SÜSS MicroTec SE — Investor Presentation 2013

Aug 26, 2013

SUSS MICROTEC INVESTOR PRESENTATION

September 2013

This presentation contains forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec AG and its subsidiaries and associates. Forward-looking statements are based on current plans, estimates, projections and expectations and are therefore subject to risks and uncertainties, most of which are difficult to estimate and which in general are beyond the control of SUSS MicroTec AG. Consequently, actual developments as well as actual earnings and performance may differ materially from those which explicitly or implicitly assumed in the forwardlooking statements. SUSS MicroTec AG does not intend or accept any obligation to publish updates of these forward-looking statements.

TABLE OF CONTENT

I. SUSS MicroTec at a Glance

• II. Products and Markets
• III. Growth Opportunities
• IV. Enhanced Lithography Portfolio
• V. Financials
• VI. Outlook

SUSS MICROTEC AT A GLANCE

• SUSS MicroTec: A global leader in semiconductor equipment
• Our equipment and process solutions create the micro structures that build and connect micro electronic devices
• We are focused on high growth market segments: Semiconductors, MEMS, LEDs

Key Data:

• Stock Exchange Symbol: SMHN
• TecDAX
• Share price*: 7.23 €
• Market Cap*: 138 € million
• Net Cash, June 30, 2013: 19.5 € million

* July 31, 2013

SUSS MICROTEC IN THE VALUE CHAIN

• Key player in providing state-of-the-art semiconductor manufacturing equipment
• Development of highly innovative process solutions with industry and R&D partners
• Components for electronic devices like cell phones, PCs and tablet computers are produced on SUSS MicroTec's equipment

THE SEMICONDUCTOR MARKET

SUSS MICROTEC – A GLOBAL PLAYER

MAIN PRODUCTION SITES

Germany USA

Garching

• SUSS MicroTec HQ
• Development/production:
• Mask Aligner
• Bond Aligner
• Core competencies:
• Exposure (proximity exposure)
• Alignment

Sternenfels

• Development/production :
• Bonder
• Coater and Developer
• Photomask Equipment
• Core competencies:
• Wet processing
• Wafer bonding

Corona

• Development/production:
• Stepper/Scanner
• Laser Processing
• Core competencies:
• Exposure (UV projection lithography)
• Laser Ablation

TABLE OF CONTENT

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities
• IV. Enhanced Lithography Portfolio
• V. Financials
• VI. Outlook

KEY MARKETS

Extraordinary expenses of € 6.0 million, which accrued in connection with the refocusing of the Permanent Bonding

• Thereof, € 4.6 million value adjustments on capitalized development costs from the years prior to 2008, demonstration equipment, and other inventories
• Thereof, € 1.4 million provisions for commitments and other agreements

• One-off effect was € 0.8 million lower than originally expected, because of lower valuation adjustments on demonstration equipment

• I. SUSS MicroTec at a Glance

• II. Products and Markets
• III. Growth Opportunities
• IV. Enhanced Lithography Portfolio
• V. Financials
• VI. Outlook

TECHNOLOGY EVOLUTION

GROWTH DRIVER SMARTPHONES AND TABLETS

Source: Yole Developpement

MICROCHIPS, MEMS UND LED: BUILDING BLOCKS FOR TECHNOLOGICAL PRODUCT ADVANCEMENT

Digital Lifestyle	- The "Digital Lifestyle" is characterized by permanent internet connectivity and convergence of media - Mobile devices like smartphones and tablet PCs provide this capability at affordable cost - New device generations offer higher functionality
E-Mobility	- Alternative transportation / mobility solutions are getting more traction with attractive price / performance ratios - EVs, Hybrid-Cars, Segways, E-Bikes, but also trains drive the need for power devices but also high performance ICs
Energy Efficiency	- Increase environmental awareness and rising energy prices and fuel the demand for energy efficient solutions in electricity usage i.e. lighting - Energy efficiency in industrial production - Smart energy management in household applications safes energy

With its strong position in the fast growing target markets 3D Integration / Advanced Packaging, LED and MEMS, SUSS MicroTec can benefit from the market developments:

Advanced Packaging	Wafer level packaging and flip chip is expected to remain more robust than the overall market, primarily driven by mobile devices like smart phones and tablets
3D Integration (TSV)	Transition to production volume in the years to come
Compound Semiconductors	LED, MEMS, RF, Optoelectronics, III-V Power are expected to remain robust based on smartphone and tablet growth and will drive further demand for advanced packaging solutions

Segment growth 2011 - 2016E CAGR ~ 15% (Gartner and industry estimates)

SCALING TECHNOLOGIES FROM 2D TO 3D

2D Packaging 2.5D Packaging 3D Integration (TSV) - Combining of several (and heterogeneous) semiconductor components on an interposer addresses limitations of traditional shrinking - Increased packaging density - Reduced footprint - Complementary technology to Moore's Law - The extension beyond the conventional shrink roadmap is called "More than Moore" - Packaging becomes key enabler for scaling and some manufacturing value is shifting from silicon to the package - Performance and complexity increase combined with smaller footprint - Reduced energy consumption - Increased performance and complexity of ICs by shrinking transistor geometry according to Moore's Law - New technologies like EUV and multiple pattering allow further scaling - Technical challenges and limitations make it increasingly more difficult and expensive to reduce the feature size

SUSS MicroTec"s equipment and process solutions enable 2D shrinking ("Moore's Law") and 3D stacking ("More than Moore")

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities

IV. Enhanced Lithography Portfolio

• V. Financials
• VI. Outlook

LITHOGRAPHY COMPETENCY

• Increasing chip performance requires the adoption of innovative lithography technologies in the semiconductor backend
• Not one single exposure technology fits all needs at the same time
• The newly acquired Stepper/Scanner products supplement our Mask Aligner product line and enlarges our technology portfolio by the key competencies UV-projection lithography and laser ablation
• SUSS MicroOptics S.A. adds key know how for critical lithography performance improvements

EXPOSURE SOLUTIONS

Only SUSS MicroTec offers complete exposure solutions for the mid-/back-end

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities
• IV. Enhanced Lithography Portfolio

V. Financials

VI. Outlook

ORDER ENTRY AND SALES BY SEGMENT AND REGION H1 2013

LONG TERM BUSINESS DEVELOPMENT

EBIT, FREE CASH FLOW AND NET CASH DEVELOPMENT

* one-off effect from refocusing product line permanant bonding

in € million	Q2 2013	Q2 2012	in %	H1 2013	H1 2012
Order Intake	36.7	41.4	-11.4%	71.6	80.4
Order Backlog 6/30	102.5	107.2	-4.4%	102.5	107.2
Revenue	24.9	36.3	-31.4%	55.0	67.5
EBIT	-11.7	1.6	--	-15.0	1.5
EBIT in % of Sales	-47,0%	4.4%	--	-27.3%	2.2%
EBIT (adjusted)	-5.7	1.6	--	-9.0	1.9
EBIT (adjusted) in % of Sales	-22.8%	4.4%	--	-16.4%	2.8%
Earnings after tax (continuing operations)	-9.1	0.6	--	-11.6	0.4
Earnings after tax	-9.1	0.6	--	-11.6	1.9
EPS in €	-0.48	0.03	--	-0.61	0.10
Free Cash Flow*	-5.2	-7.4	--	-12.4	-7.1
Net Cash**	--	--	--	19.5	30.1
Employees 6/30	--	--	--	680	689

* before consideration of purchased interest-bearing securities , the acquisition of Tamarack and the gain out of the sale from the Test Business

** incl. stock of interest-bearing securities

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities
• IV. Enhanced Lithography Portfolio
• V. Financials
• VI. Outlook

2013: - Milestone achievement in temporary bonding - Refocusing of product line Permanent Bonding - Further integration of SUSS MicroTec Photonic Systems
Fundamental growth in target markets
Strong competitive positioning: first or second in the target markets
Leading equipment company in the semiconductor backend, enabling "Moore"s Law"as well as "More than Moore"

Outlook

FY 2013: - Sales of approximately 150 € million - EBIT: minus 10 – minus 15 million €

Q3 2013: - Order Intake 30 - 40 € million

SÜSS MicroTec AG Schleissheimer Str. 90 85748 Garching

www.suss.com

Franka Schielke

Tel.: +49 (0) 89-32007- 161 Fax.: +49 (0) 89-32007- 451 Email: franka.schielke@suss.com

SÜSS MicroTec AG Schleissheimer Strasse 90 85748 Garching (Munich) Germany www.suss.com

Contact Financial Calendar 2013

Interim Report 2013	8. Aug.
Commerzbank TMT Conference, Frankfurt	28. Aug
Deutsche Bank Technology Conference, Las Vegas	11.-12. Sep.
Bankhaus Lampe German Technology Seminar, Zurich	13. Sep.
UBS Best of Germany Conference, New York	16. - 18. Sep
Baader Investment Conference, Munich	24. Sep.
Berenberg/Goldman Sachs, German Corporate Conference	25. Sep.
UniCredit/Kepler Investment Conference, Munich	26. Sep.
Nine-month Report 2013	7. Nov.
German Equity Forum, Frankfurt/Main	11. - 13. Nov
Morgan Stanley TMT Conference, Barcelona	21. - 22. Nov

OUR TECHNOLOGY ENABLES SUSTAINABILITY

Equipment	Applications	Initiatives
- SUSS MicroTec equipment is designed to efficiently use electricity and chemicals - ReMan, the remanufacturing operation of SUSS MicroTec	- 3D IC and chip scaling helps reducing energy and material consumption - LEDs for efficient lighting solutions	- Partner company of VDMA BlueCompetence initiative, a network of equipment providers in Germany, who are following a sustainable business approach
takes back used equipment and refurbishes it	- MEMS applications improve performance of mobile devices and conserve energy - Shift to renewable energies requires more power devices and	- Innovative lighting solution in Sternenfels - Improved climatization system of cleanrooms - Paperless invoice system
	high-performance ICs (e.g. for solar and wind power systems) - Laser Ablation in lieu of photolithography (seed layer removal)

SUSS MICROTEC PRODUCT PORTFOLIO

32 SUSS MicroTec Investor Presentation