Scientech — Investor Presentation 2018

May 22, 2018

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(3583)

2018/5/23

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Safe Harbor Statement

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• This Presentation contains certain forward-looking statements that are based on current expectations and are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements.

• Except as required by law, we undertake no obligation to update any forward –looking statements, whether as a result of new information, future events or otherwise.

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Scientech Corp (3583: TT)

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|||
|---|---|
|Company|
|Establishment|1979/10/17|
|IPO|2013/3/12|
|Capital|NT$ 811 Million|
|Chairman|H.L. Hsieh|
|President|M.T. Hus|
|、|、|
|Equipment Manufacturing|Wafer Reclaim|
|Products|
|Trading(Agent/Distributor)|

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Business Overvies Products

Future Prospect

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Business Overview

Income Statement

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Units：NT $ M	2013	2014	2015	2016	2017	1Q18
Revenues	3,068	2,717	2,942	3,495	3,539	694
Gross Profit	983	970	903	1,178	1,251	239
Operating Expenses	629	673	779	835	829	199
Operating Income	354	297	124	343	423	40
Other Income and Expenses	(26)	20	(6)	21	(8)	(22)
Income Before Tax	328	317	119	363	415	18
Net Income	249	246	86	292	328	16
EPS	3.11	3.04	1.06	3.60	4.05	0.19
Gross Margin	32.04%	35.71%	30.69%	33.71%	35.36%	34.39%
Operating Margin	11.53%	10.93%	4.23%	9.80%	11.95%	5.71%
Income Before Tax margin	10.69%	11.68%	4.03%	10.40%	11.72%	2.57%

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Business Overview

Products Mix

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Units：%	2013	2014	2015	2016	2017	Gross Margin
Trading	59	50	59	51	54	Below Average
Manufacturing	41	50	41	49	46	Above Average

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Business Overview

R&D Expenses

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Units：NT $ M	2013	2014	2015	2016	2017
R&D Expenses	131	160	196	226	228
Expenses as % of Revenue	4.27%	5.89%	6.66%	6.48%	6.44%

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Products

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Wet Process
Equipment
Equipment
Manufacturing
Trading
Wafer
(Agent/Distr
Reclaim
ibutor)
Semiconductor and 12” Wafer
Optoelectronics
Reclaim
Process Equipment
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Products

Equipment Manufacturing

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Wet process equipment  Single wafer/ Batch type

• 8”/12’ Advanced packaging

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、
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、 、 (Fan-out Solder Bump 、 、 Copper Pillow Bumping 、 、 Gold Bump RDL TSV …ect)

• 6”/ 8”/12” Front-end special 、 、

• process (IoT Sensor Power IC 、 、 、

• FP sensor RF CMOS Touch 、

• Controller MEMS)

• HB LED fully-automatic process

• MEMS

• III-V

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Products Si Wafer Reclaim

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Advanced clean technology
Complete particle inspection
20nm/ 16nm Particle
• (SP1-DLS & SP2)
Low trace metal (<5E9)
•
 12” Wafer Reclaim
Cleaning Etching

Capacity: 120K / month

Separated Cu & Non Cu
Line
Full Process
Optimization
Polishing Grinding
Complete polishing process Super flatness
Single side polish • (GBIR<0.5 m m)
Double side polish
•
Final Haze polish 10
•
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Products

Trading (Agent/Distributor)

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Multi
Exclusive
applicati
Agency
on
Supply Chain
Partnership
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Future Product-based Extension Prospect

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Wet Process Equipment ------------------- Front-end Wet Process Equipment Wafer Support System Mass Spectrometer

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Equipment
Manufacturing
Trading
Wafer
(Agent/Distr
Reclaim
ibutor)
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Semiconductor and Optoelectronics Process Equipment

12” Wafer Reclaim ------------------- SiC Wafer Reclaim

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AMOLED Advanced Process Miniaturization

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Q & A

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Thank You!

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