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Scientech Investor Presentation 2026
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Investor Presentation
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SCIENTECH
Scientech Corp.
MT Hsu 2026/05/12
SCIENTECH Confidential
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SCIENTECH
Safe Harbor Statement
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This Presentation contains certain forward-looking statements that are based on current expectations and are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements.
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Except as required by law, we undertake no obligation to update any forward-looking statements, whether as a result of new information, future events or otherwise.
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Agenda
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Agenda
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SCIENTECH
About Us
Overview | Milestones | Location | Organization
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Overview
Abou Us Products & Services Contact
SCIENTECH
SCIENTECH
Product and Technology
- Equipment Design and Manufacturing
- Wafer Reclaim
- Representative
Industries We Serve
- Semiconductor (Front-End and Advanced Packaging)
- Compound Semiconductor
- LED / Mini LED / Micro LED
- Flat Panel Display (TFT-LCD, AMOLED, Touch Panel)
Established: 1979
Taipei, Taiwan
Capital: US$ 27 Million
TWSE:3583
Employees: >1,100 (Worldwide)
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SCIENTECH
Employees
Over 1,100 Employees
Representative
- 145 in Taiwan
- 130 in China
- 70% in Service and Process Support
Wafer Reclaim
- 310 in Total
Equipment Design and Maf'g
- 430 in Total
- 130+ in R&D, Process and Design
Administration
- 85 in Total
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Milestones
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Locations - Taiwan
Taipei Headquarter
HuKou Factory
- Equipment Design and Manufacturing
- Equipped With Class 10/1,000/10,000 Clean Room
- Wafer Reclaim
Chiayi Office
Kaohsiung Office
HsinChu Office
Taichung Office
Tainan Office
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SCIENTECH
Locations - Worldwide
Europe
- Villach, Austria (2020)
- Sales and Service Office to support European customers
- Interface with our factory and European Customers
- New Product / PRODUCTS Development
USA
- Santa Clara, CA (1994)
- Sales and Service Office
- Interface with Principals and U.S. Customers
- New Product / PRODUCTS Development
China
- Beijing office (2004)
- Dalian office (2012)
- Xian (2013)
- Chongqing office (2010)
- Changzhou (2012)
- Wuxi office (2003)
- Shanghai Office (2001)
- Wuhu office (2013)
- Xiamen office (2011)
- Huizhou office (2013)
- Qunming Office (2002)
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SCIENTECH
Organization
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SCIENTECH
Products & Services
Wafer Reclaim | Equipment Manufacturing and Design | Representative
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R&D Expenses
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| Units : NT $ M | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026/Q1 |
|---|---|---|---|---|---|---|---|
| R&D Expenses | 248 | 280 | 320 | 320 | 378 | 463 | 152 |
| Expenses as % of Revenue | 6.9% | 6.0% | 5.7% | 5.7% | 3.9% | 4.1% | 4.9% |
| Expenses as % of Manufacturing | 16.5% | 14.9% | 15.3% | 15.7% | 11.3% | 9.8% | 9.9% |
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Patents
SCIENTECH
- The cumulative number of patents on file is 204, and 50 applications are pending.
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Products
SCIENTECH
Equipment Design and Manufacturing
- Advanced Package
- FEOL
- Mask
- Compound
- etc...
Wafer Reclaim
- 12" Si Wafer
Representative
- Equipment/Metrology
- Sub-System
- Material
- Repair and Refurbish
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Wafer Reclaim Service
Advanced Clean Technology
- 19nm Particle
- Low Trace Metal (<1E9)
Advanced Defect Inspection (SP1/SP2/SP5/SP7)
12" Si Wafer
- Capacity: 210K / Month
- Cu and Non-Cu Process
Capacity Expansion
- Additional 40K / Month by end of 2026
Complete Polishing Process
- Single/Double Side Polish
- Final Haze Polish
Super Flatness (GBIR < 0.5mm)
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Equipment Design & MFG
Wet Bench
Wet Single Wafer
TBDB
Baking
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Equipment Design & MFG
Wet Process – Bench
Application
- Semiconductor: FEOL, BEOL, Compound
- Advanced Packaging/Bumping...
Features
- Cassette type or Cassette-less type
- Adopted by big international companies
- Leading-edge technologies
Process
- Etch: Metal/Oxide/Nitride remove
- Stripper: PR/PI strip, Polymer remove
- Clean: Pre/Post/Flux clean
- Electro-less Plating: Zn/Ni/Pd/Au
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Equipment Design & MFG
Wet Process – Single Wafer
Application
- Semiconductor: BEOL, FEOL, Compound
- Advanced Packaging/Bumping
Features
- Soak/Immersion + Single
- Adopted by big international companies
- Leading-edge technologies
Process
- UBM / Metal Etch
- Flux Clean (Hot DIW)
- PR Strip
- Wafer Clean (APC, Soft spray)
- Final Clean/Mask Clean/Frame Clean
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Equipment Design & MFG
Temporary Bonding De-Bonding
Application
- IGBT & SiC Power Device
- Advanced Packaging for Semiconductor
Features
- User-friendly graphical user interface
- Adopted by big international companies
- Leading-edge technologies
Process
- Temporary Bonding
- Temporary De-bonding
- Release Layer Coating
- Carrier (Glass) Recycling
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Equipment Design & MFG
Moisture Baking
Application
- Semiconductor: BEOL
- Advanced Packaging for Semiconductor
Features
- Availability for horizontal or vertical process
- High precision temperature control
- Weight handling capacity up to 23kg per lot
Process
- Pre-underfill baking
- Pre-mold baking
- DFR Hard Bake
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Trading (Agent/Distributor)
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SCIENTECH
Representative Product Lines
Lithography
KING SEMI
Vistec
Electron Beam
ESOL
USHIO
Etch
Thin Film
Diffusion
ClassOne TECHNOLOGY
Intivac
THIN FILM
ProOptics
AXUS TECHNOLOGY
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Representative Product Lines
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Corporate Governance
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Certificates
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ESG
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Sustainability Report Officially Released since 2024/08
Eco-Friendly Manufacturing
Safe And Warm Working Environment
Operating With Integrity
Contributing To Society
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Exhibition
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Exhibition
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Financial Results
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Income Statement
| Units : NT $ M | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026/Q1 |
|---|---|---|---|---|---|---|---|
| Revenues | 3,580 | 4,684 | 5,650 | 6,911 | 9,688 | 11,371 | 3,120 |
| Gross Profit | 1,456 | 1,667 | 2,084 | 2,201 | 2,906 | 3,814 | 1,119 |
| Operating Expenses | 991 | 1,112 | 1,374 | 1,483 | 1,790 | 2,238 | 645 |
| Operating Income | 465 | 555 | 710 | 718 | 1116 | 1,576 | 474 |
| Income Before Tax | 389 | 524 | 736 | 860 | 1277 | 1,540 | 441 |
| Net profit attributable to: Owners of the Company | 305 | 420 | 568 | 650 | 927 | 1,110 | 333 |
| EPS | 3.80 | 5.23 | 7.08 | 8.10 | 11.54 | 13.82 | 4.14 |
| Gross Margin | 41% | 36% | 37% | 32% | 30% | 34% | 36% |
| Operating Margin | 13% | 12% | 13% | 10% | 12% | 14% | 15% |
| Income Before Tax Margin | 11% | 11% | 13% | 12% | 13% | 14% | 14% |
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Annual Revenue
| Units
NT $ M | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2025/Q1 | 2026/Q1 |
| --- | --- | --- | --- | --- | --- | --- | --- | --- |
| Revenue | 3,580 | 4,684 | 5,650 | 6,911 | 9,688 | 11,372 | 2,814 | 3,120 |
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EPS
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| UNIT : NTD | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
|---|---|---|---|---|---|---|
| EPS | 3.80 | 5.23 | 7.08 | 8.10 | 11.54 | 13.82 |
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Equipment Revenue
| SALES
Units NT $ K | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026/Q1 | 2026 |
| --- | --- | --- | --- | --- | --- | --- | --- | --- |
| Equipment | 931,518 | 1,134,379 | 1,207,789 | 1,325,760 | 2,590,217 | 3,715,167 | 1,255,868 | |
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Wafer Reclaim Revenue
| SALES
Units NT $ K | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026/Q1 | 2026 |
| --- | --- | --- | --- | --- | --- | --- | --- | --- |
| Wafer Reclaim | 575,527 | 716,779 | 864,409 | 855,320 | 762,958 | 1,008,562 | 277,112 | |
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Manufacturing Revenue
| SALES
Units NT $ K | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026/Q1 | 2026 |
| --- | --- | --- | --- | --- | --- | --- | --- | --- |
| Manufacturing | 1,507,045 | 1,851,158 | 2,072,198 | 2,181,080 | 3,353,175 | 4,723,729 | 1,532,980 | |
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Trading Revenue
| SALES
Units NT $ K | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026/Q1 | 2026 |
| --- | --- | --- | --- | --- | --- | --- | --- | --- |
| Trading | 2,072,958 | 2,832,629 | 3,577,788 | 4,730,901 | 6,335,105 | 6,647,828 | 1,587,342 | → |
Trading
~ US$ 210M
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Products Mix – Revenue
| Units : % | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026/Q1 | 2026 | Gross Margin |
|---|---|---|---|---|---|---|---|---|---|
| Trading | 58 | 60 | 63 | 68 | 65 | 58 | 51 | <50% | Below Average |
| Manufacturing | 42 | 40 | 37 | 32 | 35 | 42 | 49 | >50% | Above Average |
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Future Outlook
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Expansion Roadmap
- 2023: New equipment production base in Hukou (off-site)
- 2024: Expansion of existing equipment production at Hukou Plant
- 2025 Q4: Wafer Reclaim Capacity 50K/Month at Hukou Plant
- 2026 Q1: New Office in Shanghai
- 2026 Q4: Wafer Reclaim Capacity 40K/Month at Hukou Plant
- 2026 Q4: 9,000 M² (2,700坪) new building (Plant II) for EQPT MFG, and Warehouse next to Hukou Plant (Plant I)
- 2027 Q4: 22,000 M² (6,600坪) new building for EQPT MFG, Office and Warehouse in Tainan (southern Taiwan)
- 2027: Wafer Reclaim Capacity 50K/Month at Hukou Plant
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Capex / Investment
| Capex | NTD K | USD K |
|---|---|---|
| Wafer Reclaim 50K Expansion | 1,450,000 | 48,000 |
| Wafer Reclaim 40K Expansion | 300,000 | 10,000 |
| Shanghai Office | 180,000 | 6,000 |
| Hukou Factory II | 550,000 | 18,000 |
| Tainan Factorry | 850,000 | 31,000 |
| Sum | 3,305,000 | 113,000 |
| Capex | 2024 | 2025 |
| --- | --- | --- |
| NTD K | 546,000 | 1,250,000 |
| USD K | 18,000 | 41,000 |
| Other Invest. | 2024 | 2025 |
| --- | --- | --- |
| NTD K | 215,000 | 109,000 |
| USD K | 7,000 | 3,600 |
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Key Highlights
SCIENTECH
- Semiconductor CAGR to support our aggressive investment.
- Semiconductor Market Size
- 2024: 640B
- 2025: 750B
- 2026: 900B – 1Trillion
- TSMC's earning call:
- CAGR for Al Accelerator Chips raised from mid-40% to mid-to-high 50% range during 2024-2029
- Total revenue CAGR raised from 20% to 25% during 2024 to 2029
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SCIENTECH
Excellent Production Support
TSMC 2024 Outstanding Suppliers Award
https://pr.tsmc.com/english/news/3192
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SCIENTECH
Thank You!
https://www.scientech.com.tw
SCIENTECH Confidential