SUSS MicroTec - Capital Markets Day
Program
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Company Presentation February 2011Capital Markets DaySternenfels, October 20, 2011
Disclaimer
This presentation contains forward-looking statements relating to the business, financial performance and earnings of SÜSS MicroTec AG and its subsidiaries and associates. Forward-looking statements are based on current plans, estimates, projections and expectations and are therefore subject to risks and uncertainties, most of which are difficult to estimate and which in general are beyond the control of SÜSS MicroTec AG.Consequently, actual developments as well as actual earnings andperformance may differ materially from those which are explicitly or implicitly assumed in the forward-looking statements. SÜSS MicroTec AG does not intend or accept any obligation to publish updates of these forward-looking statements.
Content
I.SUSS MicroTec today
- II.Sternenfels, a Business Location with Potential
- III. Our four Product Lines:
- Mask Aligner
- Coater/Developer
- Wafer Bonder
- Photomask Equipment
- IV.Strategic Outlook
SUSS MicroTec – A Global Player
Optimizing Structures – Shaping the Future
Garching
- SÜSS MicroTec AG HQ
- Development and production:
- Mask Aligner
- Bond Aligner
- Core competencies:
- Exposure
- Alignment
Sternenfels
- Development and production :
- Bonder
- Coater and Developer
- Photomask Equipment
- Core competencies :
- Wet processing
- Wafer bonding
Divestment of SUSS Photomask Precision Inc.
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- Sale of SUSS MicroTec Precision Photomask Inc. to Compugraphics Inc.,Los Gatos, CA
- -Sale of all assets
- -Limited synergies with core business units
- -Focus on profitable and high growth business areas
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- Supports the expansion of the SUSS MicroTec Photo Mask Equipment
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- Eliminating competitive overlap with prospective customers
The Purchaser:
- Compugraphics is a globally acting mask manufacturer with mask shops in the US, UK and Germany
Content
I.SUSS MicroTec today
II.Sternenfels, a Business Location with Potential
III.Our four Product Lines:
Mask Aligner
Coater/Developer
Wafer Bonder
Photomask Equipment
IV.Strategic Outlook
Sternenfels – Our Major Production Facility
- The production site was built in three steps between 1991 and 1998
- Total costs of land and building the facility amounted to approx. € 20 million
- SUSS MicroTec paid € 4.5 million for the land and the buildings in 2010
- 15.000 m² production facilities
- 34.000 m² land
- 270 employees, of which approximately 50 are temporary workers
Sternenfels - Synergies and Flexibility
- Three product lines under one roof: Photomask Equipment - Coater/Developer - Bonder
- Modern production facility with two large clean rooms supporting future business expansion
- Reduction of complexity and establishment of flexible production structures
- Synergies in purchasing, administration and research and development
Sternenfels - The new Competence Center
- Competence center for wet processing and wafer bonding
- Establishment of a research and development center:
- Technology
- Product development
- Application development
- Customer Care Center
- Supply Chain Management
Sternenfels - Site for Volume Manufacturing
Divisions and Products
Markets
Content
- I.SUSS MicroTec today
- II.Sternenfels, a Business Location with Potential
- III.Our four Product Lines:
Mask Aligner
Coater/Developer
Wafer Bonder
Photomask Equipment
IV.Strategic Outlook
Mask Aligner – A Look at the Inside
Mask Aligners are 1X full field exposure systems that offer an excellent cost of ownership and ease of use compared to competing stepper technology.
Mask Aligner – Product Overview
Manual Equipment(100mm, 150mm, 200mm)
MJB4 MA6 MA/BA8 Gen3
Support also emerging applications like UV-NIL, SCIL, bond alignment, wafer level microlens UV replication and UV-bonding (SMILE).
Automated Equipment (100/150mm, 200mm, 300mm)
MA100/150e /MA200/300 Gen2
Provide best possible cost of ownership by achieving highest throughput at superior alignment accuracy. Combine state of the art pattern recognition with excellent print results. Different product enhancements available to further optimize and advance the level of automation.
Integrated LithographyClusters (200mm and 300mm)
LithoPack 200 / 300
SUSS Lithography Clusters are integrated coat, bake, expose, develop solutions thatespecially used in volume production.
Mask Aligner – The right Equipment for every Target Market
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Mask Aligner – Focus on Growth Markets
LED
- Trend to larger substrate sizes with continued pressure to reduce cost / lumen.
- Development of dedicated LED lithography equipment to meet technological requirements at best cost of ownership.
MEMS
- Trend to 200mm fabrication for mature products and customized solutions for emerging applications
- Development of specific 200mm lithography solutions plus integration of new technologies(i.e. SELECT)
Advanced Packaging
- Mainly driven to reduce cost and form factor for chip and system packages with high pin count
- Fastest growing semiconductor packaging technology
- Development and launch of emerging WLP technologies like FanOut WLP and 3D WLP for MEMSand LED just happening now
- Development of 200 and 300mm WLP solutions to offer best possible cost of ownership
Mask Aligner – Challenges
- Competition with higher performance lithography technology (projection vs. proximity printing)
- Continued efforts to improve and strengthen the strong position in cost of ownership:
- Yield improvements (CD uniformity, overlay accuracy, uptime, etc…)
- Throughput improvements
- New development of Next Generation Exposure Optics based on micro lens arrays which deliverssuperior optical performance plus customizedillumination and optical proximity correction(frontend lithography technologies)Micro Lens Integrators
(a SUSS MicroOpticsproduct)
Content
- I.SUSS MicroTec today
- II.Sternenfels, a Business Location with Potential
- III. Our four Product Lines:
- Mask Aligner
Coater/Developer
Wafer Bonder
Photomask Equipment
IV.Strategic Outlook
Coater/Developer – A look at the Inside
Spin Coater Spray Coater Developer
200mm Automated Coat/Develop Cluster
Coater/Developer –Product Overview
Manual Equipment(200mm, 300mm)
Automated Equipment (200mm, 300mm)
LabSpin 6/8 Delta80 RC/12 RC
LabSpin Systems, the smallest coater/developer system for basic applications are offered as table top systems or for integration into a wet bench.
The Delta series is the perfect tool for R&D, universitiesand start-up companies.
Gamma, ACS200 Plus,ACS300 Gen2
Highly automated, modular systems for wafers up to 300mm configurable with differentmodules like:spin/spray coaters, aqueous/solvent developer, primer and temperature stack.
Integrated LithographyClusters (200mm and 300mm)
LithoFab 200 / LithoPack 300
SUSS Lithography Clusters are integrated coat, bake, expose, develop solutions thatespecially used in high volume production for unmatched process stability.
Coater/Developer -The right Equipment for every Target Market
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Coater/Developer – Focus on Growth Markets
LED
- Trend to larger substrate sizes with continued pressure to reduce cost / lumen.
- Development of dedicated LED lithography equipment to meet technological requirements at best cost of ownership
MEMS
- Trend to 200mm fabrication for mature products and customized solutions for emerging applications
- Development of specific 200mm lithography solutions plus integration of new technologies(i.e. Spray Coating)
Advanced Packaging
- Thick resist photo lithography is an indispensable element of wafer bumping and advanced wafer level packaging
- The challenges of photoresist processing in the field of wafer bumping and wafer level packaging requires very carful design of coat, bake and develop modules in order to attain suitable production quality performance
- Combining the AltaSpray Technology with the SUSS LGO Optics guarantees most effective patterning of high topographiesfor various applications
Coater/Developer – Challenges I
Spray Coating
Resist film tends to tear at the topography edges
Limited control of resist thickness at the bottom of the topography
Goal: Uniform coating of topography
AZ4999, positive resist,4µm top / 2.2µm sidewall coverage
AZ4999, positive resist,4µm coverage over 200µm deep KOH structure
Coater/Developer – Challenges II
Thick Resist Coating / Developing
TOK PMER PLA900, positive resist,10µm lines / 40µm spaces
JSR THB151-N, negative acting,75 micron thick
3D Coating/ Developing
AZ 4999 positive resist, 10µm thickness,50µm l/s across 200µm deep etched trench,
Positive resist on passivation layer, Via size: opening 140µm, depth 120µmUsed for image sensor packaging
Content
- I.SUSS MicroTec today
- II.Sternenfels, a Business Location with Potential
- III. Our four Product Lines:
- Mask Aligner
- Coater/Developer
Wafer Bonder
Photomask Equipment
IV.Strategic Outlook
Wafer Bonder – Overview Bonding Technologies
Wafer Bonder – Overview
Bond Aligner
Wafer clamped into transport fixtureafter alignment
Wafer Bonder – A Look at the Inside
Wafer Bonder – Product Overview
Manual Equipment(Small pieces to 200mm)
Semi-Automated andAutomated Equipment (up to 200mm)
Manual Wafer Bonders are designed for R&D, pilot production and low labor cost production environments
One chamber designed for all types of bond processes –including anodic, glass frit, thermocompression, polymer and adhesive bonding – offers ultimate flexibility
CB200M CBC200
Semi-Automated Wafer Bonders allow for high PerformanceWafer Bonding
Achieve unmatched pressure uniformity, alignment stability and thermal performance with the CB200M wafer bonder for MEMS, 3D stacking and LED bonding applications.
Automated Equipment (200mm and 300mm)
XBC300
Automated Permanent & Temporary Wafer Bonding Systems are designed for volume production.
Wide selection of process modules for permanent and temporary bonding allows for greater flexibility
High throughput withsmallest footprint
Substrate Bonder -The right Equipment for every Target Market
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Substrate Bonder – Focus on Growth Markets
- CMOS Image Sensors (Permanent Bonding: Si-Si, Si-Glass)
- Driven by mobile device market and e-mobility
- LED (Permanent Bonding: Metal-Metal, e.g. Au-Au, Temporary Bonding and Debonding in R&D)
- Driven by the digital lifestyle and the trend to increase energy efficiency
- MEMS (Permanent Bonding)
- MEMS production relies on permanent bonding technologies for the capping layer
- Trend from Glas-Silicon to Metal-Metal, e.g. Al-Ge
- Development of new bonding chamber designed for new MEMS applications (up to 90 kN bond force)
- Automated platform with 6 modules for high volume throughput (CBC200)
- 3D-Integration (Temporary Bonding and Debonding, Permanent Bonding: Metal-Metal, e.g. Cu-Cu, Cu-Sn)
- Open-Platform-Strategy allows SUSS MicroTec to serve different applications/customers with the same platform
- SUSS MicroTec supports all currently available temporary bonding and debonding technologies
Overview on Temporary (De-Bonding): Traditional vs. New Processes
New Trend:
Mechanical Room Temperature Release / Release Layer Approaches
SUSS XBC300
Laser Release
Traditional Methods:
Thermal Slide
WaferBOND™
Overview on Temporary Bonding and Debonding: Traditional Slide and Laser Debond vs. New Peel-Off Processes
New Room Temperature / Peel-Off Debonding that meet 3D-IC requirments
Traditional Thermal Slide and Laser Debonding
Challenges of 3D- Integration
Content
- I.SUSS MicroTec today
- II.Sternenfels, a Business Location with Potential
- III. Our four Product Lines:
- Mask Aligner
Coater/Developer
Wafer Bonder
Photomask Equipment
Photomask Manufacturing Process
1. Chrome blank production
- 11.Metrology
- 12.Inspection for defects
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13.Repair of defects
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15.Pellicle mounting
- to protect active layer from particles
- 16.Final Inspection
Mask Manufacturing Products
Photomask Equipment – Product Overview
250 nm to 90 nm
ASx Series HMx Series
The ASx Series is the photomask processing platform for 250nm to 90nm technology nodes.
HMx is manually operated and enables processing of small series or pilot production of special substrates.
> 90 - 32nm
MaskTrack
MaskTrack is a multi-purpose, fully-automated platform for imprint mask cleaning and critical photomaskprocessing; Post Exposure Bake, Develop, Strip and Clean. < 32 nm
MaskTrack Pro
MaskTrack Pro was designed to balance the most stringent conditions of 193i 22nm hp DPT, Extreme Ultraviolet Lithography and Nano-Imprint Lithography processing with innovative techniques to maximize mask performance.
Photomask Equipment - Challenges
193i DPT ChallengesEUVL Challenges
•Pellicle adhesive removal
- •CD, phase & overlay stability
- •Haze prevention
- •Pattern fragility
- Electrostatic
- •Surface layer integrity
- •Mask lifetime
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•Mask availability
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•Vacuum compatibility
- •Carbon deposition
- •CD & overlay stability
- •Pattern fragility
- •Surface layer integrity
- • Heat sensitivity of mirror stack
- •Mask lifetime
- •Mask availability
- •Backside particles
Cleaning Requirements
- • 100% removal of sub -20nm particles
- •No residual ions or moisture
- • Minimum change to optical properties of surface layers
- •Highest first -pass cleaning yield
- • Zero ESD, Galvanic erosion or Electric field material migration
- •No pattern damage (incl. SRAF)
- • Precise removal of carbon deposition
- • Zero damage to mirror stack or absorber
Lithography Driving Mask Challenges
February 2011Site Visit
Content
- I.SUSS MicroTec today
- II.Sternenfels, a Business Location with Potential
- III.Our four Product Lines:
Mask Aligner
Coater/Developer
Wafer Bonder
Photomask Equipment
IV.Strategic Outlook
Market Forecasts I
Source: Yole Developpement
Market Forecasts II
Source: Yole Developpement
Guidance
Investment case
- Strong competitive positioning: first or second in the target markets
- Expansion of the solid financial situation and increasing profitability
- Strong fundamental growth in target markets
- Significant mid term revenue opportunity
- Evolve to a leading company in the semiconductor backend, enabling 3D integration while supporting "Moore's Law" as well as "More than Moore"
- Participate in the consolidation of the backend
February 2011Thank you!