MicroTec at a Glance
VI. Outlook
| in € million | 2012 | 2011 | YoY in % |
|---|---|---|---|
| Revenue | 163.8 | 175.4 | -6.6% |
| Order Intake | 157.2 | 143.1 | 9.9% |
| Order Backlog 12/31 | 86.5 | 83.7 | 3.3% |
| EBIT | 11.7 | 18.6 | -37.1% |
| EBIT in % of Sales | 7.1% | 10.6% | -3.5%pt. |
| Net Cash* | 32.3 | 42.0 | -23.1% |
| Free Cash Flow** | -4.5 | 3.5 | <-100% |
*incl. stock of interest-bearing securities
**before consideration of purchased interest-bearing securities and M&A activities
Guidance Investment Case Strong fundamental growth in target markets Strong competitive positioning: first or second in the target markets Leading equipment company in the semiconductor backend, enabling "Moore"s Law" as well as "More than Moore" Significant mid term revenue opportunity FY 2013: - Sales of approximately 150 € million - EBIT: low single digit € million amount
Play active role in the consolidation of the backend
SÜSS MicroTec AG Schleissheimer Str. 90 85748 Garching
www.suss.com
Tel.: +49 (0) 89-32007- 161 Fax.: +49 (0) 89-32007- 451 Email: [email protected]
SÜSS MicroTec AG Schleissheimer Strasse 90 85748 Garching (Munich) Germany www.suss.com
| Cheuvreux German Corporate Conference, Frankfurt/Main | 21. Jan. |
|---|---|
| Annual Report 2012 | 28. Mar |
| Quarterly Report 2013 | 8. May |
| Commerzbank German Midcap Conference, Boston/New York | 22./23. May |
| Shareholders" Meeting, Haus der Bayerischen Wirtschaft, Munich |
19. Jun. |
| Interim Report 2013 | 8. Aug. |
| Commerzbank TMT Conference, Frankfurt | 28. Aug |
| UBS Best of Germany Conference, New York | 16. - 18. Sep |
| UniCredit/Kepler Investment Conference, Munich | 24. - 26. Sep |
| Baader Investment Conference, Munich | 24. - 26. Sep |
| Nine-month Report 2013 | 7. Nov. |
| German Equity Forum, Frankfurt/Main | 11. - 13. Nov |
Major Shareholders: DWS Germany 8.68% Credit Suisse Switzerland 3.35% BlackRock 3,23% Henderson Global Invest. 3.14% DWS Luxembourg 3.04%
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